CPU/Processor Sockets



CPU/Processor Sockets News


November 2012 new product news.

New Product News Roundup: November 2017

In the market for a new solution? We’ve rounded up, summarized, and linked the latest connectors, cables, assemblies, tools, accessories, and development kits to hit the market. New Product News Connectors, Inserts, Pins, Probes, Sockets, and Modules Bulgin’s new M-Series circular connectors provide reliable data, signal, and power transmission for harsh-environment industrial automation systems, including: Read More >>

New connector products roundup October 2017

New Product News Roundup

In the market for a new solution? We’ve rounded up, summarized, and linked the latest connectors, cables, assemblies, tools, accessories, and development kits to hit the market. New Product News Connectors, Inserts, Pins, Probes, Sockets, and Modules ITT Cannon’s new CTC Series high-performance, cost-effective cable-to-cable interconnects deliver ruggedized, environmentally sealed, easy-install, low-maintenance solutions for harsh-environment Read More >>

Stamped Spring Pin Socket Meets Requirements for BGA1164 Testing

Ironwood Electronics introduced a new stamped spring pin socket to address high-performance requirements for testing BGA1164 – CBT-BGA-7042. The contactor is a stamped spring pin with 31g actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH; insertion loss <1dB at 15.7 GHz; and the capacitance Read More >>

New Product

New Product News Roundup

In the market for a new solution? We’ve rounded up, summarized, and linked the latest connectors, cables, assemblies, tools, and accessories to hit the market.  Connectors and Cable Assemblies Hirose’s new DF40GL Series low-profile FPC connectors operate at USB 3.1 Gen. 2 speeds of up to 10Gb/s and are an excellent choice for daughter boards Read More >>

Featured news

Interconnect News for January 29, 2016

In this issue’s interconnect news, we meet DesignCon’s Engineer of the Year and are introduced to a number of new products from global suppliers.   Eric Bogatin Named DesignCon’s Engineer of the Year DesignCon 2016, held January 19 – 21 in Santa Clara, Calif., recognized Dr. Eric Bogatin of the Teledyne LeCroy Signal Integrity Academy Read More >>

DesignCon ChipHead

Gettin’ Down on the Show Floor: DesignCon 2016

The DesignCon show floor opens today, so we spoke with some of the exhibitors to find out what they expect will be the hot technologies in this year’s Expo Hall.   Did you enjoy your workshops and survive your bootcamps? Well, slip on your walking shoes because the DesignCon show floor opens today, and there is so much Read More >>

Medical

Changing Health Tech with MEMS I/O Connectors

MEMS I/O connectors will dramatically change medical technology in 2016 as more patients require treatment both on-site and remotely.   The face of healthcare, as we know it, is changing. Rising costs combined with a substantial increase in healthcare monitoring are forcing a paradigm shift like we have never seen before. While patient care is Read More >>

Ironwood Electronics BGA Socket for 0.8mm-Pitch 177-Pin Device

Ironwood Electronics BGA Socket for 0.8mm-Pitch 177-Pin Device

The Ironwood Electronics socket for 177-ball BGA packages can be used on any PCB without soldering or mounting hardware or screws. Ironwood Electronics introduced a new high-performance BGA socket for 0.8mm-pitch BGA 177-pin devices. The SG-BGA-6434 socket is designed for a 13x13mm package size and operates at bandwidths up to 27GHz with less than 1dB of insertion loss. Read More >>