New Video Demonstrates Flip-Top BGA Test Sockets Ease of Use
Advanced Interconnections Corp. recently produced a video showing how easy the Flip-Top BGA Socket is to use for device test and validation. The video illustrates how the socket’s compact design uses less PC board space than typical test sockets because the Flip-Top BGA Socket requires no external screws, backing plates, or mounting holes in the PCB. Highlighted features include the hinged clamp, with integral heat sink, which makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to each specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues to ensure a reliable electrical connection.
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