The cabling system promises to streamline rack interconnect systems. Companies that design components for Ethernet systems will want to take a look at the RCx Multi-Source Agreement (MSA), a new intra-rack connection technology aimed at Ethernet applications. RCx MSA, an industry working group with members from Amphenol, Broadcom, Dell, Hewlett Packard Enterprise, and JAE Electronics, Read More >>
As the Internet of Things expands to link phones, appliances, security systems, and vehicles, manufacturers are looking to one SIM card that can talk to them all. By David Luu, Marketing Manager, GCT Connectors Embedded subscriber identity modules (eSIMs) or embedded universal integrated circuit cards (eUICCs) are integrated SIM chips that cannot be removed from Read More >>
The two most widely used standards in the electronics industry, IPC-J-STD-001 and IPC-A-610, have been updated. How will this impact your work? IPC — Association Connecting Electronics Industries® has released the G revisions of IPC-J-STD-001, Requirements of Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. These documents refer to the two most widely Read More >>
A multitude of requirements compel manufacturers to default to worldwide commonality. EU regulations, such as RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals), the US Dodd-Frank Law (involving Conflict Minerals), and California’s Proposition 65 (currently listing over 800 chemicals that must be flagged), affect composition, processing, costs, and supply Read More >>
Consumers and businesses want to be able to repair the products they have invested in. Industry says no. If you are an engineer and your phone — or toaster, TV, or printer — is on the fritz, you’ve got two options: Tinker with it or toss it. But most people only have one option, and Read More >>
How did data centers do during the recent spate of disasters? Just fine, thanks to good planning. The cloud is a great repository for critical information, but in the event of a fire, hurricane, earthquake, or other disaster, that information is only as safe as the data center in which it’s stored. This summer, disasters Read More >>
By Alexander Weber, Global Product Manager, Belden Inc. Fact: Mission-critical applications require industrial networking components that meet the highest levels of industry standards to withstand harsh environmental conditions. Failure to meet this threshold is likely to result in higher levels of interference and longer periods of downtime. With this in mind, selecting products with industry Read More >>
Molex, Phoenix Contact, Murrelektronik, and binder are driving the standardization of a non-proprietary push-pull connection system M12 connection technology market leaders Molex, Phoenix Contact, Murrelektronik, and binder have announced a cooperation agreement to drive the standardization of M12 push-pull connectors. M12 push-pull interlocks make traditional screw connections a thing of the past, as they automatically Read More >>
Recent approval of the IEEE 802.3bp standard offers efficiencies for reducing the weight and cost of interconnections to support communication among an ever-growing roster of automotive subsystems. While advanced driver assistance systems (ADAS) and infotainment systems have been touted to automotive consumers for quite some time, automotive electronic engineers have been saddled with adapting Read More >>
Systems designers must keep up with ever-evolving next-generation device standards, as well as with standards not yet set. Systems design engineers need to keep several considerations in mind when designing to meet codes and standards. But what about when design or product standards don’t yet exist, are in flux, or when technology convergence blurs Read More >>
Depicted as “one cable to connect them all,” in reality there will be more than one type of USB-C cable. Mouser Electronics offers a primer on what you need to know about USB Type-C technology. USB Type-C (USB-C) is a new technology that promises to de-clutter our lives by channeling up to 10Gb/s of Read More >>
The microQSFP Specification Version 2.0 enables development of new compact transceivers that address future 100G port density, data speed, and system thermal requirements. The members of the microQSFP (micro Quad Small Form-Factor Pluggable) Multi-Source Agreement (MSA) group today announced that it has released the microQSFP Specification Version 2.0, which allows system designers, optical module manufacturers, Read More >>
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