Products Are Listed Alphabetically By Manufacturer

 
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Anderson Power Products Offers Powermod® HP Connector Series
April 2008—Anderson Power Products® (APP) offers its PowerMod®HP (high power) series connector family, featuring touch-safe female housings, cable strain relief, and integral positive latches. These safety features, combined with the ease of connector assembly, establish a new standard for cost-effective, high-power connectors.


APP’s PowerMod HP Series is RoHS-compliant and rated up to 450 amps for appropriate applications at a 30ºC temperature rise. Using APP’s patented sterling contact technology, the PowerMod HP offers low electrical resistance, provides a minimum of 500 mating cycles, and is rated for circuit interruption (true hotplug). These connectors are IP20-rated (touch-safe) for user safety. The integral coding key provides further protection by allowing the user to configure unique mating of up to six individual connectors.

The connectors accommodate American wire sizes from #6 to 4/0 AWG, and metric wires from 13.3 to 95mm². For additional reliability, an innovative cable strain relief kit that encompasses all applicable wire sizes is available as a product option. The unique latching system offers superior security and ergonomics, as well as clear identification through its distinct blue buttons. PowerMod HP, offered in 10 different connector housing types, including right angle, bus bar, panel mount, and blindmate/float selections, delivers broad design flexibility for current and future high power interconnections.


APP connectors are available through their authorized distributor network or direct from the factory. For more information, visit www.andersonpower.com.

Amphenol Viper Triples Best Data Rate Performance for Aerospace

April 2008—At 10 Gb/s, Amphenol’s Viper more than triples the previous market-best data rate performance. This press-fit board-to-board interconnect also offers very high density, excellent severe-environment resistance, and a modular structure for easy customization. Viper is the ideal answer to the high-speed transmission needs of future aerospace and C4ISR systems.

With this product, Viper introduces several technical innovations that ensure excellent resistance to severe environments and provide record data rates.

The interconnect has fork female contacts providing four points of contact between the female and male contacts, limiting displacement to a maximum of ± 0.02". This innovation is complemented by an anti-stubbing design which secures female contact positioning in groove systems, forcing correct positioning of the male contact and ensuring secure contact. Press-fit board mounting is used on both backplane and daughterboard. Viper provides exceptional electrical density, exceeding 55 differential pairs per linear inch of board.

Viper also places the ground contact in front of the signal contacts, providing highly effective protection against electrostatic discharge. The contacts are made of Olin C7025 TM03 plated with nickel (150 µm) and gold (50 µm). The Viper interconnect has very good impact and vibration resistance (> 0.2 G2/Hz, 16.9 G rms). It accepts additional backplane protection applications (epoxy or other), routinely used in military equipment.

The data rate performance is obtained through a novel design: each signal contact is on a separate wafer. The wafers are embedded in plastic (LCP UL94VO) and isolated from each other by columnar ground shielding. This enables Viper to reach very high data rates with no risk of interference between the signals.

The Viper interconnect’s modular design offers extensive design flexibility. Different wafers can be combined according to the type of contact required: unit signal or differential pair, power, RF, or fiber optic. The wafers are stacked and secured by a stainless steel retention system, which also provides shielding and acts as a board stiffener, integrating guidance and keying options.

Optimized for differential pair architecture on a 1.8mm x 1.35mm grid, Viper can be configured for asymmetric pairs while maintaining a chassis slot pitch of 0.8" to 1.0". Eight and 16-row backplane modules are available with 1.8mm x 1.8mm incrementation. Built according to the principles of the VITA 41, 46, and even 48 standards, and available in 3U and 6U configurations, Viper is intended to comply with future international standards.


VIPER has been designed for military and aerospace applications.


For more information, visit www.amphenol-aerospace.com.

Amphenol RADSOK® PCB Connectors Provide More Power, No Heat to PCB
February 2008—Amphenol Industrial now offers three compact, high-amperage connectors, ideal for use in high-current, single-point connections to printed circuit boards (PCBs). The new PowerBlok™, RADSERT™, and PGY™ connectors incorporate RADSOK® technology to eliminate threaded connection failures and increase reliability, flexibility, and available surface space within a board design.

Housed in a small package of 12.7mm x 12.7mm (0.500” x 0.500”), PowerBlok provides up to 70 amps to a board. The component’s backplane power interface uses compliant pins, which are press-fit into the board, enabling a solid connection and an even signal flow. PowerBlok features a radial design that ensures many points of contact, as well as a touch-proof cover for safer operation.

