APEC 2008: Applying Connector Power
By Bob Hult, Bishop & Associates Inc.

The 23rd annual Applied Power Electronics conference and exposition was held February 24-28 in Austin, Texas, U.S. The show expanded this year into the Austin Convention Center, allowing more area for both exhibitors, as well as comfortable space for the many technical sessions. APEC is the premier industry event that tightly focuses on power supply manufacturers and related components. This year’s show featured over 120 exhibitors, including six major connector suppliers that offer power interfaces. Engineers and business managers from all aspects of the power industry attend this show to participate in more than 200 technical sessions, 113 dialogue sessions, 21 exhibitor seminars, 18 professional education seminars, 23 special presentation sessions, and three rap sessions. The extensive array of seminars addresses such diverse applications as server farms, portable products, and hybrid electric vehicles. Evolving industry standards that influence the industry are also included in the roster of topics.

Recognizing the critical role that connectors play in supporting the increasing demand placed on power distribution systems, connector manufacturers featured an array of new connectors. The key aspects of higher power ratings in smaller profile connectors, together with a modular design, were apparent in many of the interfaces on display. 

Anderson Power Products demonstrated connectors that range from 10 to 700 amps in a variety of wire-to-wire, wire-to-board, blind mate rack and panel, and bus bar configurations. Many of these connectors feature a combination of keying options, low mating forces, wire strain relief, and designs that support hot mating.

FCI Electronics has recently published its Power Solutions catalog, which includes data on a variety of power connector systems. One of the newest products included is the HCI board-to-board hybrid connector, which is being promoted as the next-generation PwrBlade® interface, featuring a modular design, increased current rating, and improved airflow characteristics, which result in greater power density. FCI also announced the availability of PwrBlade I/O cable assemblies in panel mount and squeeze-to-release configurations.

The Methode Electronics booth included an extensive array of flexible power cable assembly solutions using a variety of unique termination systems manufactured by Cableco Technologies, which Methode acquired three years ago. Both round and flat power cable assembly configurations are available.

Molex has greatly expanded its line of power connectors and assembles them under the ExTreme Power Series brand. The Molex booth featured several new interfaces, including MicroPower™ at 16 amps/blade; LPHPower™ at 30 amps/blade; Ten- 50Power™, a 10mm tall 50 amps/blade connector; ZPower™, a power connector for mezzanine applications rated at 30 and 50 amps per pin; and PowerMass™, a modular connector that includes a 150 amp blade.

Positronic continues to expand its extensive line of screw machined power connector systems. The company now offers connectors that feature greater density power ratings with increased design flexibility. Recently introduced products feature smaller profiles, and have addressed power interfaces defined by a variety of industry standards, including Compact PCI®, Advanced TCA®, and MicroTCA™.

Tyco Electronics exhibited a wide selection of power connectors, including a stacking version of its popular MINIPAK connector, as well as the MINIPAK HDL, a new connector that offers high-density, and low-profile in a blind mate interface.

The Multi-Beam connector family has been upgraded with the introduction of the Multi-Beam XLE version, which features a new three-beam contact fabricated from thicker/high-conductivity material. As a result of these changes, the power rating of this connector has been increased 20 percent. Tyco recently published a new 234-page catalog that includes all of its power-related products.

Exhibits and seminars at this year’s APEC show have demonstrated the need for connectors with greater power density. This market opportunity has stimulated connector manufacturers to introduce new higher performance and flexible power interfaces to meet the need.

Robert Hult
Director of Product Technology, Bishop & Associates, Inc.
Robert Hult has been in the connector industry for over 36 years. Hult began his career as a sales engineer for Amphenol. He joined AMP in 1972 and served in several management positions through 1996. In 1997, Hult joined Foxconn as group marketing manager for Intel, Chandler, Arizona, U.S.A. Prior to joining Bishop & Associates, Hult was the regional application engineering manager for Tyco Electronics.

Hult graduated in 1968 from Bradley University with a Bachelor of Science degree in electronics technology and a minor in business.