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Products Are
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Anderson Power Products Offers Powermod®
HP Connector Series
April
2008—Anderson Power Products® (APP) offers its PowerMod®HP
(high power) series connector family, featuring touch-safe
female housings, cable strain relief, and integral positive
latches. These safety features, combined with the ease of
connector assembly, establish a new standard for
cost-effective, high-power connectors.
APP’s PowerMod HP Series is RoHS-compliant and rated up to
450 amps for appropriate applications at a 30ºC temperature
rise. Using APP’s patented sterling contact technology, the
PowerMod HP offers low electrical resistance, provides a
minimum of 500 mating cycles, and is rated for circuit
interruption (true hotplug). These connectors are IP20-rated
(touch-safe) for user safety. The integral coding key
provides further protection by allowing the
user to configure unique mating of up to six
individual connectors.
The connectors accommodate American wire sizes from #6 to
4/0 AWG, and metric wires from 13.3 to 95mm². For additional
reliability, an innovative cable strain relief kit that
encompasses all applicable wire sizes is available as a
product option. The unique latching system offers superior
security and ergonomics, as well as clear identification
through its distinct blue buttons. PowerMod HP, offered in
10 different connector housing types, including right angle,
bus bar, panel mount, and blindmate/float selections,
delivers broad design flexibility for current and future
high power interconnections.
APP connectors are available through their authorized
distributor network or direct from the factory. For more
information, visit www.andersonpower.com. |
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Amphenol Viper Triples Best Data Rate
Performance for Aerospace

April 2008—At 10 Gb/s, Amphenol’s Viper more than triples the
previous market-best data rate performance. This press-fit
board-to-board interconnect also offers very high density,
excellent severe-environment resistance, and a modular
structure for easy customization. Viper is the ideal answer
to the high-speed transmission needs of future aerospace and
C4ISR systems.
With this product, Viper introduces several technical
innovations that ensure excellent resistance to severe
environments and provide record data rates.
The interconnect has fork female contacts providing four
points of contact between the female and male contacts,
limiting displacement to a maximum of ± 0.02". This
innovation is complemented by an anti-stubbing design which
secures female contact positioning in groove systems,
forcing correct positioning of the male contact and ensuring
secure contact. Press-fit board mounting is used on both
backplane and daughterboard. Viper provides exceptional
electrical density, exceeding 55 differential pairs per
linear inch of board.
Viper also places the ground contact in front of the signal
contacts, providing highly effective protection against
electrostatic discharge. The contacts are made of Olin C7025
TM03 plated with nickel (150 µm) and gold (50 µm). The Viper
interconnect has very good impact and vibration resistance
(> 0.2 G2/Hz, 16.9 G rms). It accepts additional backplane
protection applications (epoxy or other), routinely used in
military equipment.
The data rate performance is obtained through a novel
design: each signal contact is on a separate wafer. The
wafers are embedded in plastic (LCP UL94VO) and isolated
from each other by columnar ground shielding. This enables
Viper to reach very high data rates with no risk of
interference between the signals.
The Viper interconnect’s modular design offers extensive
design flexibility. Different wafers can be combined
according to the type of contact required: unit signal or
differential pair, power, RF, or fiber optic. The wafers are
stacked and secured by a stainless steel retention system,
which also provides shielding and acts as a board stiffener,
integrating guidance and keying options.
Optimized for differential pair architecture on a 1.8mm x
1.35mm grid, Viper can be configured for asymmetric pairs
while maintaining a chassis slot pitch of 0.8" to 1.0".
Eight and 16-row backplane modules are available with 1.8mm
x 1.8mm incrementation. Built according to the principles of
the VITA 41, 46, and even 48 standards, and available in 3U
and 6U configurations, Viper is intended to comply with
future international standards.
VIPER has been designed for military and aerospace
applications.
For more information, visit
www.amphenol-aerospace.com. |
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Amphenol RADSOK® PCB Connectors
Provide More Power, No Heat to PCB
February
2008—Amphenol
Industrial now offers three compact, high-amperage
connectors, ideal for use in high-current, single-point
connections to printed circuit boards (PCBs). The new
PowerBlok™, RADSERT™, and PGY™ connectors incorporate RADSOK®
technology to eliminate threaded connection failures and
increase reliability, flexibility, and available surface
space within a board design.
Housed in a small package of 12.7mm x 12.7mm (0.500” x
0.500”), PowerBlok provides up to 70 amps to a board. The
component’s backplane power interface uses compliant pins,
which are press-fit into the board, enabling a solid
connection and an even signal flow. PowerBlok features a
radial design that ensures many points of contact, as well
as a touch-proof cover for safer operation.
Available in either a 2.4mm (0.094”) size carrying up to 35
amps or in a 3.6mm (0.141”) size carrying up to 70 amps,
RADSERT offers the smallest footprint of Amphenol’s new PCB
line, freeing up the most surface space for added design
flexibility. In addition, RADSERT enables designers to bring
power to the board from busbars suspended above the board
and its components. A standard RADSERT is designed for a
board thickness of 6.35mm +/-0.0635mm (0.250” +/-0.025”),
with custom sizes available for specific applications.
The PGY, an orthogonal card edge connector, is available in
two sizes, 3.6mm (0.141”) carrying up to 70 amps and 5.7mm
(0.224”) carrying up to 120 amps, delivering the highest
amperage in the smallest package. Design engineers can
achieve the needed size and weight reductions within their
design without compromising the power needed for the board.
The RADSOK PCB connector series is RoHS-compliant, and can
be applied manually (press-fit) or by a reflow solder
process that eliminates the need for additional wires and
special crimping tools.
Pricing starts at $7 (PowerBlok), $2.50 (RADSERT), and $2 (PYG)
in small quantities. Delivery is eight weeks ARO.
