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Telecom in Transition, Moving
at Hyper-Speed
By David Pheteplace,
Bishop & Associates Inc.
Telecommunications
equipment has come a long way since the days of mechanically switched
phone lines. The latest step in this evolution is the IP-based routers
and switches. This evolution has also significantly impacted the
backplane connectors used in telecommunications equipment.
Twenty
years ago, a commonly used backplane connector used in rack-based
telecom equipment was the DIN 41612 (pictured right from ERNI). The
connectors are rated at 2 amps per pin and 500 volts. They have a
0.1-inch pitch and have first-mate/last-break contacts to accommodate
hot-swappable applications. The DIN 41612 evolved into the 2mm connector
used in the Futurebus standard. Although they are still used in many
rack-mount systems today, most telecom equipment uses newer connectors
that have higher pin densities and are able to handle higher speed
signals.
Why the move? The major factors are the advances in semiconductor
technology and the explosive growth of broadband Internet. The computer
processors used in today's computers pack millions of gates into
increasingly
denser
packages. As a result, the communication links are getting shorter and
the processing speeds are increasing. With the growth of the Internet,
faster equipment is needed to keep up with the demand for high-speed
service. This is where the IP router and core router come into play.
They are the most cost-effective way to increase the capacity and speed
of the telecommunications system. Rack-based IP router and core router
systems require backplane connectors that can handle signal bandwidth up
to 10Gb/s. On today’s drawing boards, 40Gb/s is the holy grail for these
systems, so designers are in need of headroom for their interconnect
systems.
The
Juniper TX Matrix (left) interconnects four of Juniper's core routers to
achieve a sustainable throughput rate of 2.5Tb/s, equaling three billion
pps (packets per second). The T Series supports a 100Gb/s Ethernet
router interface.
Cisco's 7609 series Internet router (right) has a bandwidth of 256Gb/s,
a switching performance of 30Mpps, and a service performance of 6Mpps
per OSM (Optical Service Module). These speeds are obtained by running
multiple parallel channels at lower speeds. The aggregate speed may be
25, 40, or 100 gigabits.
In order to handle this bandwidth, backplane connector manufacturers
have had to control the attenuation, impedance, and crosstalk in these
multi-gigabit connectors.
To
meet these performance criteria, most designs originally incorporated
internal shielding to minimize crosstalk and maintain consistent
impedance. FCI’s AirMax design meets the requirements without shielding
by closely controlling the dimensions of the connector and the mating of
contact pairs. This enables system designers to more closely match
system requirements with a more cost-effective product. Many connector
manufacturers introduced competing designs. The shielded systems with
differentially paired contacts, however, are being chosen for the
higher-speed applications.

The Tyco Impact™
backplane product (right) is designed for increased speed and signal
density. The connector utilizes a localized ground return path and
tightly coupled differential pairs to reduce crosstalk and increase the
bandwidth capabilities. The connector system is rated at 100 ohms
impedance and 25Gb/s bandwidth. The product is intended for use in IP
switches and routers.

The Amphenol TCS XCede©
high-density connector is a similar design to the Tyco connector. It
utilizes differential pairs (up to 85 pairs per inch) with 85 and 100
ohm impedance ratings. XCede HD is
designed for data rates from six to 10 Gb/s, but allows the system
designer an easy upgrade path to more than 20 Gb/s.
The
Molex GbX I-Trac connector utilizes a broadside coupled, skew-equalized
design with differential pair, allowing 56 to 300 circuits depending on
the connector and pairing. The pitch of the connector is 0.073-inches by
0.146-inches. The connector is designed for telecommunication
applications and can handle data rates up to 12.5 Gb/s. With the
capability to be rotated 90 degrees on opposite sides of a midplane, it
is also capable of orthogonal architecture.
Several enabling technologies
facilitate these speeds through backplane connectors. Advances in signal
conditioning - equalization and compensation - are particularly
important. In the advanced signal software, the send/receive circuits
are capable of ferreting out high-speed, low-level signals buried in the
noise caused by an imperfect physical system. On
the physical side, improvements to the connector footprint, and smaller,
shorter pins, with smaller, plated through-holes on the PCB, reduce
crosstalk. In the printed circuit board design, enhanced FR4 materials
in the boards improves high-speed performance, and counter-boring of the
plated through holes reduces stub length, thus reducing potential
secondary (reflected) signals. Without all of these factors working
together, the system would not work at higher speeds.
As our need for bandwidth on the Internet continues to grow, connector
manufacturers will have to keep pushing the envelope with these systems
to appease consumers who have come to expect constant, and rapid
improvements in their technology.
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