Available in either a 2.4mm (0.094”) size carrying up to 35 amps or in a 3.6mm (0.141”) size carrying up to 70 amps, RADSERT offers the smallest footprint of Amphenol’s new PCB line, freeing up the most surface space for added design flexibility. In addition, RADSERT enables designers to bring power to the board from busbars suspended above the board and its components. A standard RADSERT is designed for a board thickness of 6.35mm +/-0.0635mm (0.250” +/-0.025”), with custom sizes available for specific applications.

The PGY, an orthogonal card edge connector, is available in two sizes, 3.6mm (0.141”) carrying up to 70 amps and 5.7mm (0.224”) carrying up to 120 amps, delivering the highest amperage in the smallest package. Design engineers can achieve the needed size and weight reductions within their design without compromising the power needed for the board.

The RADSOK PCB connector series is RoHS-compliant, and can be applied manually (press-fit) or by a reflow solder process that eliminates the need for additional wires and special crimping tools.

Pricing starts at $7 (PowerBlok), $2.50 (RADSERT), and $2 (PYG) in small quantities. Delivery is eight weeks ARO.


For more information,
visit www.amphenol-industrial.com or www.radsok.com.

Aries’ High-Frequency Center Probe Test Socket
January 2008—Aries Electronics announced its new high-frequency center probe test socket for devices up to 13mm square. Available in four versions with ratings of 1-3 GHz, 3-5 GHz, 5-9 GHz, and 10-18 GHz, the new socket is ideal for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.40mm.


The socket's solderless, pressure-mount, compression spring probes allow the socket to be easily mounted to and removed from the test board. The four-point crown ensures "scrub" on solder balls for reliable contact mating, and its raised tip probe works with LGAs, MLFs, and other socket types. The socket's gold-over-nickel compression spring probe screws leave very small witness marks on the bottom of the device solder balls and are accurately located by two molded plastic alignment pins, and secured with four stainless steel screws.

Aries' new socket provides minimal signal loss for higher bandwidth capability via a signal path of only 0.077" (1.95mm). With an overall size of 1.200" (30.48mm) x .840" (21.34mm) x .440" (11.18mm), the socket provides the maximum allowable space for board components and connectors.

The compression spring probes in Aries' new RF sockets are constructed of durable heat-treated beryllium-copper alloy, plated with 30 µ" min. (0.75 µm) gold per Mil-G-45204 over 30 µ" min. (0.75 µm) nickel per QQ-N-290. The socket's molded components are UL94V-0PEEK or Ultem. All hardware is stainless steel.

The pricing for a center probe test socket with up to 50 positions starts at $330 in single-piece quantities. Delivery is four to six weeks ARO.


For more information, visit www.arieselec.com.


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Blockmaster’s Innovative Power Splitting Terminal Blocks
June 2008—BlockMaster Electronics has announced the release of its new Panel Power Distribution Terminal Block, Part OTP-80-03P.

This new power panel distribution terminal block, OTP-80-03P, enables the user to split large-gauge high-power input into lower-power, smaller-gauge wire circuits. The unit is particularly applicable for usage in HVAC equipment, switch gear, lighting panels, and pump controls.

The OTP-80-03P is rated at 80 amps at 600 volts on the input line side, and can load and split all attached branch circuits up to the same current level. Input wire sizes range from four to 10 gauge, with branch connection wire gauges from six to 16 AWG. The operating temperature range for the unit is from minus 40 to 90 degrees C, with housing dimensions of 91.5mmL X 40.5mmW X 50.0mmH. It uses polycarbonate (UL94V-0) material, with black as the standard color. The OTP-80-03P is furnished with a clear snap-on plastic safety cover and a convenient marker strip.

BlockMaster’s new OTP-80-03P Panel Power Distribution Terminal Block blocks are in stock at its Elk Grove Village Headquarters warehouse. Current pricing is quoted at $50 each.


For more information, visit
www.BlockMaster.com.

Blockmaster’s Highest Amperage Rated Terminal Block
April 2008—With an operating current rating of 250 amps @ 600 volts, BlockMaster Electronics’ new OTB-588 Series is the latest and most powerful offering in the company’s already impressive high power terminal block line.

BlockMaster Electronic’s new OTB-588 High Power Series is particularly suitable for applications requiring thru-panel high current needs, such as electrical switch gear, off-road vehicles, current-generating systems, and other industrial usages where high current capacity is a design criteria.

