New Connector Roadmap Helps Industry Navigate the Road Ahead

By John MacWilliams, Bishop & Associates Inc.

Would you like to know what lies ahead for the connector industry? The new 2009 Electronics Industry Technology Roadmap is the essential guide to the road into the future. This report details major electronic component and systems technology trends from 2009-2019. The 1,400-page report includes a 43-page chapter on electronic connectors, detailing roadmap findings, key trends and roadblocks, trends in regional markets, design, manufacturing, environmental and product technologies. Product areas include:

  •  IC Sockets

  • Memory Sockets and Receptacles

  • PCB Connectors

  • Wire-to-Board

  • Miniature Board Stacking

  • 2mm Backplane

  • High-Performance Backplane

  • Fiber Optics

  • Cables

  • Test and Burn-In Sockets

Later this year, look for a Bishop Report analyzing the connector roadmap from a market perspective and review a forecast of the impact this current downturn will have on the industry for the next 10 years.

A Technology Document

As Casey Stengel would say, technology roadmaps tend to focus on technological trends. This is accomplished very well in the iNEMI roadmap. One excellent example of this is the very detailed semiconductor roadmap. There is less discussion about markets and the economy in these roadmaps, although some, like the connector and mass data storage roadmaps, do include market forecast data. Some roadmaps also discuss how global market forces and activities—such as outsourcing—impact manufacturing infrastructures around the world.


Enter the 2009 Recession
The 2009 Roadmap is the culmination of almost two years of effort by over 1,000 people from throughout the industry. It was started and developed before the recession.

Now, the current and evolving global downturn is going to impact most, if not all, of the electronic industry segments detailed in the roadmap. Industry market forecasts are being redone as we speak. And, due to the unprecedented fiscal nature of this recession, no one knows for certain how deep or long it will be. We are hoping for a modest recovery by 4Q09, with the whole year being down by double-digit percentages—just shy of 15 percent in the current connector industry forecast. Many are predicting it will take several years for markets to fully recover.


Impact on Roadmap?

Roadmaps, by their nature, are long-term documents, and transcend short-term hiccups (although this “hiccup” may be more like the whooping cough). This roadmap’s purpose is to serve as a planning tool for industry stakeholders, and to identify technology opportunities and roadblocks that lie ahead.

The 2009 recession is shaping up to be severe, and as such will impact R&D, product development, and capital investment funding in many areas of the electronics industry and its customer base. But the basic findings of the roadmap are still operative, if not delayed by 1-2 years. It will be up to each user to determine how the current and near-term market environment will impact their specific areas of interest vis-vis the roadmap.

Here are some areas that will affect the connector industry as a result of this downturn: 

  • Market Impact. Clearly, many markets see major suffering ahead. Connector’s largest market, automotive, is one of them. All but mil-aero and medical will be hit. Full recovery may take two to three years or more, with some segments, such as automotive, forever changed.

  • Customer Impact. This downturn will continue previous trends toward industry consolidation at the customer level. There will also be new opportunities that will emerge in areas such as infrastructure, solar energy, and electric vehicles.

  • Supply Chain Issues. Global suppliers of important materials and component parts are coming under stress. This could be particularly acute in Asia, where the infrastructure may be more fragile.

  • Pricing Pressures. This is bound to increase in a down market. The good news is that material costs should also decline.

  • Environmental Constraints. RoHS is nearly complete, but there are a number of new initiatives, including REACH, that could experience delays as suppliers resist or are unable to meet deadlines.

  • Program Delays. These will occur as customers pull in their horns. But, some players will use this period to accelerate programs, to gain market share in the recovery. Or, there are programs, such as hybrid vehicle/electric batteries, that will not be curtailed due to market or regulatory mandates.

  • Technology Impact. In the 2001 recession, telecommunications was hard hit. Fiber optics was affected, with some development programs cancelled. In this recession, markets that depend on discretionary spending (automotive, consumer electronics, mobile phone programs, and personal computers, to name a few) will experience delays in new programs, in addition to major declines in sales.

  • Technology Pull-Through. There are areas of development in electronics that have such major “pop” that they will navigate this downturn with less impact. Examples could include smart phone technology, wireless infrastructure, solid-state flash memory and other semiconductor initiatives. LCD displays, HDMI and display port, IP television, and certain OEMs could be at the top of their game.

What lies ahead? Consult the iNEMI roadmap for guidance. The roadmap is now available for ordering on CD at the iNEMI.org website. The cost is $250 in North America, $325 for the rest of world. If your company is an iNEMI member, the cost is $100 per copy.


John MacWilliams
Senior Consultant and Analyst, Bishop & Associates Inc.

John MacWiIliams has been in the electronics industry for over 40 years. His main areas of experience have included: U.S. competitiveness programs, market research studies, authored articles, field sales and management, product marketing management, strategic marketing, new product planning, venture development, advertising and media relations, direct sales, manufacturers representative, distribution sales management, and international marketing. MacWilliams has worked with AMP, Diceon Electronics, TRW, and IRC in marketing management positions. Prior to joining Bishop & Associates, MacWilliams served as the group director of marketing and new product planning for AMP.

MacWilliams is a graduate of Lehigh University, where he studied business management and engineering.

 

 


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