For more information,
visit
www.amphenol-industrial.com or
www.radsok.com. |
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Aries’ High-Frequency Center Probe Test
Socket
January
2008—Aries Electronics announced its new high-frequency
center probe test socket for devices up to 13mm square.
Available in four versions with ratings of 1-3 GHz, 3-5 GHz,
5-9 GHz, and 10-18 GHz, the new socket is ideal for manual,
high-speed testing of devices such as CSP, mBGA, DSP, LGA,
SRAM, DRAM, and Flash, with pitches as low as 0.40mm.
The socket's solderless, pressure-mount, compression spring
probes allow the socket to be easily mounted to and removed
from the test board. The four-point crown ensures "scrub" on
solder balls for reliable contact mating, and its raised tip
probe works with LGAs, MLFs, and other socket types. The
socket's gold-over-nickel compression spring probe screws
leave very small witness marks on the bottom of the device
solder balls and are accurately located by two molded
plastic alignment pins, and secured with four stainless
steel screws.
Aries' new socket provides minimal signal loss for higher
bandwidth capability via a signal path of only 0.077"
(1.95mm). With an overall size of 1.200" (30.48mm) x .840"
(21.34mm) x .440" (11.18mm), the socket provides the maximum
allowable space for board components and connectors.
The compression spring probes in Aries' new RF sockets are
constructed of durable heat-treated beryllium-copper alloy,
plated with 30 µ" min. (0.75 µm) gold per Mil-G-45204 over
30 µ" min. (0.75 µm) nickel per QQ-N-290. The socket's
molded components are UL94V-0PEEK or Ultem. All hardware is
stainless steel.
The pricing for a center probe test socket with up to 50
positions starts at $330 in single-piece quantities.
Delivery is four to six weeks ARO.
For more information, visit
www.arieselec.com. |
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Blockmaster’s Innovative Power Splitting Terminal Blocks
June
2008—BlockMaster Electronics has announced the release of
its new Panel Power Distribution Terminal Block, Part
OTP-80-03P.
This new power panel distribution terminal block,
OTP-80-03P, enables the user to split large-gauge high-power
input into lower-power, smaller-gauge wire circuits. The
unit is particularly applicable for usage in HVAC equipment,
switch gear, lighting panels, and pump controls.
The OTP-80-03P is rated at 80 amps at 600 volts on the input
line side, and can load and split all attached branch
circuits up to the same current level. Input wire sizes
range from four to 10 gauge, with branch connection wire
gauges from six to 16 AWG. The operating temperature range
for the unit is from minus 40 to 90 degrees C, with housing
dimensions of 91.5mmL X 40.5mmW X 50.0mmH. It uses
polycarbonate (UL94V-0) material, with black as the standard
color. The OTP-80-03P is furnished with a clear snap-on
plastic safety cover and a convenient marker strip.
BlockMaster’s new OTP-80-03P Panel Power Distribution
Terminal Block blocks are in stock at its Elk Grove Village
Headquarters warehouse. Current pricing is quoted at $50
each.
For more information, visit
www.BlockMaster.com. |
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Blockmaster’s Highest Amperage Rated Terminal Block
April 2008—With an operating current rating of 250 amps @
600 volts, BlockMaster Electronics’ new OTB-588 Series is
the latest and most powerful offering in the company’s
already impressive high power terminal block line.
BlockMaster Electronic’s new OTB-588 High Power Series is
particularly suitable for applications requiring thru-panel
high current needs, such as electrical switch gear, off-road
vehicles, current-generating systems, and other industrial
usages where high current capacity is a design criteria.
The OTB-588 Series has a thru-panel barrier configuration
and is offered in one to 12 positions at a 35mm pitch,
accepting wire sizes of 4/0 CU within an operating
temperature range of –40 to +90ºC. Terminals are
copper-nickel-plated, furnished with M10 steel bolts.
Housing is of a black polycarbonate (UL94V-0). A snap-on
clear plastic cover is provided for finger safety. The
entire series is RoHS-compliant.
BlockMaster’s new OTB-588 terminal blocks are in stock for
sample quantities at their Elk Grove Village headquarters
warehouse. Current pricing for a two-pole OTB-588 is priced
at $25 each in lots of 500 pieces, with delivery at four to
six weeks for larger quantities. For sample requests,
pricing and delivery, detailed specifications, or a copy of
their barrier block catalog, visit
www.BlockMaster.com. |
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Binder Offers Compact Design for M9
Molded Connectors
April
2008—Binder-USA
has recently released a modified version of its Series 702,
M9 molded connectors. This modification features a new
compact design ideally suited for medical and industrial
applications with limited space. The Series 702 are
preassembled cordsets designed to improve strain relief and
reduce cable assembly time.
Both Series 702 and the cable connector, Series 712, are
manufactured with IP67 environmental protection and 360
degree EMI shielding. Cordsets are molded with PUR material,
giving durability and protection from harsh environments.
Series 702 cordsets are available with lengths of two and
five meters.
For more information, visit www.binder-usa.com. |
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BlockMaster’s “Jelly Bean” Series
Gets Higher Power Upgrade
April
2008—BlockMaster Electronics has added to its color-coded
“Jelly Bean” series of terminal blocks with an expanded
listing of higher power rated units, with current carrying
capacity of up to 60 amps.
Designated as the JB-OTB-358 series of the “Jelly Bean”
line, these modular, thru-panel units feature an operating
current rating of 60 amps at 600 volts, making them an ideal
choice for motor, industrial, and pump controls, as well as
for electrical switch gear and off-the-road vehicles.
