The Shape of Things to Come: Rectangular Connectors Find Their Place in the Future
By Lynda Nolen, Bishop & Associates Inc.

Ranked third, behind printed circuit board and application specific connectors, rectangular I/O connectors accounted for approximately $6,618 million, or 16.6 percent, of the total world connector sales in 2006. This represented an increase of approximately 14.9 percent from 2005.

I/O Rectangular by Region

Comprised of one of the largest groupings of products, I/O rectangular connectors include:

  • D-subminiatures

  • Ribbon connectors

  • SCSI, VHDCI, and 1Gbps+ high-speed connectors

  • Rack and panel connectors

  • Blade and tab contact connectors for auto and off-road vehicles

  • Power connectors

  • A wide variety of connectors used with computers, personal peripherals, and telephone and data communication equipment.

The wide variety of I/O rectangular connectors available, in addition to the many options within a family, allow engineers multiple options when specifying a particular connector type.

Customers and Markets Served
Unlike other classifications of interconnects, I/O rectangular’s broad offering of products provides the unique opportunity to supply products to a never-ending customer base. Rectangular I/O interconnect products are supplied to OEMs, CMs, and cable and harness assembly facilities, for both high reliability and commercial applications. Rectangular I/O interconnects are found in just about every conceivable market and represent hundreds of manufacturers.

The Ever-Changing I/O Rectangular Connector
Similar to all other categories of interconnect products, I/O rectangular connectors have had to contend with many challenges over the past
decade. As end products become smaller and more sophisticated, the requirements demanded from interconnects have become greater. Engineers must now look for a product to meet a variety of requirements. I/O rectangular interconnects must:

  • Be robust enough to handle harsh environments and multiple mating cycles

  • Consume less space and handle more power

  • Provide high-speed performance

  • Offer cost-effective assembly and placement

  • Be installer- and consumer-friendly

  • Be multi-sourced and capable of generic interface

  • Be competitively priced and readily available

And, in addition to all of these requirements, the “quality” of the interconnect still plays a crucial role.

Facing These Challenges

Harsh Environments
The ability to operate effectively in harsh environments may be one of the biggest challenges I/O rectangular manufacturers have had to overcome. As more and more I/O connectors find their way into the industrial automation, transportation, and medical markets, the necessity to produce I/O rectangular connectors that can thrive in a variety of environments becomes essential. Connectors once viewed as primarily for controlled environments are now being utilized in some of the harshest environments. Manufacturers have responded to these requirements by offering additional plating options and termination styles, stronger and more resilient insulator materials, and a broad offering of accessories.

Amphenol Socapex has responded to this challenge with its Field Series of products. Designed to reinforce standard USB 2.0 and IEEE1394 interconnects, the Field Series allows standard USB 2.0 and IEEE1394 connections to be resistant to shock, vibration, and traction, as well as sealed against fluids and dust. By inserting a standard USB 2.0 or IEEE1394 cordset into a metallic plug, using a tri-start thread coupling mechanism (MIL-DTL-38999 series III type), and an anti-decoupling device for high vibration, and then mating this with a USB receptacle module that offers either a USB A connection or PCB board with four tinned holes for solder connection, you have created a connection that not only will withstand a variety of elements, but also provides polarization and improved EMI shielding. Other series, such as Bulgin’s Buccaneer and Yamaichi’s Y-ConUSB and Y-ConIEEE series, offer similar types of protection.

         

Occupying Less Space
 As with all interconnect products, size and density will continue to play a crucial role in design. Not only will this be a factor in markets that have traditionally required smaller more dense connectors, but it will also be a factor in markets traditionally known for their oversized connectors, such as the industrial market. Addressing this need for downsizing in the industrial market, Molex has recently introduced two series of products geared toward the needs of smaller industrial automation and new generation smaller robotic equipment. Its Mini-HMC rectangular I/O connector system offers similar form and function to traditional heavy-duty hard shell rectangular I/O, with a reported 65 percent space-saving potential. Designed for signal applications, the Mini-HMC is available in 10 or 40 contacts, with a maximum current rating of 7 amps. The Molex CRC (Compact Robotic Connector) provides signal and power options, shielding, and high-density (.118”) grid packaging, in up to 30 circuits. Rated at up to 15 amps, this interconnect offers durable one-touch mate and unmated, while taking only about 1/15th the space of industry standard heavy-duty connectors.

