January 29, 2013—Polymer’s benefits to connector technology featured at DesignCon.
Home » Samtec Inc.
January 22, 2013 – Samtec’s new patent-pending FireFly Micro Flyover System is the first interconnect system that gives the designer a choice of using either micro footprint optical or copper interconnects to meet today and next-generation data rate requirements.
January 15, 2013 – Samtec’s high-speed I/O interfaces deliver rugged, durable performance.
January 8, 2013 – Samtec’s One-Piece Interfaces provide high performance with increased design flexibility ideal for almost any application.
July 17, 2012 Samtec recently updated its line of HDBNC high-density RF interconnects. The interconnects are made for broadcast video applications requiring high-density panel arrays that tend to result in additional strain on the interface due to ganged cabling. HDBNC connectors are based on the familiar quarter-turn BNC coupling design, but with patented advancements permitting Read More >>