2011 New Product Review
By Bob Hult, Bishop & Associates Inc.

A truly groundbreaking new product can influence the direction of an entire industry. One example is the iPhone. This device inspired thousands of applications, which in turn have transformed the iPhone from a communication device into a multifunction entertainment, location finding, personal assistant, and data delivery tool. It takes on new roles every day. It could become even more essential as the medical realm taps into its potential, too. One app currently in development will enable users to measure their heart rate, blood pressure, and oxygen levels by simply placing a finger over the camera lens. We are just beginning to see the full potential of this tool.  

The early 2010 introduction of the Apple iPad opened up a flood of new personal communication and information devices that changed the way the world looks at computing. iPads wirelessly connected to the Internet are even threatening the future of laptop computers. This transition to small, portable, but powerful multifunctional devices has been called “iPad-ization,” and is quickly becoming the expectation for electronic devices in applications way beyond the original consumer market, including military, medical, and industrial applications.

In the midst of this rapid change, many of the basic performance and packaging requirements continue on the same track that began years ago. These include: 

• Increased packaging density

• Improved power efficiency

• Increased data transfer rates

• More functionality

• Portability

• Ruggedness

• User-friendly interface

• Lower cost per function

A continuous stream of new interfaces is coming from just about every connector manufacturer. The majority of these are evolutionary extensions of existing interfaces. Many of these new products reflect demand for interfaces that offer increased speed, smaller envelopes, greater power capacity, and greater design flexibility.


Samtec, for instance, has been aggressively branching out into new markets and applications as they feature their high-speed, rugged, power, and micro interconnects. Their SEARAY product line continues to expand with many new configurations. New product lines introduced this year include high-speed Card Edge, ZIF Flex Data Link, AccliMate, and RF cable assemblies.




Ethernet at 40 Gb/s and 100 Gb/s, as well as Infiniband, seems to be prodding the industry to expand the bandwidth of backplane connectors. Airmax VSe from FCI Electronics is now rated to 20 Gb/s, while Amphenol XCede and Molex Impact connectors have been demonstrated at 28 Gb/s. The Strada Whisper connector from TE Connectivity claims performance to 40 Gb/s.



Mezzanine connectors continue to gain attention in system packaging and are evolving to higher signal density, pin count, and speeds. FCI Electronics announced their MezzoStak connector based on 0.5mm contact pitch. The hermaphroditic contacts use the same part number for each half of the mating pair. Stack heights of 4 to 7mm and in 20 to 70 surface mount contacts are available.



Amphenol TCS introduced their InfinX mezzanine connector that is rated to 25 Gb/s and uses unique 3D shield technology for reduced crosstalk and resonance. This connector offers up to 61 differential pairs per inch in stacking heights ranging from 10mm to 40mm.

Hirose introduced their IT-5 high-speed mezzanine connector that provides 73 differential pairs at up to 25 Gb/s.

The STRADA Mesa connector from TE Connectivity and the 14G CN099 mezzanine connector from Yamaichi both feature performance into the mid-teen Gb/s range. The Strada Mesa connector features the unique capability of mixing power and signal contacts in a common press-fit housing.



System demand for power continues to grow and new connectors with higher current ratings are addressing the need. The EXTreme Ten60™ power connector from Molex can deliver up to 260 amps per linear inch of PCB edge while maintaining a low profile that minimizes obstruction of cooling airflows.




The High Power Card Edge connector (HPCE) from FCI Electronics handles up to 9 amps per power contact, and allows a mix of power and signal contacts. Vertical, right angle, or straddle mount configurations are available. This design utilizes vented contacts to maintain lower temperatures at the contact interface.

Connectors that have been adapted to survive in harsh environments are being introduced at a rapid pace. As delicate electronic equipment migrates from protected rooms and enclosures to outdoor locations, demand grows for connectors that can withstand dust, moisture, shock, vibration, extreme low and high temperatures, and abusive handling. Consumer-grade interfaces such as USB and RJ45 are now offered in protective metal or tough plastic shells.  




TE Connectivity recently introduced a positive latching industrial USB connector that carries an IP20 rating.






Traditional metal shells on military circular connectors are evolving to composite plastic for weight reduction. New miniature configurations from Spectrum Advanced Specialty Products, ODU, ITT Interconnect Solutions, and API Technologies consume less space while meeting the mechanical and performance requirements of the military specification. In many cases, this transition is being driven by the Commercial-Off-The-Shelf (COTS) initiative where cost-reduction and shorter design cycles have become key objectives.

New connectors aimed at specific applications, such as medical electronics, feature easy push-pull mating, ergonomic designs, and materials that can withstand repeated sterilizations.  

Rugged high-speed connectors are also appearing in backplane and circular configurations. The Viper backplane connector from Amphenol and Fortis Zd connector from TE Connectivity are designed to withstand extreme shock and vibration while operating at 10+ Gb/s, and are being driven by emerging VME standards. Hypertronics recently introduced a ruggedized backplane connector focused on VME64X applications.


