The Samtec SEARAY press-fit right-angle socket array provides increased design flexibility.
Samtec’s family of SEARAY Open Pin Field Arrays has expanded to include a right-angle socket with press-fit terminations for increased design flexibility and high retention. This socket is a high-density solution for micro backplane applications with Samtec’s Edge Rate contact system optimized for signal integrity.
Available in eight- and 10-row designs with up to 500 total I/Os on a .050″ (1.27mm) pitch grid, this SEARAY press-fit right-angle socket array (SEAFP-RA Series) delivers maximum grounding and routing flexibility, low insertion/extraction forces, and high cycle life. Optional guidepost holes aid in proper alignment when mating with SEARAY terminal arrays, which are also available in right-angle and press-fit terminations.
The featured Edge Rate contact system increases cycle life and minimizes the effects of broadside coupling, which decreases crosstalk for superior signal integrity performance and impedance control. This rugged contact system is also less prone to damage when “zippered” during unmating.
SEARAY products are the industry’s largest offering of high-speed, high-density, open-pin field arrays. They support 28+Gb/s applications and are also Final Inch-certified for breakout region trace routing recommendations to save designers time and money. SEARAY Open Pin Field Arrays (SEAM/SEAF Series) feature a .050″ x .050″ (1.27mm x 1.27mm) pitch grid and stack heights from 7mm to 40mm. SEARAY LP ultra-low-profile arrays (LPAM/LPAF Series) are available in 4mm, 4.5mm, and 5mm mated heights. For up to 50% board space savings, SEARAY ultra-high-density arrays (SEAM8/SEAF8 Series) feature a 0.80mm (.0315″) pitch grid with up to 500 total I/Os.
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