Roundup – Test and Measurement Products

Roundup – Test and Measurement Products

The test and measurement sector covers a wide variety of devices, ranging from large automated test equipment (ATE) that evaluates hundreds of devices simultaneously to small handheld testers that technicians use in the field. Regardless of the end market, all products must be tested prior to shipment to the end customer. There are no specific test and measurement connectors; instead, a variety of electronic connector types are used for this purpose. In this issue’s roundup, we take a look at a broad range of products from key suppliers, including Advanced Interconnections, Emerson Network Power, Fischer Connectors, Mill-Max, Phoenix Contact, and QA Technology.

Emerson Network Power Connectivity Solutions’ new family of SMA Self-Fixture End Launch connectors can help improve manufacturing costs and speed up testing cycles. The proprietary design accurately aligns and holds the center contact of a coaxial connector to the circuit board plane until the soldering operation is complete, without the need for special fixtures. The Self Fixture connectors will overcome the gaps and RF path discontinuities associated with inconsistent soldering processes. They are manufactured to produce optimal return loss values for frequencies between 0-26.5 GHz.

Phoenix Contact’s line of M12 Mini-B USB products is suitable for harsh industrial applications. The receptacles and plug cable assemblies ensure a secure and reliable connection between industrial devices and PC peripherals. The IP67 housing protects against heavy impact and corrosive environments, making them ideal for a variety of small OEM and industrial devices, including portable diagnostic/test equipment, vision systems, and audio and video equipment. The receptacle and cables meet USB 2.0 with a transfer rate of 480 Mbit/s. Because they use Phoenix Contact’s SPEEDCON connection system, the connectors require just a quarter turn to ensure positive locking and high cable retention. The connection is up to 90% faster than standard connector threads.

Mill-Max has developed a series of ultra low- and low-profile spring pins for applications where above-board height is limited. As packaging requirements for electronics continue to shrink in size, traditional interconnects don’t always fit the bill. For board-to-board or device-to-board connections, low-profile spring pins are a practical solution. The series has five options, all providing unique above-PCB height profiles and thru-hole or SMT options. The 0921-X and 0926-X series are thru-hole mount and have either .0195” (0.5mm) or .0275” (0.7mm) mid-stroke travel. The 0965 series is for surface-mount applications and has .012” (0.3mm) mid-stroke travel. Gold-plated components and springs ensure the highest conductivity, corrosion resistance, and durability. All three pins are rated for one million cycles and have a current rating of 2A continuous use (3A maximum).

Fischer Connectors broke new ground in miniaturization with its MiniMax ultra high-density push-pull interconnect solution. The MiniMax is an all-in-one, 20-signal (0.5A) and four-power (5A) connector with a patent-pending for its 24 mixed contacts, the MiniMax has a durability of over 500 mating cycles. It is designed for the harshest environments, passing extreme temperature tests and 1,000 hours of salt water spray. The MiniMax is cost-effective because of its small size and 24-contact configuration, which means fewer connectors are used. On top of that, there are fewer cables needed, so the entire device becomes more cost effective and stays reliable. The MiniMax is available in three latching systems — push-pull, breakaway, and screw-lock.

Advanced Interconnections’ Mod5 Series Flip-Top BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface-mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. The series provides a compact, surface-mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision-machined spring probes with industry proven solder balls ensure high reliability performance. The Mod5 Series accommodates BGA packages up to 12mm sq., with larger sizes available upon request, and offers high bandwidth with very low insertion loss. The compact size (20 x 27mm) enables use on design boards with small keep-out zone, and the Flip-Top BGA Socket’s easy actuation with simple and turn-screw heat sink enables quick insertion and extraction.

QA Technology’s ICS40 integraMate contact is intended for use in high-performance connectors and micro connectors using .050” and 1.0mm grids for mil/aero, medical, and industrial applications. The smallest size in the ICS family, the ICS40 features the same flexibility in customized terminations and mounting features as in their larger ICS sizes. The core technology of integratMate is a novel hyperboloid wire cage contact design that offers a low mating force, high cycle life, and superior resistance to shock and vibration. integraMate contacts are inherently smaller in diameter than traditional hyperboloid contacts, providing better electrical ratings and higher density.