This week’s Product Roundup highlights memory module sockets from leading suppliers.
Memory Module Sockets
Kensington Electronics supplies JAE’s MM80 Series memory module socket connectors for high-capacity, double-data-rate 3 (DDR3), synchronous, dynamic, random-access memory (SD-RAM), small-outline, dual-inline memory modules (SO-DIMMs) compatible with the MO-268C JEDEC standard. These right-angle SMT connectors are available in standard and reverse mounting configurations with 5.2mm heights and have 204 pins on a 0.6mm pitch, as well as a unique contact structure designed to prevent incomplete insertion by blocking the latch from locking if the memory module isn’t fully inserted. They are rated for 0.3A per terminal, a minimum of 100MΩ insulation resistance, a maximum of 40mΩ initial contact resistance, 500VAC dielectric withstanding voltage (one minute), 25 mating cycles, and operating temperatures extending from -55°C to +105°C. Ideal applications for the series include desktop and notebook PCs, servers, fax machines, and copiers.
TE Connectivity offers a broad range of industry-standard, JEDEC-compliant double-data-rate (DDR), dual-inline memory module (DIMM) sockets, which are comprised of a series of dynamic, random-access-memory integrated circuits, mounted on PCBs, and used to establish reliable connections with standard memory modules in data centers, desktop PCs, servers, mass storage devices, and various communication memory applications. All of its DDR DIMM sockets have end latches for module retention and ejection, as well as mechanical voltage keying, and a contact design that protects against mechanical stubbing, and are available in multiple color and plating options and in vertical solder tail, vertical press-fit, right-angle, and 25° angle configurations. Its DDR2 and DDR3 DIMM sockets have 240 pins, while its DDR4 and DDR5 DIMM sockets have 288 pins, but TE also offers custom sizes upon request. The latest-generation DIMMs, its DDR5 DIMM sockets, are engineered for higher data rates (3,200–6,400Mb/s) to better support modern memory module applications and deliver two times the performance of DDR4 DIMM sockets, improved signal integrity performance (7.5GHz), and better heat performance. They also have a smaller design to help preserve PCB space, minimize difficult soldering rework with enhanced contact coplanarity (0.1mm), and are available in 288-pin SMT and through-hole variants with a 0.85mm pitch and short, medium, long, and narrow latch options to address different space requirements.
Amphenol ICC’s DDR4 DIMM sockets are designed facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. They comply with the JEDEC POD12 interface standard, accept DDR4 memory modules that conform to JEDEC MO-309, and have robust housings, contacts, and latches designed to meet the severe shock and vibration test criteria for high-end servers, conserve board space, and optimize airflow. The DDR4 memory module sockets also have narrow housings with 288 contacts on a 0.85mm pitch, offer a 2.40mm module seating plane, as well as space to mount small passive components on the board bottom to maximize PCB space utilization, and support UDIMM, RDIMM, and LRDIMM module variants and 1.60mm- and 2.40mm-thick motherboards. They also support faster data rates, lower operating voltages, and lower insertion forces than earlier generations, which reduces energy consumption and enables easier module card insertion and extraction, and are available in various pin tail lengths to meet different customer requirements. Ideal applications include switches, routers, wireless infrastructure, desktop PCs, storage systems, supercomputers, workstations, and industrial and embedded systems.
Allied Electronics stocks several of TE Connectivity’s memory module sockets, including its DDR3 Pin Sockets. These third-generation, double-data-rate, dual-inline memory module (DDR3 DIMM) sockets support up to 240 pins and are used to establish reliable connections with memory modules in high-speed data applications that require peak performance, including data center servers, communications equipment, and desktop and notebook PCs. They accept standard, 168-pin JEDEC DIMMs, which support 64-bit transfer rates, and have end latches for module retention and ejection, as well as mechanical voltage keying, and contacts designed to help protect against module stubbing. TE Connectivity’s DDR3 DIMM sockets are available in vertical through-hole, vertical surface-mount, right-angle surface-mount, and Mini DIMM right-angle surface-mount variants, and the vertical through-hole sockets offer both low resistance and three tail lengths to accommodate most board thicknesses.
Molex offers a wide range of memory module socket connectors that conform to JEDEC industry standards for single- and dual-inline memory modules (SIMMs and DIMMs), as well as custom memory modules for notebook, desktop, workstation, server, storage, and telecommunications applications, and each product family offers many different options to cater to a wide range of customer requirements. Its JEDEC-standard, 0.60mm-pitch MiniDIMM socket connectors for small-form-factor (SFF) PCs, servers, and routers are designed to accept a range of SFF memory modules including SO-DIMMs while delivering the same features and high-reliability performance as full-size DIMM connectors. MiniDIMM connectors provide significant board space savings and have card-guide-style latch towers that pre-align modules for accurate insertion, integral vibration-dampening mechanisms that stabilize the module contact interface, and DIMM-style latches that enable positive retention, easy module removal, and prevent stress on DRAM BGA joints and SMT connector solder joints. They also have SMT fitting nails at both ends and on the left side of the housing to provide mechanical support for SMT leads post-soldering and support the direct insertion of modules to facilitate the close spacing of several connectors. MiniDIMM memory module socket connectors are available in vertical, right-angle, reverse-right-angle, and DDR4 versions, as well as standard and reverse 22.5° angled versions that allow for the nesting of connectors, for broad application suitability.
Materion Corporation’s Alloy 25 high-strength copper beryllium (CuBe) alloy (UNS C17200) provides the highest strength of any CuBe alloy and exhibits considerably greater electrical and thermal conductivity than other high-strength copper alloys, which makes it an excellent material for the development of connectors and other electronic components employed in heavy-duty, harsh-environment, and high-reliability applications. Additional advantages include high fatigue strength, high resistance to wear, corrosion, galling, and stress relaxation, an ultimate tensile strength that can exceed 200ksi, a hardness approaching HRC 45, and a minimum electrical conductivity of 22% per the International Annealed Copper Standard (IACS). Alloy 25 is available in strip, rod and bar, plate, tube, wire, and forging and extrusion form factors and is approved to an extensive array of ASTM International, SAE International, RWMA, European (EN), Japanese Industrial, and Military standards. Ideal applications extend across markets ranging from oil and gas to consumer electronics and include a variety of connector industry products, including computer processor and memory module socket contacts, burn-in and test socket contacts, coil springs and pins for burn-in and test socket contacts and probe pins, circular and coaxial connectors, test probes and compression contacts, and modular jack contacts.
E-tec Interconnect offers six DIMM sockets with long-latch, module-locking extractors and through-hole terminations, each of which supports tool-free module insertion and extraction. This line of memory module sockets also has positive polarization mechanisms to prevent incorrect module insertion and long-life, anti-stress contacts plated with tin in the soldering area and selective gold in the contact area. Options include 168-pin, horizontal, 90° DIMM sockets for 3.3V UD-RAM modules; 168-pin, slanted, 25° DIMM sockets for 3.3V D-RAM, SD-RAM, and UD-RAM modules; 184-pin, vertical, DIMM sockets for 2.5V DDR modules; 240-pin DIMM sockets for 1.5V DDR3 modules (available in pink, green, and black); 100-pin, vertical DIMM sockets for 3.3V UD-RAM modules; and 168-pin vertical DIMM sockets for 3.3V and 5.0V D-RAM, SD-RAM, and UD-RAM modules.
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