The modular construction of the color-coded terminal blocks
provide for ease of field service by the matching of
internal wire color to the appropriate field connection. The
series is offered with a pitch of 16mm in terminal
configurations of one to 15 positions, accepting wire sizes
of three to 10 AWG CU, within its specified operating
temperature range of -40 to +90ºC. Terminals are brass
nickel-plated with steel nickel-plated screws installed.
Housing is a polycarbonate (UL94VO). Colors offered are red,
white, green, blue, yellow, gray, and black, with the entire
series being RoHS-compliant. A clear plastic snap-on cover
is supplied to enhance finger safety usages.
BlockMasters’ new JB-OTB-358 modular color-coded terminal
blocks are in stock for sample quantities. Current pricing
for a four-pole unit is quoted at $8 in lots of 500 pieces.
For sample requests, pricing and delivery, and for detailed
specifications contact BlockMaster at
www.BlockMaster.com. |
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BlockMaster 100 Amp Terminal
Blocks in Two-Pitch Versions
March
2008—BlockMaster Electronics has expanded its high power
line of thru-panel terminal blocks with the addition of the
Series OTB-388, with a terminal pitch of 21mm, and Series
OTB-488, at a 27mm terminal pitch. Both of these carry a
current capacity rating of 100 amps at 600 volts.
The two series are designed for, and are particularly useful
in motor control, gen set, electric heating, spa controls,
electrical switch gear, and off-the-road vehicle
applications in which the thru-panel construction allows for
the interfacing of internal and external wiring in those and
other industrial usages.
The OTB-388 and 488 Series are offered in 2 to 15 terminal
positions, accepting wire ranges of 2 to 8 and 2 to 10 AWG
CU, respectively. Both have an operating temperature range
of from –40 to +90ºC, with housing of a polycarbonate
(UL94V-0) with black as the standard color. Terminals are
brass/nickel plated, furnished with M6 steel nickel-plated
screws installed. Each series is supplied with plastic
snap-on covers for finger safety, with number strips
additionally supplied with the OTB-488 units. Both series
are UL-approved and RoHS-compliant.
BlockMasters’ OTB-388 and OTB-488 Series terminal blocks are
in stock for sample. Current pricing for a three-position
OTB-388 unit is quoted at $9.00 each in lots of 500 pieces.
Production quantities are quoted at four to six weeks
delivery ARO.
For more information, visit
www.BlockMaster.com. |
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Cinch Turns Up the Heat on Rugged
Connector Solutions
New
high-temperature interconnect system ensures greater
reliability in extreme conditions
May
2008—Cinch Connectors announced a new addition to its
Dura-Con™ Micro-D connector family. This new connector
solution is capable of performing in extreme temperatures,
from –40°C to +175°C. The connectors are constructed from
material designed to meet extreme mechanical and electrical
conditions in rugged military and high-end industrial
applications, such as down-hole directional drilling.
The pairing of a high-temperature insulator and Cinch’s
patented twist-pin design, featuring seven points of contact
and the proven ability to operate under extreme conditions
of shock and vibration, results in an ideal interconnect
solution delivering maximum dependability with a minimal
physical footprint. These interconnects can handle over 50
Gs of shock (Mil-Std 1344, Method 2004, Condition E) and 20
Gs of vibration (Mil-Std 1344, Method 2005, Condition IV),
while providing reliable, low-resistance connectivity.
Cinch's unique plug insulators, which are available in
tooled sizes of 9-,15-, 25-, 50-, 100-, and 120-positions,
have been designed to provide increased electrical
protection between contact cavities, preventing any
potential shorts in exposed wire or voids, which may occur
during extreme temperature fluctuations. Additional size and
configurations are also available upon request.
For more information, visit
www.cinch.com. |
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ept Inc. Introduces AMC.0 B+ Connectors to
meet AdvancedTCA
July 2008—ept inc. introduces its new 170-circuit AdvancedMC
connector solution for signal transmission up to 12.5 Gb/s,
with low cross talk. ept’s AMC.0 B+ connectors support PIGMG
AdvancedTCA industry specifications.
The new press-fit design was optimized to provide
significant cost and reliability advantages over other
termination technologies. The press-fit process allows for
the use of a standard ‘flat rock’ insertion tool, which
requires no custom tooling. The connector is also available
without pegs for applications in which the AdvancedTCA
guiding system is not desired.
ept’s AMC.0 B+ connectors are RoHS compliant.
ept also offers an additional AMC.0 compliant signal
connector compatible for MicroTCA systems.
For more information, visit www.ept.de. |
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ERNI Power D-Subs for SMT, Through-Hole
and Pressfit Applications
3W3, 3WK3, 7W2 configurations with robust stamped power
contacts
June
2008—ERNI Electronics is offering an extensive range of
D-sub connectors with precision stamped high-current
contacts to meet the needs of SMT, through-hole reflow (THR),
and press fit applications. Expensive screw-machine power
contacts are no longer necessary to achieve high-current
demands. ERNI’s power and signal contacts are efficiently
stamped for maximum reliability and lower installed cost.
Designed to be used by fully automatic assembly equipment,
ERNI’s SMT and THR power D-subs provide an economic solution
over traditionally more expensive manually placed
connectors. In applications that predominately use press fit
connectors, such as backplanes, ERNI also provides a press
fit power D-sub for gas-tight contact requirements.
The angled high-current D-sub connectors are available in
3W3, 3WK3, and 7W2 configurations, and can be fitted with a
maximum of three power supply contacts. However, partial
assembly is also possible, as illustrated by Deutsche
Telekom, which specified a 3W3 version with two contacts for
a 60 volt power supply. In press fit configuration, the
high-current contacts are specified for a maximum
current-carrying capacity of 30 amps (at 20°C). The male and
female multipoint connectors are supplied with the
corresponding pre-installed nut or an “anti-twist” interlock
bolt (both available in M3 or 4#40 UNC). The RoHS-compliant
power connectors are available in the standard installation
height (7.3mm), according to DIN 41652 and CECC 75301-802.
