The Hirose DF52 Series wire-to-board connector utilizes a compact, space-saving layout to deliver high current capacity in a small package.
Hirose introduced the DF52 Series, a small 0.8mm-pitch wire-to-board connector that delivers up to 2.5A per contact. With a height of only 1.75mm and a depth of 4.1mm, this miniature wire-to-board connector provides significant PCB space savings. The low-profile DF52 Series combines a compact design with a thick housing structure, ensuring high reliability and ruggedness in consumer, gaming, imaging, security, and wearable applications.
The DF52 Series utilizes robust box-shaped crimp terminals that prevent snaring or breakage and stabilize the contact. The header terminals are C-shaped with two points of contact on the top and bottom. Offering low contact resistance via highly conductive materials, the DF52 Series is well-suited for high-current applications.
“The DF52 Series has a housing wall thickness 1.5 times thicker than competing connectors. With a breaking strength of 9.5N, this wire-to-board connector is 1.5 times stronger than competing products on the market,” said Rick van Weezel, vice president of sales and marketing for Hirose Electric USA. “The DF52 Series offers one of the most reliable high-power connectors in a compact, space-saving design.”
In addition, the DF52 Series features a patent-pending design with slits in the housing that allow visual confirmation of mating completion and improves overall efficiency of assembly.
The DF52 Series is rated up to 2.5A maximum with 28AWG for two positions. Multiple positions ranging from two to 20 are available.
The DF52 Series is RoHS-compliant, with an operating temperature range of -40°C to +85°C, a rated power voltage of 100V AC/DC, a rated power contact resistance of 10 milliohms, and an insulation resistance of 100 megaohms minimum at 100V DC.
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