The OTB-588 Series has a thru-panel barrier configuration and is offered in one to 12 positions at a 35mm pitch, accepting wire sizes of 4/0 CU within an operating temperature range of –40 to +90ºC. Terminals are copper-nickel-plated, furnished with M10 steel bolts. Housing is of a black polycarbonate (UL94V-0). A snap-on clear plastic cover is provided for finger safety. The entire series is RoHS-compliant.


BlockMaster’s new OTB-588 terminal blocks are in stock for sample quantities at their Elk Grove Village headquarters warehouse. Current pricing for a two-pole OTB-588 is priced at $25 each in lots of 500 pieces, with delivery at four to six weeks for larger quantities. For sample requests, pricing and delivery, detailed specifications, or a copy of their barrier block catalog, visit www.BlockMaster.com.

Binder Offers Compact Design for M9 Molded Connectors
April 2008—B
inder-USA has recently released a modified version of its Series 702, M9 molded connectors. This modification features a new compact design ideally suited for medical and industrial applications with limited space. The Series 702 are preassembled cordsets designed to improve strain relief and reduce cable assembly time.

Both Series 702 and the cable connector, Series 712, are manufactured with IP67 environmental protection and 360 degree EMI shielding. Cordsets are molded with PUR material, giving durability and protection from harsh environments. Series 702 cordsets are available with lengths of two and five meters.

For more information, visit www.binder-usa.com.

BlockMaster’s “Jelly Bean” Series Gets Higher Power Upgrade
April 2008—BlockMaster Electronics has added to its color-coded “Jelly Bean” series of terminal blocks with an expanded listing of higher power rated units, with current carrying capacity of up to 60 amps.

Designated as the JB-OTB-358 series of the “Jelly Bean” line, these modular, thru-panel units feature an operating current rating of 60 amps at 600 volts, making them an ideal choice for motor, industrial, and pump controls, as well as for electrical switch gear and off-the-road vehicles.

The modular construction of the color-coded terminal blocks provide for ease of field service by the matching of internal wire color to the appropriate field connection. The series is offered with a pitch of 16mm in terminal configurations of one to 15 positions, accepting wire sizes of three to 10 AWG CU, within its specified operating temperature range of -40 to +90ºC. Terminals are brass nickel-plated with steel nickel-plated screws installed. Housing is a polycarbonate (UL94VO). Colors offered are red, white, green, blue, yellow, gray, and black, with the entire series being RoHS-compliant. A clear plastic snap-on cover is supplied to enhance finger safety usages.

BlockMasters’ new JB-OTB-358 modular color-coded terminal blocks are in stock for sample quantities. Current pricing for a four-pole unit is quoted at $8 in lots of 500 pieces. For sample requests, pricing and delivery, and for detailed specifications contact BlockMaster at www.BlockMaster.com.

BlockMaster 100 Amp Terminal Blocks in Two-Pitch Versions
March 2008—BlockMaster Electronics has expanded its high power line of thru-panel terminal blocks with the addition of the Series OTB-388, with a terminal pitch of 21mm, and Series OTB-488, at a 27mm terminal pitch. Both of these carry a current capacity rating of 100 amps at 600 volts.

The two series are designed for, and are particularly useful in motor control, gen set, electric heating, spa controls, electrical switch gear, and off-the-road vehicle applications in which the thru-panel construction allows for the interfacing of internal and external wiring in those and other industrial usages.

The OTB-388 and 488 Series are offered in 2 to 15 terminal positions, accepting wire ranges of 2 to 8 and 2 to 10 AWG CU, respectively. Both have an operating temperature range of from –40 to +90ºC, with housing of a polycarbonate (UL94V-0) with black as the standard color. Terminals are brass/nickel plated, furnished with M6 steel nickel-plated screws installed. Each series is supplied with plastic snap-on covers for finger safety, with number strips additionally supplied with the OTB-488 units. Both series are UL-approved and RoHS-compliant.

BlockMasters’ OTB-388 and OTB-488 Series terminal blocks are in stock for sample. Current pricing for a three-position OTB-388 unit is quoted at $9.00 each in lots of 500 pieces. Production quantities are quoted at four to six weeks delivery ARO.


For more information, visit www.BlockMaster.com.


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Cinch Turns Up the Heat on Rugged Connector Solutions
New high-temperature interconnect system ensures greater reliability in extreme conditions
May 2008—Cinch Connectors announced a new addition to its Dura-Con™ Micro-D connector family. This new connector solution is capable of performing in extreme temperatures, from –40°C to +175°C. The connectors are constructed from material designed to meet extreme mechanical and electrical conditions in rugged military and high-end industrial applications, such as down-hole directional drilling.