For applications with a cable termination, ERNI also offers
a D-sub power housing kit and high-current contacts with a
solder or crimp connection for 10, 20, 30, and 40 amps.
For fully automated assembly, ERNI’s power D-subs are
available in both an SMT-compatible tray and tape-on-reel
packaging. To further simplify pick-and-place processing,
each connector has a large intake surface for easy and
reliable vacuum pick-up. Positioning pegs are located at the
center of gravity to optimize connector placement during
soldering. The SMT power and signal contacts utilize “solder
traps” to minimize the wicking effect of solder away from
the pads, and durable surface brackets absorb extreme
mechanical forces from mating and unmating heavy cables. The
tin-plated terminals are contrasted by black high
temperature resistant thermoplastic for improved visual
inspection.
Pricing starts at $3.50 for these new D-sub connectors.
Contact ERNI for free samples.
For more information, visit
www.erni.com. |
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ept Designs New Power Connectors for MicroTCA Systems
May
2008—ept inc. has developed a MicroTCA Power Connector that
is an output connector for MicroTCA power modules.
This MicroTCA™ Power Connector is a combination connector
with 72 signal contacts at 2mm spacing, and a UPM power
component, which is a two-row pattern with 24 power
contacts. A load of up to 15 amps per pin is permitted for
the connector. This combination of signal and power contacts
on one connector has set a new standard.
ept supplies their power connector with the reliable ept
Tcom press® press-fit
technology, a proven press-fit contact in today’s
marketplace.
Features:
For more information, visit
www.ept.de. |
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ERNI Expands Universal Power Module Range
to Include 5-, 6- and 7-pin Versions
April
2008—ERNI Electronics has upgraded its hard metric Universal
Power Module (UPM) to include new 5-, 6-, and 7-pin
versions. These UPMs augment the existing 3-pin power
modules and match their current carrying capacity of 18 amps
per contact (at 20°C).
These new high-performance connectors are designed to supply
power in applications in line with industry standard PICMG
EXP.0 CompactPCI Express (5-pin and 7-pin versions). This
completes the family of connectors supplied by ERNI in
accordance with the CompactPCI Express standard, and meets
requirements on both the signal side (ERmet ZD, ERmet type
B8) and the power side.
The angled male multipoint connectors featuring pressfit
technology are designed to supply power to daughter cards in
conjunction with 2mm ERmet connectors conforming to IEC
61076-4-101. Pre-mating contacts also make it possible to
enable hot-swap applications. The corresponding straight
female multipoint connectors are used on the backplanes. The
UPMs are compatible with other 2mm and DIN 41612 connectors,
and also meet the requirements for performance grade one,
and comply with RoHS.
The UPMs are available now, with lead times of 10 days.
Estimated pricing begins at 2.00EUR per mated pair for
volume orders of the 5Pin ERmet PowerModule, 2.10EUR per
mated pair for volume orders of the 6Pin ERmet PowerModule,
and 2.20EUR per mated pair for volume orders of the 7Pin
ERmet PowerModule.
For more information, visit
www.erni.com. |
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ERNI’s Cost-Effective Board-to-Cable
Solution
Additional space savings with the compact and economical SMC
board-on-IDC cable connector
March
2008—ERNI Electronics has made an even more compact version
of its proven and tested board-on-IDC connector available as
part of its 1.27mm SMC series. The total height was reduced
down to 5.0mm from its previous height of 7.3mm, and
subsequently, cable connectors can now be designed in an
even more space-saving manner. In addition, the costs were
significantly reduced in comparison to a conventional
solution using female and male multipoint connectors. The
system avoids detachable points of contact in sensitive
applications. In the process, the cable is permanently
attached to the connector—already soldered to the PCB—by
means of the cable duct, and forms a gas-tight connection
with the IDC contacts.
The new connector enables the connection between the PCB and
an IDC flat cable to be established using only one
connector, and allows the assembly of the flat cable to be
easily and quickly performed without the need for customized
tools. The connector is designed for fully-automatic SMT
assembly, and is equipped with features to take advantage of
this, such as a black insulating body, high
temperature-resistant thermoplastic housing (LCP) for SMT
reflow soldering, a pre-assembled mounting hood and
tape-on-reel packaging.
The simple assembly process is performed
as outlined below, using a simple hand lever press:
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Remove
mounting hood from the soldered connector, and mount PCB
in customer-specified installation frame
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Move
cable duct with pre-assembled flat cable to pre-lock
position
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Using a
flat die, press cable duct to crimp dimension. During
this process, the connector must be supported on the
bottom of the PCB.
The data
sheet provides additional information on the area and the
dimensional design of the required support
The new SMT cable connector for the board-on-IDC cable
connector is available with 12, 26, or 50 pins. To promote
reliable processing and a long service life, bonus features
enable additional support by means of the contact underneath
the connector, the pre-locking of the cable duct, and the
form-fitting inserted solder clips.
Further information is available at
www.erni.com. |
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FCI TwinMezz
Mezzanine Connectors Offer High Density and High
Performance
February
2008—FCI introduced the TwinMezz board-stacking connector,
bringing ultra-high density to mezzanine applications while
exhibiting next-generation, high-speed electrical
performance. The TwinMezz system packs 25 high-speed
differential signal pairs in a square centimeter, or 161
signal pairs in a square inch of board area.
