This week’s interconnect news is a positive mix of acquisitions, awards, promotions, and achievements.
Molex acquired Interconnect Systems Inc. (ISI), which specializes in the design and manufacture of high-density silicon packaging with advanced interconnect technologies. The acquisition enables Molex to offer a wider range of fully integrated solutions to customers worldwide. Headquartered in Camarillo, Calif., ISI delivers advanced packaging and interconnect solutions to top-tier OEMs in a wide range of industries and technology markets, including aerospace and defense, industrial, data storage and networking, telecom, and high-performance computing. ISI uses a multi-discipline customized approach to improve solution performance, reduce package size, and expedite time-to-market for customers. By combining respective strengths and leveraging their global manufacturing footprint, the companies can more efficiently and effectively provide customers with advanced technology platforms and top-notch support services, while scaling up to higher-volume production.
In other Molex news, the manufacturer received the 2015 Best Quality Partner (Gold Award) from Huawei Technologies. Molex won the Gold Award based on the strength of its product quality performance and quality management process and was the only Huawei cable and connector supplier to receive the award. Molex solutions support the development of Huawei end-to-end ICT solutions, which are designed to provide customers with a competitive edge in telecom and enterprise networks, devices, and cloud computing. Huawei ranks top suppliers in its global supply chain according to an annual scorecard measuring performance on a quarterly basis. In 2015, Molex consistently ranked highest among Huawei connector and cable suppliers in the categories of quality and stabilization. Responsible for overseeing Molex quality control and shipments in China, Molex Dongguan excelled in providing responsive service and reliable delivery of high-performance solutions to help meet Huawei’s targets for superior quality.
LEMO USA has appointed Farhad Kashani as its new general manager. With more than 20 years of high-technology global manufacturing and design experience with companies such as Amphenol and Nortel Networks, Kashani has extensive senior management and technical expertise. He holds a bachelor’s degree from the University of Waterloo in mechanical engineering and a minor in management science.
Hermetic Seal Corporation (HSC), a unit of AMETEK Interconnect, has expanded its hermetic sealing capabilities to include state-of-the-art hermetic fiber optic component manufacture. The new glass-to-fiber optic seal (GTFOS) capabilities allow AMETEK HSC to manufacture, process, terminate, and test optical connector and feedthrough components for demanding harsh environments utilizing specialty optical fibers. By commissioning temperature-controlled and monitored hydrostatic pressure vessels and adding manufacturing facilities for fiber preparation, inspection, sealing preparation, and optical performance evaluation, AMETEK has further broadened its interconnect industry lead in optical component development, qualification, and production.
C&K Components announced the appointment of John J. Boucher as chief executive officer. Boucher brings more than 30 years of diversified experience with leading global companies within the high-tech electronics manufacturing and services segment to C&K. He most recently served as president and CEO of ModusLink and, before that, served as partner, chief commercial officer, and chief operations officer at Symbotic LLC, a product and service company that provides robotics and automation solutions for high-volume distribution centers. He has also held high-level positions at Celestica, Manufacturers Services Ltd., and Digital Equipment Corporation. Boucher replaces Frédéric Chevreton, who is leaving the company to pursue other interests.
The Lumberg Group won the Key Supplier Award 2016 for outstanding achievement from the Brose Group. Lumberg has been working for the international automotive supplier and its 60 production sites in 23 countries since early 2008. A family business, the Brose Group, with sales that reached €6 billion in 2015, employs around 24,000 people worldwide and specializes in mechatronic components and systems for car doors, seats, and car bodies. As a supplier of highly complex mechatronic sub-assemblies, Lumberg is one of the key suppliers for the Brose Group.
Mouser Electronics announced the opening of its South Korea Customer Service Center, located in Seoul. This new customer service center will support local design engineers and buyers, helping them to locate the newest products for their designs. Mouser now has 22 offices worldwide, with nine locations in the Asia Pacific region. In South Korea, the distributor’s business grew more than 170% in the last five years, and its customer base grew 135%. Mouser has offered services to engineers in South Korea through its comprehensive website and through its other offices across Asia, but incredible year-on-year growth validated the need for a local office in the region.
In other Mouser news, the distributor announced its next Innovation Spotlight interview with Grant Imahara as part of the Portable Power Series in the Empowering Innovation Together program. In this new interview, Imahara speaks with Jon Nelson, president and CEO, TDK Americas, to learn more about energy management and storage. Nelson explains how TDK Americas and EPCOS, a TDK group company, keep up with the latest power trends by delivering electronic components that contain the newest materials to optimize performance, cost, and space for the next generation of products and power designs.
TLC Electronics now offers a quick-response manufacturing (QRM) service to help reduce delays with interconnect, cable assembly, or simple subassembly applications. This premium service is delivered by utilizing experienced technicians and lead personnel that are dedicated to completing a customer’s assembly in a quick, timely manner. QRM quotations are returned to the customer in as little as 24 hours, and products can be delivered within five business days, depending on material availability.
Indium Corporation announced the promotion of Tim Hults to global accounts manager. Hults works closely with other members of the Indium Corporation team to coordinate global resources that enhance relationships. He also develops and executes strategies that nurture existing accounts and encourage the growth of new business. Hults joined Indium Corporation in 2014 as technical support engineer for global accounts. His electronics industry experience includes providing technical support and training to electronics manufacturers.
Airbus Group and Siemens have signed a collaboration agreement in the field of hybrid electric propulsion. In doing so, the companies have launched a major joint project toward the electrification of aviation with the goal of demonstrating the technical feasibility of various hybrid/electric propulsion systems by 2020. Both companies will be making significant contributions into the project and have sourced a team of around 200 employees to advance European leadership in innovation and the development of electrically powered aircraft. Hybrid-electric propulsion systems can significantly reduce fuel consumption of aircraft and reduce noise. European emissions targets aim for a 75% reduction of CO2 emissions by 2050 compared to the values for the year 2000. These ambitious goals cannot be achieved by conventional technologies. Airbus Group and Siemens plan to jointly develop prototypes for various propulsion systems with power classes ranging from a few hundred kilowatts up to 10+ megawatts, i.e. for short, local trips with aircraft below 100 seats, helicopters, or UAVs up to classic short and medium-range journeys.
AbelConn Electronics, a division of Atrenne Integrated Solutions, was recently awarded a Rockwell Collins Platinum Premier Award. The Rockwell Collins Trusted Supplier Program presents the award to select top-performing suppliers who have maintained the highest level of performance and business alignment. The program is designed to foster collaboration with its supplier network to improve efficiencies and drive performance, and it provides a formal framework to inform suppliers of how they’re performing, recognize achievements, and celebrate collective successes.
The 2016 International Group IV Photonics Conference (GFP 2016), sponsored by the IEEE Photonics Society, has announced a call for papers seeking original research on novel materials and nanophotonics; photonic devices; and silicon photonics applications and systems. The conference is scheduled for August 24 – 26 at the Grand Kempinski Hotel Shanghai in Shanghai, China. The Group IV Photonics Conference, now in its 13th year, delivers insights on current and future innovations in Group IV element-based photonic materials and devices including silicon photonics as well as other integration and fabrication technologies. Scheduled as a single-track conference, GFP 2016 facilitates personal interaction between colleagues, including oral and poster sessions of contributed and invited papers, as well as a plenary session with overviews of important Group IV element photonics topics.
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