Consumers and businesses want to be able to repair the products they have invested in. Industry says no. If you are an engineer and your phone — or toaster, TV, or printer — is on the fritz, you’ve got two options: Tinker with it or toss it. But most people only have one option, and Read More >>
How did data centers do during the recent spate of disasters? Just fine, thanks to good planning. The cloud is a great repository for critical information, but in the event of a fire, hurricane, earthquake, or other disaster, that information is only as safe as the data center in which it’s stored. This summer, disasters Read More >>
By Alexander Weber, Global Product Manager, Belden Inc. Fact: Mission-critical applications require industrial networking components that meet the highest levels of industry standards to withstand harsh environmental conditions. Failure to meet this threshold is likely to result in higher levels of interference and longer periods of downtime. With this in mind, selecting products with industry Read More >>
Molex, Phoenix Contact, Murrelektronik, and binder are driving the standardization of a non-proprietary push-pull connection system M12 connection technology market leaders Molex, Phoenix Contact, Murrelektronik, and binder have announced a cooperation agreement to drive the standardization of M12 push-pull connectors. M12 push-pull interlocks make traditional screw connections a thing of the past, as they automatically Read More >>
Recent approval of the IEEE 802.3bp standard offers efficiencies for reducing the weight and cost of interconnections to support communication among an ever-growing roster of automotive subsystems. While advanced driver assistance systems (ADAS) and infotainment systems have been touted to automotive consumers for quite some time, automotive electronic engineers have been saddled with adapting Read More >>
Systems designers must keep up with ever-evolving next-generation device standards, as well as with standards not yet set. Systems design engineers need to keep several considerations in mind when designing to meet codes and standards. But what about when design or product standards don’t yet exist, are in flux, or when technology convergence blurs Read More >>
Depicted as “one cable to connect them all,” in reality there will be more than one type of USB-C cable. Mouser Electronics offers a primer on what you need to know about USB Type-C technology. USB Type-C (USB-C) is a new technology that promises to de-clutter our lives by channeling up to 10Gb/s of Read More >>
The microQSFP Specification Version 2.0 enables development of new compact transceivers that address future 100G port density, data speed, and system thermal requirements. The members of the microQSFP (micro Quad Small Form-Factor Pluggable) Multi-Source Agreement (MSA) group today announced that it has released the microQSFP Specification Version 2.0, which allows system designers, optical module manufacturers, Read More >>
IPC/WHMA A-620-B is an excellent tool for everyone involved in the building of wire harnesses because it greatly simplifies best practices for the harness supplier. The WHMA’s Donnie Hill updates us on the latest revisions to the standard. IPC/WHMA – A-620-B is the current wire harness standard developed jointly by IPC and the Wire Harness Read More >>
As US politicians debate the future of the Internet, Bishop & Associates’ John MacWilliams makes the case for leaving oversight in the hands of the US. The World Wide Web evolved out of DARPA Net in the late 1980s, emerging from an NSF/university technology dotcom system, and then as an open Internet in the Read More >>
Pure tin plating has been almost universally adopted, but the looming expiration of a critical exemption is poised to bite manufacturers of screw machined contacts. Bob Hult examines the continuing impact of RoHS. Just when you thought the connector industry had bit the bullet and removed all lead from its products, the looming expiration of Read More >>
The Photonic Systems Manufacturing Consortium enlists participation in a 10-year roadmap for the development and manufacturing capabilities needed to produce low-cost, high-volume, integrated photonic systems. The Photonic Systems Manufacturing Consortium (PSMC), a collaboration of the International Electronics Manufacturing Initiative (iNEMI) and the MIT Microphotonics Center, is enlisting the participation of key industry stakeholders in its development of Read More >>
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