A hermaphroditic design allows the TwinMezz connector to
mate to itself, significantly reducing the number of part
variations needed to accomplish a range of different stack
heights. Current plans are to support six different
connector heights to offer 20 different stack heights in the
range of 12mm to 40mm. Planned options for two, four, or six
differential signal pairs per column will provide capability
for circuit counts ranging from 80 to 800 contact positions,
and to tailor the connector width to fit available board
space.
The TwinMezz connector exhibits very well-matched impedance,
low insertion loss, and low crosstalk, which makes it
well-suited for applications in very high-speed
environments. The open pin field structure, builds on the
same edge-coupled technology used in FCI’s successful AirMax
VS high-speed connector system. The structure allows for
custom pin assignments for optimal speed and signal density.
With optimized wiring patterns, transmission rates of 25 Gb/s
or higher are achievable.
TwinMezz connectors also feature FCI’s patented BGA
connector termination for easy attachment to printed circuit
boards using conventional reflow soldering processes.
For more information on TwinMezz connectors, contact Rob
Poort at
rob.poort@fci.com
or +31.73.6206.827, or visit
www.fci.com. |
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Fischer AluLite Connectors—When Weight
Matters
June
2008—Are
weight considerations important in the development of your
equipment? The new aluminium-engineered Fischer AluLite
Series is your solution to ultralight product design,
weighing up to 50 percent less than a comparable connector.
Saving weight improves efficiency, making the use of
aluminium in product development a natural choice in many
fields. Ultra-light, compact, and offering excellent
strength-to-weight ratio, the new Fischer AluLite product
line is ideal for mobile equipment, portable systems, and
hand-held devices.
Available in a wide range of colors, from bright to
camouflage shades, the Fischer AluLite connectors easily
integrate with your product design, while also offering a
flexible color-coding system. Rugged, 360° EMC shielded,
sealed up to IP68 (2m/24h) or hermetic, they can withstand
harsh conditions. Ideal for frequent connect/disconnect
operations, the plugs and receptacles are engineered to
endure more than 5,000 mating cycles within a temperature
range of -50°C to +150°C. Additionally, the anodized
finished connector housing is engineered with an aluminium
alloy specifically chosen for its anti-corrosion properties.
Accepting cable diameters from 1.4 to 10.7mm, the new
AluLite series is available in multi-pole, from two to 27
pins with solder, PCB, or crimp contacts and, upon request,
in coax, triax, or hybrid contact configurations. The choice
of body styles is wide: standard-sized or short plugs,
push-pull locking mechanism or emergency release system,
front projecting or flush receptacles, and front- or
rear-mounting models. This high flexibility of
configurations makes it easier to find the connector
dedicated to providing a solution to your specific product
design.
For more information, visit
www.fischerconnectors.com. |
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FCI AirMax VS® and ZipLine™ Connectors
Transmit Error-free 40Gb/s Data
May
2008—FCI recently completed multi-channel tests for both the
AirMax VS and the ZipLine connector systems, using twin test
vehicles in which the high-speed connectors transmitted
error-free data at 40Gb/s.
The test configurations consisted of a set of four Broadcom
BCM8072 dual-channel 10Gb/s transceivers and two IEEE802.3ap
reference backplanes with either AirMax VS connectors or
ZipLine backplane connectors. FCI successfully transmitted
error-free data over eight one-meter channels
simultaneously. With the daughter cards and backplane made
of Nelco 4000-12SI material, each of the channels achieved a
bit-error rate (BER) of better than 5e-16 in the presence of
seven aggressor channels. With four channels running in each
direction, the resultant aggregate data rate was 40 Gb/s.
AirMax VS Connector has been a leading high-speed backplane
connector since 2004. The recently announced ZipLine
connector system offers customers the highest signal density
of any backplane or orthogonal midplane connector presently
on the market. Both AirMax VS and ZipLine connector systems
are ideally suited for multiple 10Gb/s channel applications.
ZipLine connectors are built upon FCI’s AirMax VS technology
and offers similar signal integrity performance. Like AirMax
VS connectors, the ZipLine connector system uses
edge-coupling technology to deliver high signal density with
low insertion loss and low crosstalk, all without the use of
costly and space-consuming metal shields. Data rates can
scale from 2.5Gb/s to beyond 12Gb/s without requiring
re-design of a basic platform.
For more information, visit
www.fci.com/airmax
or
www.fci.com/zipline. |
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FCI’s
Product Portfolio Meets Demands of Industrial Applications
May
2008—FCI is expanding and updating its product portfolio to
continue to meet the needs of industrial equipment
manufacturers.
FCI’s industrial product offering is built around an
extensive range of board-to-board and wire/cable-to-board
connectors, with established brand names such as Dubox™,
Quickie®, and Minitek™. I/O connectors, including modular
jacks and D-subs, are also used in such applications.
“Customers know FCI for innovative, high-speed connector
solutions,” said Gijs Werner, global I&I market manager for
FCI. “FCI is also a reliable source for interconnect
solutions in industrial applications.”
FCI has developed several technologies to enhance product
offerings, including an improved through-hole reflow
technology (Pin-In-Paste), which is used for most of FCI’s
products. Following the trend towards miniaturization, FCI
also expanded its successful 2.00mm modular, board-to-board
system—Minitek, the most complete 2.00mm system. Minitek
provides 38 percent PCB space reduction, compared to 2.54mm
systems.
“Although some of FCI’s products were designed more than 40
years ago and set the connector standard at that time, we
find that even today these products are still going strong,”
said Bavo Teunissen, global marketing communications
director for FCI. “Products with dual-beam contact systems,
proper normal force, higher conductive materials, and
performance-based plating address the needs for higher
reliability in long lasting applications.”
A specific service program was created to accomplish a two
week lead-time, quick delivery of samples, and easy access
to information to make the design-in process easy and to
speed-up time-to-market. FCI continues to invest in the
expansion and updating of its standard product portfolio
because of the value these products have for industrial
manufacturers. Detailed information is available in a
dedicated brochure, “Connectors for Process Control,”
available on FCI’s website.