In support of the growing miniaturization trend for portable devices, such as PDAs and digital cameras, and the continued adoption of USB in mobile phones, the USB Implementers Forum, Inc. (USB-IF) finalized the specification of the Micro-USB earlier this year. The Micro-USB, spearheaded by Hirose Electric, is smaller and thinner than the Mini-USB, specifies a stainless steel shell for longer life and higher durability, and a passive latching mechanism for higher extraction forces. It is expected to replace most of the mini-USB plugs and receptacles currently being used. Hirose plans to offer production quantities in early summer 2007, available in several configurations and mounting styles. Micro-B receptacles for standard devices, Micro-AB receptacles for OTG devices, and Micro-A and Micro-B plugs and cable assemblies, are all referenced in the specification. Similar products should also be available from Molex and other current USB suppliers in 2007.

Increased Speed
Over the last decade, speed and signal integrity often equates to success in the world of I/O rectangular interconnect. With this in mind, 3M’s recent introduction of their Mini-SAS connector should offer just that.

Designed for the 2007 jump to 6 Gbps, this I/O connector meets the need for much higher data throughput, while still maintaining the use of standard SCSI commands used in parallel SCSI. Designed for servers, routers, and storage applications, this I/O interconnect conforms to SFF 8086, 8087 and 8088 standards, doubles the capacity of first generation SAS, and provides increased I/O density with greater channel capacities. In addition to 3M, Amphenol and Tyco will be offering similar type products in 2007.

 

  

Cost-Effective Assembly and Placement
 The ability to modify existing connector types to offer a significant advantage over traditional I/O interconnects has also become a focus point for many interconnect manufacturers. Modifications, like pick-and-place capabilities, offer customers significant reductions in time and money spent over manual placement. Reflow process compatible pin-and-paste technology gives customers the ability to reduce their total applied cost by making costly wave-solder or press-fit operations unnecessary. Many manufacturers who have offered thru-hole PCB-type products are now complementing their line with surface mount options, and others have opted to offer many product series in a variety of colors for reductions in mating errors.

Ease-of-assembly, and the ability to use or upgrade existing assembly equipment, also affects the I/O rectangular segment. Cable and harness assembly manufacturers account for a large portion of I/O rectangular sales and will continue as leaders in that area. High-speed cable assemblies are presently one of the fastest growing areas in this market. The ability to use or retrofit existing equipment will play heavily in the overall cost of assembly. Interconnects systems, like RAST, that dictate specific interconnects, allow the use of high-speed termination equipment, and automated inspection of harnesses will continue to grow. Automated inspection of harnesses will continue to grow. With manufacturers like Tyco broadening their RAST line with headers designed to mate with RAST-compliant receptacles, the options available to OEMs will only increase.

Bishop and Associates Analysis of the I/O Rectangular Market

  • Rectangular I/O growth from 2005 to 2006 exceeded overall connector growth. This was mainly due to its ability to adapt to market requirements.

  • Over the next five years, I/O rectangular growth is anticipated to be slightly above overall connector growth. Much of this growth will be in high-speed connectors used in cable assemblies.

  • I/O rectangular interconnects will continue to play an important role in the cable and harness industry. Ease of assembly, durability, availability, and low tooling costs will drive connector selection.

  • Over the next five years, I/O rectangular interconnects will maintain their third place ranking, just slightly behind application specific connectors. Similar to other interconnect categories, the largest growth will be seen in China.

  • By 2011, the I/O rectangular segment should exceed $10 billion in sales, with China accounting for almost 30 percent of all I/O rectangular connectors.

  • Older interfaces will continue to lose market share as the transition to high-speed serial signaling drives the development of new interfaces.

  • Interfaces able to satisfy both harsh environment requirements and offer increased signaling speed will enjoy the greatest potential growth.

Lynda Nolen
Product Specialist, Bishop & Associates Inc.
 Lynda Nolen has been in the interconnect industry for over 28 years. She has worked in sales, sales management, marketing, and product management for such companies as TRW Electronics Components Group, Sunbelt Components, Cinch Connectors, Arrow Electronics, PEI Genesis, and Delphi Interconnect. Nolen has extensive experience in competitive cross-referencing, drawing, web and catalog review, new product introduction programs, harness and connector assembly programs, account management, and customer service programs. Lynda received her Bachelor of Arts degree from Roger Williams University in Rhode Island in 1979, and has completed various electrical engineering courses.


 
 
 

Bishop & Associates, Inc. © 2007