Summary coverage of upcoming industry events, as well as recent award, partnership, promotion, personnel, facility, distribution, standards, association, and certification news from across the connector industry. April 2019 Connector Industry News – Part II April 2019 Connector Industry News – Part II > Event News Samtec is showcasing a wide variety of Samtec Solution Blocks Read More >>
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The two most widely used standards in the electronics industry, IPC-J-STD-001 and IPC-A-610, have been updated. How will this impact your work? IPC — Association Connecting Electronics Industries® has released the G revisions of IPC-J-STD-001, Requirements of Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. These documents refer to the two most widely Read More >>
IPC/WHMA A-620-B is an excellent tool for everyone involved in the building of wire harnesses because it greatly simplifies best practices for the harness supplier. The WHMA’s Donnie Hill updates us on the latest revisions to the standard. IPC/WHMA – A-620-B is the current wire harness standard developed jointly by IPC and the Wire Harness Read More >>
To learn more about recent appointments, promotions, and awards, check out the news briefs for May 19, 2015. Molex announced the acquisition of certain assets of Soligie Inc., which specializes in printed and flexible electronic solutions for applications in medical, military, industrial, lighting, and consumer goods. Products range from sensor systems, medical wearables, LED lighting, Read More >>
IPC has released the PCB industry results for July 2014, showing that the North American PCB business is seeing a normal seasonal slowdown. IPC announced the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders were weaker in July, but the book-to-bill ratio held steady at parity. Total Read More >>
August 2013—There is a new resource for meeting the challenges of the US SEC conflict minerals regulation as the first filing deadline approaches.
May 21, 2013—IPC conference focuses on every stage of the medical device supply chain.
February 5, 2013—New tool will improve reliability of ball grid arrays and fine-pitch ball grid arrays in high-density applications.