Connector and Cable Assembly Supplier


Overcoming High-Speed Interconnect Challenges with VNAs

Cloud computing, smart phones, and LTE services are causing a significant increase in network traffic, as well as bottlenecks in high-end services in data centers. Jon Martens and Bob Buxton of Anritsu explain how to overcome high-speed interconnect challenges with vector network analyzers. Cloud computing, smartphones, and LTE services have caused a significant increase in network Read More >>

Beware the I/O Bottleneck

It makes little difference what a computer’s computational capability may be if the I/O port is unable to keep up with the processor. Bob Hult looks at developments in high-speed I/O applications, and warns system designers to beware the I/O bottleneck. Similar to a crowded freeway, the throughput of any system is limited by its tightest constriction: Read More >>

Julian Ferry, Samtec

Q&A: Samtec on Signal Integrity

Recently we spoke to Julian Ferry, high-speed R&D manager at Samtec, to learn more about the latest developments in high-speed interconnects, which applications are driving them, and how Samtec is meeting the challenges. Read on for more from Samtec on signal integrity. CS: What are the primary applications in which system designers would look to high-speed Read More >>

Connector Challenges for High-Speed Serial Link Applications

As data rates increase, the bandwidth of signals increases and its rise time decreases. ALL signal integrity problems get worse with higher signal bandwidth and shorter rise time. Here, Dr. Eric Bogatin examines the connector challenges for high-speed serial link applications. Thanks in part to Netflix and YouTube, which together comprise as much as 50% of Read More >>

TE Mezalok Family for Rugged Applications

TE Expands Mezalock Line of Connectors

Additions to the Mezalok line of connectors offer more design flexibility with new stack height and pin density options. TE Connectivity has extended its rugged, high-speed Mezalok mezzanine connector family. The new extensions include a stack height of 15mm and a new 320-position size, which fill a height gap and add additional pin density. The Read More >>

DesignCon ChipHead

Connector Technology Highlights from DesignCon

Bob Hult reports on the connector technology highlights from DesignCon, especially the race to 100+Gb/s. The DesignCon 2014 conference and expo once again demonstrated the event’s value as the premier showcase for high-speed chip, connector, and PCB board technology. Featuring a full schedule of well-attended technical sessions over four days, a sense of excitement and Read More >>

A Peek Under The High-Speed Hood

August 2012 -What new developments are coming up in high-speed train design, and what role will cable and interconnect devices play? Here’s a look inside this fast-moving market.