IC Sockets

New Product Roundup for May 25, 2016

Learn about the newest product introductions from your favorite interconnect suppliers.   Product Roundup AVX Corporation has released two new series of wire-to-wire (WTW) connectors that deliver considerable cost and space savings in a broad range of industrial electronics designs – the 9286-200 Series reduced thru-wire connectors and 9286-250 reduced junction box connectors. These latestRead More

New Product Roundup for April 18, 2016

Read all about the latest product introductions from your favorite suppliers in this week’s new product roundup.      Alpha Wire recently expanded its Coaxial Cable product line under the Alpha Essentials product family to include Micro Coax sizes from 32AWG to 50AWG. With the addition of Micro Coax, Alpha Wire now offers coaxial cableRead More

Inside the 2016 OFC Conference and Expo

The OFC show will mirror a dynamic and growing industry say organizers of this year’s event.      [quote]“With escalating bandwidth needs each year and the constant change in data rates from 10G to 40G to 100G, if you don’t attend even just one year of OFC, you are actually missing out. You are missingRead More

Interconnect News: February 2016

Have you read the latest interconnect news? We’ve got the week’s product, show, personnel, and business announcements from your favorite interconnect suppliers. LEMO Celebrates 70th Anniversary LEMO is celebrating its 70th anniversary in 2016. After seven decades of innovation, the company now offers 75,000 product combinations, a product range that continues to grow through custom-specific designs. READ MORE ConnectorRead More

Interconnect News for January 29, 2016

In this issue’s interconnect news, we meet DesignCon’s Engineer of the Year and are introduced to a number of new products from global suppliers.   Eric Bogatin Named DesignCon’s Engineer of the Year DesignCon 2016, held January 19 – 21 in Santa Clara, Calif., recognized Dr. Eric Bogatin of the Teledyne LeCroy Signal Integrity AcademyRead More

Interconnect News from DesignCon

If you weren’t lucky enough to attend DesignCon, here’s your guide to the major product announcements made at the show.   DesignCon 2016 is in the books, and the show did not disappoint when it came to showcasing the latest technology. TE Connectivity TE Connectivity showed a range of industry-leading data communications connectivity solutions, withRead More

Gettin’ Down on the Show Floor: DesignCon 2016

The DesignCon show floor opens today, so we spoke with some of the exhibitors to find out what they expect will be the hot technologies in this year’s Expo Hall.   Did you enjoy your workshops and survive your bootcamps? Well, slip on your walking shoes because the DesignCon show floor opens today, and there is so muchRead More

Changing Health Tech with MEMS I/O Connectors

MEMS I/O connectors will dramatically change medical technology in 2016 as more patients require treatment both on-site and remotely.   The face of healthcare, as we know it, is changing. Rising costs combined with a substantial increase in healthcare monitoring are forcing a paradigm shift like we have never seen before. While patient care isRead More

Ironwood Electronics BGA Socket for 0.8mm-Pitch 177-Pin Device

The Ironwood Electronics socket for 177-ball BGA packages can be used on any PCB without soldering or mounting hardware or screws. Ironwood Electronics introduced a new high-performance BGA socket for 0.8mm-pitch BGA 177-pin devices. The SG-BGA-6434 socket is designed for a 13x13mm package size and operates at bandwidths up to 27GHz with less than 1dB of insertion loss.Read More

Ironwood Electronics 75GHz Clamshell Socket for BGA1156

The Ironwood Electronics 75GHz clamshell socket for BGA1156 allows users to quickly and easily socket 1mm-pitch, 34×34-array, 1156BGA packages on any application board with the performance equivalent of the direct-solder version. Ironwood Electronics introduced a new BGA socket design that uses high-performance elastomer capable of 75GHz, very low inductance, and wide temperature applications. The GT-BGA-2029 socket isRead More

Samtec Z-Ray Ultra-Low-Profile, Ultra-High-Density Interposers

Samtec Z-Ray ultra-low-profile, ultra-high-density interposers provide ultimate design flexibility. Samtec’s newly released Z-Ray one-piece arrays provide an ultra low profile and high density and are highly customizable. These compression-contact arrays are used as interposers or integrated into connector housings. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normalRead More

Yamaichi SO-DIMM Sockets

Yamaichi SO-DIMM sockets expand the supplier’s family of production use and test & burn-in sockets. With the CN111S and CN112S series, Yamaichi brings to market new socket versions for DDR2 and DDR3 SO-DIMM memory modules. With these two new series, Yamaichi is expanding its large family of production use and test & burn-in sockets. TheRead More

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