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TE Micro SFP+ Connector and Cable Assembly

The TE micro SFP+ connector and cable assembly slash PCB and faceplate space requirements, improve signal routing, and minimize EMI.

TE ConnectivityTE Micro SFP+ Connector and Cable Assembly announced its new micro SFP+ connector and cable assembly, which slashes space requirements on faceplates and printed circuit boards (PCBs) in telecommunications, data communications, networking, and medical diagnostic equipment. The new micro SFP+ connector and cable assembly are up to 50% smaller in width and length than current SFP+ interconnects, enabling denser equipment designs than have never before been possible.

The new micro SFP+ connector and cable assembly supports up to 10Gb/s data transmission and 10 Gigabit Ethernet, Gigabit Ethernet, Fibre Channel, InfiniBand, and Fibre Channel over Ethernet (FCoE) protocols. The new product delivers several key benefits to customers:

  • Increases faceplate density/saves PCB space: Micro SFP+ needs as little as 15mm board space. One micro SFP+ frees up 19% more faceplate space than one SFP+ connector.
  • Improves signal integrity: The cable assembly and connector were designed with a staggered contact configuration that improves signal routing. Additionally, the bottom and top contacts have been further optimized for speed.
  • Reduces electromagnetic interference (EMI): EMI is minimized through a die-cast housing, cable shield crimped at 360°, and an extended EMI shield over the cable’s plug.
  • Optimizes manufacturing processes: For manufacturing automation, the board interconnect combines the connector and cage into one finished product for automated board placement. High-temperature, pin-in-paste soldering can be achieved as the product withstands up to 265°C.

“Our new micro SFP+ connector and cable assembly is ideal for communications equipment designs where space is at a premium,” said Roel van Lokven, product manager for cable and cable assemblies in TE Data Communications. “This is the latest in a series of TE connector innovations that uniquely enables denser designs, higher performance, and more cost-effective manufacturing.”

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