For more information, visit www.fci.com. |
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FCI’s eSATA Connector Provides External
Data Backup at Speeds up to 3Gb/s
April
2008—FCI has expanded its line of storage interface
interconnects with the development of an eSATA input/output
connector aimed at single lane external storage applications
with less than six feet of cable. Up to five times faster
than existing external storage solutions like USB 2.0 and
FireWire 400, the eSATA connector provides external data
backup and protection at speeds up to 3 Gb/s, and is ideal
for applications such as desktop and notebook computers,
set-top boxes, gaming equipment, external portable storage,
and USB-related equipment.
The eSATA connector operates at both Gen1 and Gen2 speeds,
so regardless of the implementation, the outside of the
device enclosure will meet Gen1m specifications when
operating at Gen1 speeds, and Gen2m specifications when
operating at Gen2 speeds. The eSATA is available with eSATA
+ USB 2.0 in the same connector housing, and is available in
versions including eSATA, eSATA + USB, or eSATA/USB (2-in-1)
combination.
Offering high durability up to 2500 cycles, the connector
withstands a mating force of 40N maximum and an unmating
force of 10N minimum. The eSATA connector is RoHS-compliant
and compatible with lead-free processing temperatures.
For more information, visit www.fci.com/basics. |
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FCI Develops
Customized Solutions for E1/T1 and VDSL Applications
March
2008—FCI has developed several customized I/O connector
solutions for E1/T1 and xDSL applications, including a cable
connector and a board connector solution. These products are
ideal in the telecom industry.
The E1/T1 transmission protocol is used to transmit voice
and data between devices, and runs at a speed of 2Mbit/s.
ADSL and VDSL (-2) solutions run at higher speeds, up to 100
Mbit/s, and are capable of supporting new high bandwidth
applications, such as general Internet access, HDTV, and
Voice-Over-IP services.
“Although in both cases the data transmission takes place
over a single twisted pair of copper cable, most of FCI’s
cable connector solutions are customized to accommodate a
customer’s specific needs,’’ said Remco Innemee, global
telecom market manager, FCI. ‘’Requests vary based on the
connector system, cable, cable management, and cabinet
requirements, including meeting over-voltage specifications
like ITU-T K20.’’
FCI’s range of solutions—from eight to 72 pairs per
connector—are designed to connect to cost-effective shielded
cable options.
Based on the proven Metral® IDC (insulation displacement
contact) technology, FCI is capable of using standard
building blocks to support its customer’s need for short
time-to-market. FCI also can provide its customers with
cable assemblies that complement the custom connector
systems developed for E1/T1 and xDSL solutions.
For more information, visit
www.fci.com. |
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HARTING Field
Termination Panel Feed-Through M12 for Individual Assembly
June
2008—The HARTING field termination panel feed-through M12
connector allows the
user to choose between two different kinds of termination;
the IDC-termination, by the use of HARAX®
contact blades, or the standard crimp termination are
possible.
Special tools are not necessary when the newly developed
HARAX® product from HARTING has been chosen.
A wide range of shielded cables fit the new design. D-coded
versions for Ethernet applications are offered as well as
A-coded panel feed-through connectors.
For more information, visit www.harting.com. |
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Hypertronics’ High-Density, Low-Profile Mezzanine Connectors
for High-Rel Applications
June 2008–Smiths
Interconnect, part of the global technology company Smiths
Group, announced that Hypertronics Corporation has
introduced the KFT Connector Series, a 0.050 inch (1.27mm)
fine pitch, high-density rectangular connector utilizing
0.40mm diameter Hyperboloid sockets. With a 0.343 inch
(8.71mm) stacking height, this low profile, dual-row in-line
interconnect solution is ideal for stacking, and can be used
in areas where board real estate is at a premium.
KFT connectors, like all Hypertronics connectors, are
engineered to allow for top performance under all dynamic
environmental conditions. KFT connectors provide immunity to
shock and vibration fretting, numerous linear paths of
contact, and a self-wipe action that consistently results in
better signal integrity. Designed with 30 percent
glass-filled liquid crystal polymer (LCP) insulators and
potted contacts, KFT connectors withstand the high
temperatures associated with soldering. The LCP insulators
also exceed NASA space requirements for outgassing, and have
inherent keying features to prevent improper mating.
“We designed the KFT, using the high-performance Hypertac®
technology, to be smaller in size and weight with the
capacity for high pin count to accommodate tightly spaced
board designs,” said Vadim Radunksy, Hypertronics’
president.
For more information, visit
www.hypertronics.com or
www.smiths.com.
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Hirschmann Media Module for MICE
Switches
April
2008—With new optical media modules for the switches of the
MICE family, which are approved for installation in
explosion protection zone 2, as well as optical transceivers
and connectors of the microFX series, remote terminals can
be connected safely via Ethernet in zone 1.
The media module, which has four optical ports (100 Mbit/s)
with M12 connections, is designed for a temperature range of
-40°C to +70°C. The printed circuit boards are coated with a
special varnish for protection against condensation
(conformal coating).
The signals are transmitted from the module to the remote
terminals via fiber optic cables. MicroFX transceivers, with
M12 connection technique in accordance with IEC 61076-2-101,
serve as an Ethernet interface. The remote terminal may
easily get the necessary approval for explosive zone 1
atmospheres (EN 60079-28:2007, Part 28).
The MICE switches, which are designed for mounting on DIN
rails, support both fast and gigabit Ethernet and various
routing, redundancy, and security methods. They are
especially suitable for use in industrial networks with
complex applications.
