|

|
 |
|
|
 |
Robert
Hult Director of Product Technology, Bishop & Associates Inc. Robert Hult has been in the connector industry for more than 36
years. Hult began his career as a sales engineer for Amphenol.
He joined AMP in 1972 and served in several management positions
through 1996. In 1997, Hult joined Foxconn as group marketing
manager for Intel in Chandler, Arizona, U.S. Prior to joining
Bishop & Associates, Hult was the regional application
engineering manager for Tyco Electronics.
Hult graduated in 1968 from Bradley University with a bachelor
of science degree in electronics technology and a minor in
business. |
|
Connecting
to Solid State Lighting
A world under pressure to reduce its
energy consumption has spurred
innovation in efficient new lighting
technologies. The future is looking
brighter for the companies who took
the lead. |
|
The Connector Selection Process:
Making the Right Choice
April 2012 - Designers have come to fully
appreciate the critical role
connectors play in a system, and
give more thought than ever to
selecting the right connector for
the job. But the choice isn’t
obvious. Effective connector
selection requires a detailed
understanding of the performance,
environment, physical dimensions,
expected level of reliability, and
cost constraints of each
application.
|
|
What You
Missed At DesignCon 2012
This show doesn’t dazzle its
visitors with the latest sleek new
devices. Instead, it demonstrates
the dazzling technologies that will
power the devices of the future.
Here’s what caught our eye this
year.
DesignCon 2012 attendance was up 13%
over 2011. The 2013 conference is
January 28-31, the expo is January
29-30, in Santa Clara, California.
|
|
Active Optical Cables Connect
Active optical cables fill a niche
between copper and fiber, with
advantages borrowed from both
technologies.
This bridge technology is extending
reach and bandwidth, enabling copper
to hang on longer than expected.
|
|
2011 New
Product Review
A continuous stream of new
interfaces is coming from just about
every connector manufacturer. The
majority of these are evolutionary
extensions of existing interfaces.
Many of these new products reflect
demand for interfaces that offer
increased speed, smaller envelopes,
greater power capacity, and greater
design flexibility.
|
|
Counterfeit
Connectors
You may not be getting what you pay
for — although you’ll pay for it in
many other ways. Fake products have
infiltrated the interconnect market.
|
|
Rugged
Connectors Survive Harsh
Environments
As technology permeates new realms,
ruggedized connectors are adapting
to enable the proliferation of
sensitive devices into harsh
environments. Designers have a wide
array of versatile and specialized
options.
|
|
Small Form
Factor Defines Many Products
Small Form Factor is a catchy name
that conveys the intended attribute,
which is why it’s applied to a
variety of products. But this can
cause some confusion in the
industry, especially when users
expect I/O plug compatibility
between equipment.
|
|
Regulation Overload Impacts the
Connector Industry
The
RoHS ban on lead has influenced the
purchasing, sourcing, design, and
manufacturing of connectors, making
RoHS-certified parts the default
standard. But as REACH and other
standards get into the mix,
paperwork becomes an ever-greater
part of the design process. Is this
progress or interference?
more
|
|
Solid State Lighting the Way
5-3-11 -
Even
something as tried and true as the
century-old incandescent light bulb
can be improved upon. We are about
to see a revolution in the way we
light the world, thanks to
modern-day innovations.
more
|
|
High-Speed
Backplane and Mezzanine Connectors
Continue to Rock
4-5-11 -
Suppliers, including Molex, Samtec,
TE Connectivity (Tyco), 3M, ERNI,
FCI, and Amphenol TCS, dominate the
multi-gigabit backplane connector
market segment today. At last count,
these suppliers offer more than 25
families of high-speed backplane and
mezzanine connectors, with more in
the development pipeline.
more
|
|
|
Intel
Thunderbolt Ups the I/O Ante
3-15-11
-
Thunderbolt, the new Intel I/O
connection on steroids, offers some
unique characteristics that may
impact connectivity in a wide range
of electronic products.
more
|
|
DesignCon 2011: Innovation is Alive and Well
3-1-11 - Several connector manufacturers demonstrated
the results of research in new interface
technology that will likely set the stage
for improvements in system packaging and
performance—an encouraging sign that
innovation is alive and well in the
connector industry.
more
|
|
Designing
for EMC
2-1-11 - The increasingly complex environment for
electromagnetic compatibility (EMC) is
apparent in our homes, offices, and
automobiles. But insidious interference can
impair even the most carefully crafted
circuit. The objective is to design products
that neither radiate harmful EMI nor are
affected by external sources of EMI.
Designing for electromagnetic compatibility
(EMC) is the process by which this goal is
achieved.
more
|
|
Copper and
Fiber Vie for Position
1-4-11 - Copper conductors will
continue to reign supreme for many years,
but basic laws of physics are pointing to
limitations, and increasingly, fiber can
provide more cost-effective solutions. Are
you willing to bet on when this will occur?
more
|
|
2010
Connector Product Review
12-7-10 - Many of the new
interconnect products introduced in 2010 reflect demand for
attributes the end user has come to expect: improved power,
increased packaging density, increased speed, portability, and
ruggedness, to name a few. Yet in many cases, these new
interfaces are more evolutionary than revolutionary.
more
|
|
Power
Connectors: Moving Up the Curve
11-2-10 - In the past 10 years,
the market has seen the infusion of many new connectors designed
for power delivery applications, and even more innovations are
in the pipeline. Newer connector families feature modular
design, higher current ratings, and support of system cooling
strategies.
