Teradyne Connector Systems’ innovative VHDM connectors combined ground-plane and lead-frame wafers. You may remember that AMP’s patent associated with the Z-pack 2mm HM (hard metric) with ground planes between wafers was not tooled for the 2mm HM connector, primarily because it was difficult to justify the additional cost and complexity with just two pairs per chicklet. … Continue reading Great Connector Inventions: Wafers with Integrated Ground Planes