For more information, visit www.hirschmann-unlimited.com. |
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HARTING Micro Card Edge Connector
Offers Flexibility
April
2008—HARTING offers the new Micro Card Edge Connector in
surface-mounting technology for card gauges of 1.6mm. It is
suitable for board-to-board mezzanine, as well as for small
pluggable daughter card applications. The key feature for
mezzanine applications is the very flexible staple height of
parallel boards by utilizing a small board between the
connectors. This gives flexibility in the mechanical design
of the system.
The HARTING Micro Card Edge Connector is able to transfer
data rates up to 14 Gb/s, suitable for telecommunications,
medical, and industrial high-speed applications. It is
available with 40 and 100 contacts at a pitch of 0.8mm. An
extremely smooth contact surface achieved by
high-performance stamping tools and a special
after-treatment ensures low insertion forces and high
contact reliability.
HARTING´s Micro Card Edge Connector offers excellent
manufacturing features, such as tape-and-reel packaging with
a pick-and-place pad for nozzle in high-volume productions.
For more information, visit www. HARTING.com. |
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Hypertronics’
ImplanTac™, a Biocompatible, Hi-Rel Interconnect for
Implantable Devices
March
2008—Hypertronics
Corporation announces the release of their ImplanTac
technology, a biocompatible contact technology for
implantable medical devices in which reliability,
dependability, and ease-of-use are critical.
Implanted devices such as pacemakers, ICDs (internal cardiac
defibrillators or implantable cardioverter-defibrillators),
neurosti-mulators, metabolic controls, circulation pumps,
bone growth simulators, and pain management devices will
benefit from this advanced technology.
The Hypertronics ImplanTac contact, based on Hypertronics'
low-force, low-resistance, Hypertac®
contact technology, is composed of biocompatible materials
and designed to prevent faulty connections and high risk
factors that may have been an issue in the past. The
ImplanTac biocompatible contact solution offers surgeons the
ability to easily mate implanted leads into devices without
misalignment, damage to the system, or risk to the patient.
The need for specialty mating tools, as well as the life
threatening risks associated with applying unnecessary
pressure to the patient during the mating process, are
eliminated. Using the ImplanTac interconnect, doctors can
minimize patient risk, as well as the costs that are
associated with these procedures.
Typically, devices are encapsulated into a housing
structure, then implanted into the body cavity. The leads
are connected to the device during the surgical procedure.
These leads monitor and apply electrical energy based on
sensory inputs. The connection must be of the ultimate
reliability, since failure could be life threatening.
Hypertronics' new ImplanTac technology provides this
critical reliability.
For more information, visit
www.hypertronics.com. |
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HARTING’s Next-Generation D-Sub with
Angled Low Profile Surface Mount
May
2008—HARTING Technology group introduces a surface mount
assembly version of the low profile angled D-sub.
The SMT D-sub design has been optimized around key features
to provide reliable and long-term usage. It allows surface
mounting of this very standard connector, thus simplifying
PCB assemblies and broadening its range of application.
It is available in nine to 25 positions, with a large choice
of mounting hardware:
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M3 and
4-40 UNC threaded insert; M3 and 4-40 UNC female screw
locks.
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Performance level 2 and 3 are standards; PL1 upon
request. Nine- and 15-pole versions are delivered in 160
piece reels; for larger sizes, packaging will be made
according to the customer equipment.
For more information, visit
www.harting.com. |
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ITT Develops High-Temp Connectors for
Transportation Applications
May
2008—ITT Interconnect Solutions has developed a series of
high temperature connectors. Designated the CIR Series, ITT
VEAM’s circular connectors meet European CEN/TS 45545
standards governing railway fire safety. The connectors are
capable of withstanding a high temperature exposure period
of at least 15 minutes at the ISO 834-1 heating curve, where
maximum temperature is 800°C.
“The CIR Series connectors were developed specifically to
address the concerns of passenger safety in European railway
systems,” said Keith Teichmann, director of marketing for
ITT Interconnect Solutions. “As a result of the high
temperature capabilities and increased reliability, critical
control signals remain viable and the connectors remain
active while a train moves away from the site of an accident
or fire, providing increased passenger safety in the event
of an emergency.”
Typical applications for the VEAM CIR Series connectors
include railway systems, transportation interconnects, and
high temperature environments where signal integrity is
critical.
Featuring a stainless steel shell and ceramic insulation,
the VEAM CIR Series connectors are available with 35 size 12
poles at 40 amps. A silicon rubber grommet ensures sealing,
while contacts with a metallic retention clip provide a high
integrity contact that will not release under extreme shock
and vibration conditions. ITT is also developing the CIR
Series connectors with 40 size 16 poles rated at 36 amps and
4 size 16 poles.
For more information, visit
www.ittcannon.com. |
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Ironwood High-Performance Sockets for
0.8mm Pitch SDRAM
May
2008—Ironwood Electronics has recently introduced the new
high-performance BGA socket for 0.8mm pitch SDRAM. The
SG-BGA-6252 socket is designed for a 9mm x 11mm, 0.8mm pitch
60-pin BGA package, and the SG-BGA-6253 socket is designed
for a 9mm x 13mm, 0.8mm pitch 84-pin BGA package. The
sockets operate at bandwidths up to 8 GHz, with less than
1dB of insertion loss. The sockets are designed to dissipate
up to several watts without extra heat-sinking, and can
dissipate more watts with custom heat sink. The contact
resistance is typically 25 milliohms per contact. The
sockets are ZIF sockets and provide excellent signal
integrity.