Meritec is promoting the new Hercules family of 10 Gb/s circular interconnects, which utilizes a unique hermaphroditic contact system protected within a tough Mil-C 38999 shell.

Fiber optic cable assemblies and connectors continue to make inroads as the cost of optical components comes down and the difficulty in transmitting multi-gigabit signals over copper increase.



Active optical cables are finding new applications in high-speed Ethernet and InfiniBand links. TE Connectivity introduced their second generation of Paralight cable assemblies that feature quad duplex 10 Gb/s channels while consuming less power. Additional suppliers include Samtec, Siemon, Alpen IO, and Luxtera, recently acquired by Molex.




Fiber optic connectors are continuing to penetrate applications traditionally satisfied by copper as new optical connector options enter the market. Molex recently demonstrated a single chip 100 Gb/s interconnect using CMOS photonic technology developed in collaboration with Luxtera. Applications in cloud computing, data center, and high performance computing are expected to require the performance and space-saving advantages of 100 Gb optical links.


During the year, the optical LightPeak concept from Intel evolved into the 10 Gb copper Thunderbolt I/O that has appeared on several high-end Apple laptop computers and a few peripherals. It is unclear at this point if these relatively expensive active copper assemblies will remain associated with Apple products or become mainstream competition for USB 3.0.

Small Form Factor Pluggable interfaces, including SFP+ and QSFP+, are becoming the de facto standard interfaces in switches, routers, storage, and high performance computing.


The CXP pluggable interconnect system provides 12 duplex channels operating at 10 Gb/s each for a total bandwidth of 120 Gb/s and complies with InfiniBand CXP 12x QDR and IEEE 100 Gb/s Ethernet.

Connectors and cable assemblies are available from Molex, TE Connectivity, and Volex.


Demand for better ways to package electronic systems that offer cost-effective alternatives to traditional methods continues to stimulate new interconnect products and technologies.




Amphenol RF’s HD-BNC offers true 75 ohm impedance with a footprint that is 51% smaller than a traditional BNC, while Radiall introduced a new extended strain relief that simplifies finger access to a dense matrix of BNC connectors. Both of these features are important to the HDTV broadcast industry.




The introduction of PlanarMag technology from TE Connectivity promises to change the way magnetic components are integrated into RJ45 Ethernet connectors. Rather than continuing to rely on traditional hand-wound magnetic cores, TE developed an entirely new process based on standard PCB manufacturing and semiconductor test processes. The resulting modules offer scalable manufacturing, more consistent electrical performance, and long-term reliability. Individual modules are available, as well as integrated into RJ45 receptacles.

Interest in orthogonal midplane connectors also continues to grow, as they offer reduced signal path lengths between line cards. Designers can choose between the Amphenol TCS XCede, FCI AirMax VS, Molex Impact, and TE Connectivity Z-Pack Tinman orthogonal connectors. The next logical step will be elimination of the backplane or midplane, which will further reduce distortion as well as simplify system thermal management strategy.




Molex introduced their Impact Direct connector at DesignCon 2011. This connector is able to provide high-speed connection directly between orthogonally-oriented daughtercards.





Bishop & Associates Inc. Comments: 

1. The connector industry is alive and well as it continues to respond to evolving mechanical and electrical requirements.

2. New connectors may incorporate features that make them appropriate for very specific market segments, but may also work well in general applications.

3. Manufacturers may offer several performance levels within a particular product family, which allows designers to fine-tune their interface selection without resorting to a custom solution.

4. Non-conventional system packaging solutions such as orthogonal are gaining popularity in select applications.

5. Copper-based interconnects will continue to dominate the industry for many years, but fiber optic alternatives, including active optical cables, are capturing new applications with both technical and economic advantages.

6. Many newer connectors replace metal with plastic shells for weight and cost reduction. They can also be customized with an overmolded strain relief that is more ergonomically attractive.

7. The migration of electronic product manufacturing to China continued in 2011 in spite of the recent escalation of wages. One report indicated that average wages for Chinese workers will double by 2015. The incentive for U.S.-based companies to move into that area is now focused more on being close to growth markets rather than low-cost manufacturing.

Robert Hult Director of Product Technology, Bishop & Associates Inc. Robert Hult has been in the connector industry for more than 39 years. Hult began his career as a sales engineer for Amphenol in Chicago. He joined AMP Inc. in 1972 and served in several management positions through 1996. In 1997, Hult joined Foxconn as group marketing manager for Intel in Chandler, Arizona, U.S. Prior to joining Bishop & Associates, Hult was the regional application engineering manager for Tyco Electronics (now TE Connectivity). Hult graduated in 1968 from Bradley University with a bachelor of science degree in electronics technology and a minor in business.