Recent approval of the IEEE 802.3bp standard offers efficiencies for reducing the weight and cost of interconnections to support communication among an ever-growing roster of automotive subsystems. While advanced driver assistance systems (ADAS) and infotainment systems have been touted to automotive consumers for quite some time, automotive electronic engineers have been saddled with adapting olderRead More
Systems designers must keep up with ever-evolving next-generation device standards, as well as with standards not yet set. Systems design engineers need to keep several considerations in mind when designing to meet codes and standards. But what about when design or product standards don’t yet exist, are in flux, or when technology convergence blursRead More
Depicted as “one cable to connect them all,” in reality there will be more than one type of USB-C cable. Mouser Electronics offers a primer on what you need to know about USB Type-C technology. USB Type-C (USB-C) is a new technology that promises to de-clutter our lives by channeling up to 10Gb/s ofRead More
The microQSFP Specification Version 2.0 enables development of new compact transceivers that address future 100G port density, data speed, and system thermal requirements. The members of the microQSFP (micro Quad Small Form-Factor Pluggable) Multi-Source Agreement (MSA) group today announced that it has released the microQSFP Specification Version 2.0, which allows system designers, optical module manufacturers,Read More
IPC/WHMA A-620-B is an excellent tool for everyone involved in the building of wire harnesses because it greatly simplifies best practices for the harness supplier. The WHMA’s Donnie Hill updates us on the latest revisions to the standard. IPC/WHMA – A-620-B is the current wire harness standard developed jointly by IPC and the Wire HarnessRead More
As US politicians debate the future of the Internet, Bishop & Associates’ John MacWilliams makes the case for leaving oversight in the hands of the US. The World Wide Web evolved out of DARPA Net in the late 1980s, emerging from an NSF/university technology dotcom system, and then as an open Internet in theRead More
Pure tin plating has been almost universally adopted, but the looming expiration of a critical exemption is poised to bite manufacturers of screw machined contacts. Bob Hult examines the continuing impact of RoHS. Just when you thought the connector industry had bit the bullet and removed all lead from its products, the looming expiration ofRead More
The Photonic Systems Manufacturing Consortium enlists participation in a 10-year roadmap for the development and manufacturing capabilities needed to produce low-cost, high-volume, integrated photonic systems. The Photonic Systems Manufacturing Consortium (PSMC), a collaboration of the International Electronics Manufacturing Initiative (iNEMI) and the MIT Microphotonics Center, is enlisting the participation of key industry stakeholders in its development ofRead More
The first standard for 40G structured cabling, IEEE 802.3ba, only covered fiber optics and short-reach copper twinax. Now an active task force is developing a copper twisted-pair standard. Here is a look at the technology and potential market for copper 40-Gigabit Ethernet. While the TIA touts its premise wiring standards as “application non-specific,” the industryRead More
Using multi-contact coax connectors and VITA standards can preserve space on the front panel and facilitate insertion/removal of cards for installation, repair, and upgrades. A growing trend in electronic packaging for military and aerospace applications is the availability of multi-contact coaxial interconnects. A key driver is the desire to provide RF disconnect capability at the backplane/daughtercardRead More
With no medical industry standards for cable, the industry adopts voluntary specifications to ensure patient safety. The medical device industry tolerates a much smaller margin of error than most other industries. Medical devices are highly precise and sensitive instruments. As such, medical interconnect cable, and more significantly, the material used in such apparatuses, must beRead More
February 5, 2013—New tool will improve reliability of ball grid arrays and fine-pitch ball grid arrays in high-density applications.