The SG-BGA-6252 and SG-BGA-6253 are constructed with a
high-performance and low-inductance elastomer. The
temperature range is -35°C to +100°C. The pin inductance is
0.28 nH. The SG-BGA-6252 socket accommodates IC packages
such as the 60-pin Samsung DDR2 SDRAM (K4T51043QE) FBGA
package. The SG-BGA-6253 socket accommodates IC packages
such as the 84-pin Samsung DDR2 SDRAM (K4T51043QE) FBGA
package. The sockets are mechanically mounted to target PCB.
Pricing for the SG-BGA-6252 and SG-BGA-6253 is $348 each in
single quantities, with reduced pricing available depending
on quantity required.
For more information, visit www.ironwoodelectronics.com. |
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IMSCS Releases Two New FAKRA Connectors

June 2008—As
a fully accredited ISO TS 16949 supplier to the automotive
industry, IMS Connector Systems announces the release of two
new FAKRA Connectors.
Both the 4369.SMBA double plug and 4408.SMBA single plug are
PCB-mount style and fully compliant to the FAKRA DIN
standard. Benefiting from the very latest in die cast
technology, both parts are capable of being reconfigured to
various standards, IPC/JEDEC J-STD_020C and IEC-norm 60068.
Their unique design means that both parts are perfectly
balanced, to prevent tilting during the pick-and-place
process and prior to the soldering operation. This unique
design has also seen a width reduction in the 4369.SMBA
double plug of nearly 20 percent to 12.5mm, without any
compromise to the interface, meaning a reduction in the
required PCB surface, allowing for greater PCB availability.
The reliability of die-cast technology allows an automated
assembly process, resulting in further cost savings,
guaranteeing a very competitive price.
For more information, visit
www.imscs.com. |
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ITT Develops Filtered High-Power D-Sub
Connector for Telecom, Power Supply Applications
D-sub connector design provides high reliability in
space-saving package
March
2008—ITT
Interconnect Solutions has developed a series of filtered
D-sub connectors for power applications. Designated the
Combo D Series, the connectors feature size eight power
contacts with an optional integrated filter planar array.
The Combo D connectors accommodate a right-angle press fit
termination and Eurostyle brackets that meet CECC75 301 802
specifications.
“The low profile of the Combo D filter connector, along with
the Eurostyle brackets, provide customers with a significant
space savings, while the D-sub design provides increased
reliability and robustness,” said Keith Teichmann, director
of marketing for ITT Interconnect Solutions. “The connector
also ensures that the 50/60Hz frequency from the power
network does not interfere with the operation of equipment,
making the connector ideally suited for high power
telecommunications and power supply applications.”
The low-profile Combo D connector features a maximum contact
current rating of 40 amps and a passive filter array with 47
pico farad capacitance. Minimum lifespan is 200 mating
cycles, and the device is intermateable with Combo D 5W5
cable connectors. The connectors are capable of withstanding
a 1000-volt peak.
Typical pricing for the Combo D Series filtered connectors
is approximately $30 each. Lead time is four weeks.
For more information, visit
www.ittcannon.com. |
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ITT Develops High Temperature Micro
Connector Assemblies for Harsh Environments
April
2008—ITT
Interconnect Solutions has developed a series of high
temperature micro connectors. Designated the MDM Series, the
connectors are rated for operation to 200°C and can be
terminated in daisy-chain configurations within complex
electronic instrumentation packages.
“We’ve had a number of requests from customers for a
connector solution that accommodates larger wire sizes,
which in turn requires the use of high temperature back
molding materials,” said Keith Teichmann, director of
marketing for ITT Interconnect Solutions. “The MDM Series
connectors feature an integrated termination method to
accommodate multiple conductor sizes and precision back
molding, allowing us to meet our customers’ precise needs.”
Typical applications for the MDM Series high temperature
connectors include geophysical and oil exploration,
electronic instrumentation, and down-hole mapping.
The MDM Series connectors represent a complete turnkey
solution based on the use of specialized high temperature
materials such as LCP (liquid crystalline polymer)
thermoplastic. A D-subminiature connector based on PPS (polyphenylene
sulfide) thermoplastic can also be integrated into the
assembly.
The micro connectors accept #22 and #26 AWG wire sizes and
offer a combination of 1.27mm and 2.54mm (0.050” and 0.100”)
spacing. The MDM Series connectors also feature a twist pin
contact system and crimped gold-plated contacts. Lead time
for the custom MDM Series micro connectors is from eight to
10 weeks.
For more information, visit
www.ittcannon.com. |
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ITT’s LC Fiber Optic Connector Meets
Lucent and Telcordia Requirements
March
2008—ITT
Interconnect Solutions has developed a fiber optic connector
for operation in harsh environments. The Cannon PHD SuperLC
connector features a small form factor and maintains the
same high optical performance characteristics of a standard
LC product while operating in severe environments.
“Until now, the LC configuration commonly used to connect
fiber optic devices was not able to function reliably in
high temperature or high vibration environments,” said Keith
Teichmann, director of marketing for ITT Interconnect
Solutions. “With superior mechanical durability, including a
thermal plastic housing and a locking feature to prevent
mechanical release, the connector is capable of withstanding
high temperatures and thermal cycling, along with elevated
levels of shock and vibration.”
The Cannon PHD SuperLC connector meets or exceeds Lucent
640-252-053 and Telcordia GR-326 requirements. The connector
is ideal for military/aerospace, telecom service, and
industrial data communications applications.
The SuperLC connector features a tunable optical cartridge
that functions as a standalone optical element separate from
the connector housing and accepts multi-mode or single-mode
ferrules. The locking mechanism also prevents thermal stress
of the latch at high temperatures. Crimp termination of the
cable to the rear body ensures ease-of-use and quick field
repair.
Typical pricing for the Cannon PHD Super LC connector ranges
from $20 to $25 depending on quantity. Lead time is from
four to six weeks.
For more information, visit
www.ittcannon.com. |
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