Promotion, acquisition, second-source agreement, and technological achievement announcements lead the news briefs for April 14, 2015.
Molex announced the expansion of its fiber optic technology platform following the recent acquisition of Oplink Communications. A wholly owned subsidiary of Koch Industries, Molex will now manage Oplink, a leading provider of optical communication components, intelligent modules, and subsystems for a wide variety of customer applications. Oplink specializes in creating total solutions utilizing advanced optical transport and transmission technologies for customers in the wireline, wireless telecom, and datacom infrastructure markets and data center applications, as well as serving adjacent sectors of CATV, government/military, and optical sensing. As bandwidth-intensive applications continue to drive upgrades and expansion across customers’ networks, Oplink products deliver solutions by addressing DWDM/CWDM bandwidth creation, bandwidth management, optical amplification, switching and routing, wavelength conditioning, monitoring and protection, connectivity, and system-level integration of active optoelectronics and passive optical components.
Arrow Electronics announced the successful completion of the acquisition of immixGroup, a value-added distributor supporting more than 800 value-added resellers, solution providers, service providers, and other public sector channel partners with specialized resources to accelerate its government sales. This acquisition is expected to be $.10 to $.14 accretive to earnings per share, excluding the impact of the amortization of related intangible assets, in the first year post-closing.
Samtec announced an agreement with Hirose Electric USA as a second source for Samtec’s FireFly Micro Flyover System. As a certified independent second source, Hirose can now provide its customers a future-proof inside-the-box system, as well as additional support to Samtec’s customers who use FireFly in current and future applications. The patented FireFly Micro Flyover System is the first future-proof interconnect system that gives designers a choice of using either optical or copper interconnects with the same micro footprint to meet today’s data rate requirements as well as those of the next generation. Data connections to 28+Gb/s bypass the board and other components, to simplify board layout design and enhance signal integrity.
TTI announced the promotion of Paula Renfrow from director of marketing, North America, to vice president of marketing, North America. In addition to her current responsibilities, which include marketing communications and public relations, Paula also has responsibility for corporate events and corporate marketing programs. Over the course of her three-plus years at TTI, she has taken her department beyond mostly marketing communications work into more applied marketing activities like customer segmentation and “white space” marketing, areas that are a growing part of her focus and efforts.
ERNI Electronics expanded its comprehensive portfolio of PowerElements with SMD variants. The SMD power elements are specifically designed for applications where there can be no holes on the PCB or a fully automated production process is given. The current rating per SMD power element is specified up to 200A. In addition to the standard versions, the SMD power elements are offered with UNC thread or customer-specific modifications upon request. The new power elements enable PCB connection for fixing cable lugs. With the SMD variants, ERNI expands its existing power element portfolio with flexible and massive press-fit zones.
Silicon Labs, a provider of semiconductor and software solutions for the Internet of Things (IoT), and Digi-Key announced an IoT design contest for pioneering developers who want to create connected “things” that will help make the world a smarter, more connected, and energy-friendly place. The “Your IoT Connected World” design contest is open to inventors of all skill levels, from professional embedded developers and seasoned makers to electronics enthusiasts. The contest runs now through July 17, with three winners to be announced on August 3, 2015. Visitors to the site will vote to choose 15 finalists, and expert judges from Silicon Labs and Digi-Key will choose the three winners. Each winner will select the Silicon Labs components they need (microcontrollers, wireless chips, sensors, boards, and more – valued up to $10,000) to bring their prize-winning IoT ideas to market as commercially viable products.
The CDFP Multi-Source Agreement (MSA) announced the release of Rev. 3.0 of the 400Gb/s (16 x 25Gb/s) pluggable transceiver specification at the Optical Fiber Communications (OFC) Exposition in March. This release includes a new Style 3 module intended for applications based on proposed draft specifications from the IEEE P802.3bs 400Gb/s Ethernet task force. The compliant Style 3 module uses the same connectors as Style 1 and Style 2 modules, but the Style 3 module cage is mechanically keyed to prevent mismating with Style 1 and Style 2 modules.
Mouser is partnering with celebrity engineer Grant Imahara to call on engineers of all levels to collaborate with him and his Spider-Bot as part of the next Robotics Empowering Innovation Challenge. This time, Grant is asking engineers to creatively describe what to attach or add on to enhance Grant’s existing Spider-Bot to solve a real-world problem, and why that particular problem should be solved. To vote, simply go to the Empowering Innovation Challenge webpage, click and scroll through the list of ideas, and pick which one you think deserves the top honors.
Molex united with other Optical Internetworking Forum (OIF) members to showcase 56Gb/s Common Electrical Interface (CEI) solutions during live technology demonstrations at the OIF in Los Angeles last month. The OIF is facilitating rapid progress on technically complete documentation that can be used to develop compliant products. This is crucial to meeting the high-performance needs of current and future communications systems that enable multi-vendor interoperability.
Esterline Connection Technologies – Souriau received a Strategic Excellence Award from Airbus in the category of electrical cables and components. This is the seventh time since 2005 that the company has received an award from Airbus. Airbus chose Esterline Connection Technologies due to its industrial maturity, strong customer focus, and the compatibility of its competitive strategy (including R&D programs and fast, up-stream development of new products) with that of Airbus.
Sonobond offers a free, no-obligation Ultrasonic Welding Viability Test, using materials supplied by the customer, to provide sample welds to see if Sonobond equipment can meet a company’s welding needs and assembly specifications.
RS Components has extended its range of interconnection solutions serving industries such as mining, chemicals, process automation, and oil and gas with the addition of HARTING Han Ex connectors for use in potentially explosive environments. The Han Ex connector range comprises a set of hoods, housings, and inserts designed as a system to satisfy intrinsically safe applications. HARTING’s patented vibration-proof Han-Quick Lock termination technology allows fast and easy assembly without special tools. Alternatively, crimp terminations are available, which can be used with wire gauges down to AWG 26. The inserts have greater than 10GΩ insulation resistance, and housings are powder-coated in the standard blue color used to indicate an intrinsically safe circuit.
Latest posts by News Release (see all)
- MikroElektronika Intel Joule click shields - May 10, 2017
- Right Angle Board-to-Board Battery Connectors Suit High Shock and Vibration Applications - May 10, 2017
- Compression Pulling Head Family Offers Six Sizes - May 3, 2017