The DesignCon conference never fails to live up to its reputation of being the premier platform for state-of-the-art chip and board technology, and DesignCon 2019 was no different. Once again, DesignCon demonstrated why it has become the most respected conference and exhibition for engineers engaged in high-performance chip, PCB, and system design. DesignCon 2019 featured Read More >>
This week’s Product Roundup highlights high-speed connector and cable products from leading suppliers. Phoenix Contact’s FINEPITCH 0.8 Series board-to-board connectors have a compact, high-density design with 0.8mm-pitch hermaphroditic ScaleX contacts that provide critical space savings, high electrical and mechanical reliability, high tolerance compensation, and vibration-proof performance in high-speed signal and data transmission applications with Read More >>
Observers have claimed Fibre Channel, which powers Storage Area Networks (SANs), has been in decline for years, replaced by newer, faster standards. But innovations in storage network software and infrastructure may help keep demand for Fibre Channel and its dedicated connectors and cables alive. By Neil Shurtz Computing applications are continuing to grow in complexity. Read More >>
Summary coverage of the latest, new-to-market connector and cable products New Product News Roundup: April 2018 – Part I Interconnects, etc. Smiths Interconnect’s new Eclipta – ECL Series edge-card connectors feature innovative, high-performance, double-ended card contact technology designed to deliver the reliability, serviceability, and affordability demanded by critical, disposable medical applications, like electrophysiology catheters. Since Read More >>
A how-to guide for selecting and successfully implementing high-speed connectors Michael Rock, Engineering Manager – Signal Integrity Products, AirBorn Inc. When designing applications that utilize high-speed interconnects, it’s vital to navigate around all potential speed bumps along the signal’s path. Factors including: stackups, tolerances, via design, trace widths, plating, and copper etching must be understood Read More >>
Processor and SerDes speeds continue to bump up, putting pressure on input/output connectors mounted on the faceplate. Like investors running to the exit when the market tanks, the I/O panel can quickly become a serious bottleneck that limits communication and slows the system. Computers and their users hate to sit idle while waiting for required Read More >>
Summary coverage of upcoming events and recent news from across the connector industry. Event News DesignCon 2018, which will take place January 31 – February 1 in Santa Clara, California, will feature in-depth education, top-tier suppliers, and easy networking activities designed to help chip, board, and systems design engineers stay ahead of the pack, push Read More >>
In the market for a new solution? We’ve rounded up, summarized, and linked the latest connectors, cables, assemblies, tools, accessories, and development kits to hit the market. New Product News Connectors, Inserts, Pins, Probes, Sockets, and Modules Bulgin’s new M-Series circular connectors provide reliable data, signal, and power transmission for harsh-environment industrial automation systems, including: Read More >>
Connectivity and autonomy in next-generation autos is creating lots of data that will be sent to data centers, fostering a new market for connector makers. The explosion of electronics in vehicles continues to drive solid growth in the market for connectors. Typically, we think of these as harsh-environment connectors that can meet the rigorous demands Read More >>
When I/O connectors block airflow, a toolbox of solutions is required to keep today’s fast, dense, and hot systems cool. Lithium ion batteries are not the only source of excessive heat in electronic devices. A nasty combination of dense system packaging and increased power consumption tends to concentrate heat inside the box, causing component stress Read More >>
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