The new JST XNI Series wire-to-board crimp-style disconnectible connectors feature JST’s unique inertia locking mechanism to prevent false mating.
JST Corporation’s new XNI Series wire-to-board, 2.5mm (.098″) pitch, crimp-style connectors offer high reliability and provide stable contact performance under high-vibration conditions.
The headers and housings incorporate polarization, keying (physical and color), and secure locking features. The unique contact locking feature is internal to the housing, thereby eliminating contact back-out and damage through handling external locking lances. The positive locking system is designed to fit inside the envelope of the header to make it possible to stack the headers close together and still be able to release the positive lock. Additionally, the inertia locking system prevents a false mated condition. The housing and mating header must be fully mated before there is any connection between the header pins and receptacle contacts.
The XNI Series is available in two to 11 circuit sizes rated 3A (using 22AWG) at 250V (AC/DC). The contacts are tin-plated over a phosphor-bronze base material and accommodate a wire range of 30AWG to 22AWG. The box design provides redundant points of contacts to ensure a reliable connection. Temperature range is -25°C to +85°C including temperature rise in applying electrical current. PCB-mounted, through-hole headers are available in top-entry configuration. Housings are molded in a RoHS-compliant 94V-0 material.
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