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CPU/Processor Sockets

CPU/Processor Sockets News
Molex MultiCat Mid-Power Connector Family

New Connectivity Products: July 2019

Summary coverage of new-to-market connectivity products, including interconnects, wire and cable, cable assemblies, materials, accessories, tools, development kits, and connector-adjacent technologies, such as sensors and antennas. Supplier names are generally linked to product announcements and product names are generally linked to product pages, catalogs, or datasheets. New Connectivity Products: July 2019 New Connectivity Products: July Read More >>

new connector and cable products: June 25, 2019

New Connector and Cable Products: June 25, 2019

Summary coverage of the new connector and cable products that were recently released to market, including interconnects, wire and cable, cable assemblies, materials, accessories, tools, development kits, and other connectivity products. Supplier names are generally linked to product announcements or home pages and product names are generally linked to product pages or datasheets. New Connector Read More >>

New Connector and Cable Products: April 2019 – Part II

Summary coverage of the new connector and cable products that were recently released to market, including interconnects, wire and cable, cable assemblies, materials, accessories, tools, development kits, and other connectivity products. Supplier names are generally linked to product announcements and product names are generally linked to product pages or datasheets. New Connector and Cable Products: Read More >>

TE MULTIGIG RT 3

New Connector and Cable Products: March 2019

Summary coverage of the new connector and cable products that were recently released to market, including interconnects, wire and cable, cable assemblies, development kits, tools, and materials. New Connector and Cable Products: March 2019 Interconnects, etc. TE Connectivity’s new MULTIGIG RT 3 connectors are among the fastest rugged backplane connectors currently available, supporting speeds of Read More >>

New Product News Roundup: November 2017

In the market for a new solution? We’ve rounded up, summarized, and linked the latest connectors, cables, assemblies, tools, accessories, and development kits to hit the market. New Product News Connectors, Inserts, Pins, Probes, Sockets, and Modules Bulgin’s new M-Series circular connectors provide reliable data, signal, and power transmission for harsh-environment industrial automation systems, including: Read More >>

New Product News Roundup: September 2017 – Part II

In the market for a new solution? We’ve rounded up, summarized, and linked the latest connectors, cables, assemblies, tools, accessories, and development kits to hit the market. New Product News Connectors, Inserts, Pins, Probes, Sockets, and Modules ITT Cannon’s new CTC Series high-performance, cost-effective cable-to-cable interconnects deliver ruggedized, environmentally sealed, easy-install, low-maintenance solutions for harsh-environment Read More >>

Stamped Spring Pin Socket Meets Requirements for BGA1164 Testing

Ironwood Electronics introduced a new stamped spring pin socket to address high-performance requirements for testing BGA1164 – CBT-BGA-7042. The contactor is a stamped spring pin with 31g actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH; insertion loss <1dB at 15.7 GHz; and the capacitance Read More >>

New Product News Roundup

In the market for a new solution? We’ve rounded up, summarized, and linked the latest connectors, cables, assemblies, tools, and accessories to hit the market.  Connectors and Cable Assemblies Hirose’s new DF40GL Series low-profile FPC connectors operate at USB 3.1 Gen. 2 speeds of up to 10Gb/s and are an excellent choice for daughter boards Read More >>

Featured news

Interconnect News for January 29, 2016

In this issue’s interconnect news, we meet DesignCon’s Engineer of the Year and are introduced to a number of new products from global suppliers.   Eric Bogatin Named DesignCon’s Engineer of the Year DesignCon 2016, held January 19 – 21 in Santa Clara, Calif., recognized Dr. Eric Bogatin of the Teledyne LeCroy Signal Integrity Academy Read More >>

DesignCon ChipHead

Gettin’ Down on the Show Floor: DesignCon 2016

The DesignCon show floor opens today, so we spoke with some of the exhibitors to find out what they expect will be the hot technologies in this year’s Expo Hall.   Did you enjoy your workshops and survive your bootcamps? Well, slip on your walking shoes because the DesignCon show floor opens today, and there is so much Read More >>