more
|
|
Finding
the Right Niche
10-5-10 -
Striving to be the biggest in the industry may not be the best
strategy for everyone. Niche connector manufacturers fill
critical gaps in the electronics industry, as many lower-volume
applications require unique interconnect solutions that may not
be supported by large industry leaders.
more
|
|
Shrinking
Connectors Create Challenges and Opportunities
9-7-10 - Connector
manufacturers are researching entirely new interconnect devices
and materials meeting the challenge of providing better
stability and durability in a smaller package.
more |
|
Rough and
Rugged:
New High-Speed Backplane Connectors Shake Up the Market
8-3-10 -
Can a backplane connector that is accustomed to a clean and tidy
environment adapt to the rugged, weather-beaten environment of
the military and industrial world? Several manufacturers have
new—and proven—products that fill the need.
more |
|
Let There Be Solid State Light
5-4-10 -
The replacement of candles and oil lamps with electric light
bulbs forever changed our living and working habits. Now, a
series of emerging technologies combined with increasing
environmental concerns have set the stage for the development of
a better source of light. more |
|
Turn Down the Noise
Filtered Connectors Provide Solutions
to Reduce EMI/ESD Distortion
4-6-10 - High-speed
signal distortion created by electromagnetic interference can
delay or kill a new product in development. Anyone who
has drawn a quarter-inch arc between a wall switch and their
finger has experienced the power of an electrostatic discharge.
Protecting a system from EMI and ESD has become a critical
requirement in electronic product design.
more |
|
PCB Attachment Options Continue to Grow
2-2-10 - It took
nearly 10 years for PCB assemblers to accept the reliability of
compliant pin technology. A variety of factors, including
contact density, size of the connector, intended environment,
pin count, availability of process equipment, and cost,
influence the choice of future PCB attachment methods. Change is
slow.
more |
|
Protecting Intellectual Property in the Connector Industry
1-5-10 -
Cultivating secondary sources for connectors is important to
securing new designs, but how much do manufacturers give up in
intellectual property rights while doing this? Is global
manufacturing creating a hotbed of counterfeit connector
products?
more |
|
2009 New Product
Review
12-8-09 -
In spite of a deep recession, 2009 proved to be a particularly
prolific year for the development and introduction of new
interconnect systems. Will the innovations continue in 2010, or
will we stop and savor the strides that have been made in 2009?
Here’s your 2009 product review.
more |
|
Are Standards
Driving New Interconnect Technology?
11-3-09 -
While collaboration can be beneficial in many decision-making
processes, conflicting forces may hinder the development of a
new interconnect standard. Who gets to be a member,
what’s the
benefit to a company for participating, and what pitfalls could
prevent a company from wanting to be involved?
more |
|
USB 3.0: Pushing I/O
Performance
10-6-09 -
USB is one connector even non-industry people recognize by
name—that’s how “universal” it is. The USB connector is defined
by industry standards that are flexible enough to continually
adapt to performance increases. The upgrades, from 1.0 to 2.0
and now 3.0, must have backward compatibility, while also
facilitating the newest products and technology.
more |
|
Second Source—First Priority
8-4-09 - In
years past, connectors manufactured by different companies could
mate and perform to a certain specification—but if a conflict
arose, the two suppliers might blame the other for the failure,
leaving the OEM to solve the problem. Now, connector
manufacturers are working together to provide solid,
problem-free second-sourcing for the OEM.
more |
Tough Time to be an Independent Innovator
6-16-09 - The connector industry
depends on the continuous development of innovative products,
but independent inventors find it increasingly difficult to
successfully bring their bright ideas to the marketplace.
more |
|
MicroTCA: Less is
Sometimes Better
6-2-09 - Relentless
market pressure to offer greater functionality in smaller
envelopes and at lower cost is the name of the game in today’s
electronics industry. Designers in every market segment, from
consumer to military, are looking for increased value in these
tough economic times. Systems that conform to a packaging
standard can minimize the need for scarce engineering resources.
MicroTCA is the answer.
more
|
|
Embedded Computer Standards
Proliferating
5-19-09 -
The embedded computer
automates a wide variety of devices, from the mundane to the
exotic. Rather than design a custom device from scratch to
satisfy a new application, an off-the-shelf embedded computer in
a variety of form factors can be quickly and economically
adapted to many tasks.
more |
|
Saving the Environment—One Mandate at a Time
4-7-09 -
Just as we’re becoming comfortable with RoHS, other mandates are
on the horizon, attempting—with mixed results—to clean up the
electronics industry’s often toxic impact on the planet. Is your
company in the running to become one of the leading “green”
manufacturers?
more |
|
Long Live the Copper
Connector
3-3-09 - It
turns out the prediction of copper’s imminent demise were
premature; designers are expanding the limits of the material
into the future.
more |
|
DesignCon 2009 in Review
2-17-09 -
Once again, DesignCon 2009 was rich in new products and
innovation. The electronic connector industry was well
represented; 14 connector and several more high-performance
cable assembly manufacturers demonstrated their most advanced
and inspiring products.
more |
|
Cool Connections are Hot in High-Power Designs
1-7-09 - The failure
of a power connector can be a dramatic event and may have
serious safety implications. Today’s design challenge is to
create connectors that can withstand today’s high-heat
applications.
more |
|
2008 in Review: A Year of
Connector Innovation
12-2-08 - New product is the
lifeblood of the connector industry, and 2008 has been a prime
example of how connector manufacturers are scrambling to ensure
that connectors do not become a technology bottleneck for the
design of next-generation equipment.
more |
|
|
|
|
Bishop
& Associates, Inc. © 2012 |
|