TE

Electronic Connectors Shrink to Fit

Incredible advances in processor and memory technology have mandated shrinking all other electronic components from chip capacitors to connectors and the circuitry that joins them. The connector industry has responded to these challenges by introducing new classes of high-density microminiature connectors.   A basic pillar of the electronics industry has been its ability to stuff more functionality in Read More >>

Making Connections in LED Lighting

Considering connectors at the start of the design process results in an optimized LED lighting design.   LED lighting is very different from traditional lighting systems. Modern LED assemblies offer vastly improved power efficiency and longevity, and they can be extremely compact. However, their electronics are much more complex to design than those of incandescent light Read More >>

Featured news

Industry Leaders Collaborate on QSFP Module Speeds to 400Gb/s

A consortium is collaborating to define double-density QSFP modules through a multi-source agreement.   The QSFP-DD Multi Source Agreement (MSA) Group recently announced plans to develop high-speed, double-density quad small-form-factor pluggable (QSFP-DD) interfaces. The primary objective of the MSA group is to define the specifications and promote industry adoption of the QSFP-DD. “Establishment of this Read More >>

Connected Cars

The Connected Car: A Revolution in Mobility

Since the modern automobile was invented, its basic functionality and shape has remained essentially the same. However, the environment in which vehicles operate and the data to which they connect are changing dramatically, and components will play a significant role in the automotive revolution.   The connected car has the power to shake up the Read More >>

Bob Zubrickie, TE Connectivity

Tech at Work: 3D Printing

We spoke with Bob Zubrickie of TE Connectivity about the possibilities that lay ahead for 3D printing and additive manufacturing, as well as the role connector technology will play in future developments.     Q: What is additive manufacturing, and where is it in the development stage in general industry? How quickly will it come Read More >>

DesignCon ChipHead

DesignCon 2016 Technology Wrap-Up

DesignCon 2016 featured 33 interconnect manufacturers, all concentrating on ever-higher speeds and improved signal integrity.   DesignCon 2016 opened in the shadow of preparations for Super Bowl 50 at Levi’s Stadium, directly across the street from the Santa Clara Convention Center. With more than 160 exhibitors and 4,800 pre-registered attendees, the exposition and conference continues Read More >>

Featured news

TE Named to Thomson Reuters Top 100 Global Innovators List

TE was named a Thomson Reuters Top 100 Global Innovator for the fifth consecutive year. †   TE Connectivity was named a Thomson Reuters 2015 Top 100 Global Innovator for the fifth consecutive year in recognition of its achievements as one of the world leaders in innovation. The program, an initiative of the IP & Science Read More >>

TE AMPSEAL 16 Hybrid Lever Connector System

TE AMPSEAL 16 Hybrid Lever Connector System

The TE AMPSEAL 16 hybrid lever connector system is designed for the harsh conditions in agricultural, construction, marine, and off-highway industries. TE Connectivity Industrial & Commercial Transportation released the AMPSEAL 16 hybrid lever connector system. The heavy-duty, environmentally sealed AMPSEAL 16 hybrid lever connectors are designed to stand up to the harsh conditions of the agricultural, construction, Read More >>

TE's Raychem S1260 Hot-Melt Tape Adhesive

TE’s Raychem S1260 Hot-Melt Tape Adhesive

TE’s Raychem S1260 Hot-Melt tape adhesive is designed for ground defense and aerospace applications and enables permanent field repairs for PTFE wire and cable. TE Connectivity announces its new Raychem S1260 Hot-Melt tape adhesive for high-temperature wire and cable repairs. The S1260 tape uses an environmentally resistant modified fluoropolymer for sealing high-temperature heat-shrink components to Read More >>

TE block micro SD connector

TE Low-Profile Block Connectors

The TE low-profile block connectors offer a flexible, cost-effective solution for wearables, smartphones, and mobile devices. TE Connectivity introduced three low-profile block connectors, including the 0.3H block SIM card connector, 0.3H block side-entry SIM connector, and 0.3H block micro SD connector — all new additions to its SIM card connector portfolio for smartphones, wearables, and Read More >>

TE zQSFP+ Portfolio with 25Gb/s Data Rate

TE zQSFP+ Portfolio with 25Gb/s Data Rate

The TE zQSFP+ portfolio allows for a simple upgrade path from 10Gb/s to 25Gb/s, offering 2.5 times more throughput than traditional QSFP solutions. TE Connectivity expanded its zQSFP+ (z-Quad Small Form-factor Pluggable Plus) product portfolio, offering a data transfer rate of 25Gb/s to meet high-speed customer design requirements. TE Connectivity’s zQSFP+ interconnects offer 2.5 times more throughput Read More >>

TE DWFR Tubing

TE Dual-Wall Heat-Shrink Tubing

The new TE dual-wall heat-shrink tubing products meet the UL VW-1 flammability requirement. TE Connectivity introduces the DWFR (dual-wall, fire-retardant) product line – its first dual-wall heat-shrink tubing products to be rated for the UL VW-1 flammability test specified by the UL 224 standard. The DWFR tubing products’ highly flame-retardant polyolefin jacket and a thermoplastic Read More >>