Samtec Launches New Copper and Optical Interconnect System at DesignCon
Samtec Launches New Copper and Optical Interconnect System at DesignCon
Samtec will participate in the DesignCon 2013 conference and exhibition, featuring new products for high-speed and signal integrity applications as well as a 40-minute technical paper session on “Advances in Miniature Onboard Optical Interconnects” on Tuesday, January 31, 2013 at 10:15 a.m.
Samtec’s new patent-pending FireFly Micro Flyover System is the first interconnect system that gives the designer a choice of using either micro footprint optical or copper interconnects to meet today and next-generation data rate requirements. The FireFly system utilizes low-cost copper cables or high-performance active optical engines to achieve data rates up to 28 Gb/s. Data “flies over” the board, negating layout complexities, improving electrical performance, and eliminating signal integrity issues.
The FireFly active optical cable assembly uses the proven 850 nm VCSEL array and multi-mode fiber technology and contains all the necessary controls to ensure the optical engine provides maximum performance with minimum power dissipation. The FireFly copper cable assembly features Samtec’s 38 AWG ribbon coax cable used extensively for existing high-speed copper cable assemblies, which allows for seamless integration of new designs with existing designs. The two-piece connector system mates with both cable assemblies making it easy to upgrade from copper to optical when that level of performance is required.
Samtec’s line of high-speed, high-density SEARAY Open Pin Field Arrays, which maximize grounding and routing flexibility and feature EdgeRate contacts optimized for signal integrity, will also be featured at the show. The 1.27 mm (.050”) pitch system (SEAM/SEAF Series) is available with up to 500 I/Os in stack heights from 4.00 mm to 40.00 mm. Right-angle designs are available for micro backplane applications, while press-fit tail options provide greater system flexibility. The 0.80 mm pitch (.0315”) system offers up to a 50% board space savings with 7.00 mm and 10.00 mm stack heights. Both SEARAY systems are 25+ Gb/s solutions, as they either achieve a data rate of 25 Gb/s or more at 3 dB insertion loss, or meet the 25 Gb/s per channel (100 Gigabit Ethernet) standard, depending on required stack height.
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