The pairing of a high-temperature insulator and Cinch’s patented twist-pin design, featuring seven points of contact and the proven ability to operate under extreme conditions of shock and vibration, results in an ideal interconnect solution delivering maximum dependability with a minimal physical footprint. These interconnects can handle over 50 Gs of shock (Mil-Std 1344, Method 2004, Condition E) and 20 Gs of vibration (Mil-Std 1344, Method 2005, Condition IV), while providing reliable, low-resistance connectivity.

Cinch's unique plug insulators, which are available in tooled sizes of 9-,15-, 25-, 50-, 100-, and 120-positions, have been designed to provide increased electrical protection between contact cavities, preventing any potential shorts in exposed wire or voids, which may occur during extreme temperature fluctuations. Additional size and configurations are also available upon request.


For more information, visit www.cinch.com.

 

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ept Inc. Introduces AMC.0 B+ Connectors to meet AdvancedTCA
July 2008—ept inc. introduces its new 170-circuit AdvancedMC connector solution for signal transmission up to 12.5 Gb/s, with low cross talk. ept’s AMC.0 B+ connectors support PIGMG AdvancedTCA industry specifications.

The new press-fit design was optimized to provide significant cost and reliability advantages over other termination technologies. The press-fit process allows for the use of a standard ‘flat rock’ insertion tool, which requires no custom tooling. The connector is also available without pegs for applications in which the AdvancedTCA guiding system is not desired.

ept’s AMC.0 B+ connectors are RoHS compliant.

ept also offers an additional AMC.0 compliant signal connector compatible for MicroTCA systems.


For more information, visit www.ept.de.

ERNI Power D-Subs for SMT, Through-Hole and Pressfit Applications
3W3, 3WK3, 7W2 configurations with robust stamped power contacts

June 2008—ERNI Electronics is offering an extensive range of D-sub connectors with precision stamped high-current contacts to meet the needs of SMT, through-hole reflow (THR), and press fit applications. Expensive screw-machine power contacts are no longer necessary to achieve high-current demands. ERNI’s power and signal contacts are efficiently stamped for maximum reliability and lower installed cost. Designed to be used by fully automatic assembly equipment, ERNI’s SMT and THR power D-subs provide an economic solution over traditionally more expensive manually placed connectors. In applications that predominately use press fit connectors, such as backplanes, ERNI also provides a press fit power D-sub for gas-tight contact requirements.

The angled high-current D-sub connectors are available in 3W3, 3WK3, and 7W2 configurations, and can be fitted with a maximum of three power supply contacts. However, partial assembly is also possible, as illustrated by Deutsche Telekom, which specified a 3W3 version with two contacts for a 60 volt power supply. In press fit configuration, the high-current contacts are specified for a maximum current-carrying capacity of 30 amps (at 20°C). The male and female multipoint connectors are supplied with the corresponding pre-installed nut or an “anti-twist” interlock bolt (both available in M3 or 4#40 UNC). The RoHS-compliant power connectors are available in the standard installation height (7.3mm), according to DIN 41652 and CECC 75301-802. For applications with a cable termination, ERNI also offers a D-sub power housing kit and high-current contacts with a solder or crimp connection for 10, 20, 30, and 40 amps.

For fully automated assembly, ERNI’s power D-subs are available in both an SMT-compatible tray and tape-on-reel packaging. To further simplify pick-and-place processing, each connector has a large intake surface for easy and reliable vacuum pick-up. Positioning pegs are located at the center of gravity to optimize connector placement during soldering. The SMT power and signal contacts utilize “solder traps” to minimize the wicking effect of solder away from the pads, and durable surface brackets absorb extreme mechanical forces from mating and unmating heavy cables. The tin-plated terminals are contrasted by black high temperature resistant thermoplastic for improved visual inspection.

Pricing starts at $3.50 for these new D-sub connectors. Contact ERNI for free samples.

For more information, visit www.erni.com.

ept Designs New Power Connectors for MicroTCA Systems
May 2008—ept inc. has developed a MicroTCA Power Connector that is an output connector for MicroTCA power modules.

This MicroTCA™ Power Connector is a combination connector with 72 signal contacts at 2mm spacing, and a UPM power component, which is a two-row pattern with 24 power contacts. A load of up to 15 amps per pin is permitted for the connector. This combination of signal and power contacts on one connector has set a new standard.

ept supplies their power connector with the reliable ept Tcom press® press-fit technology, a proven press-fit contact in today’s marketplace.

Features:

  • 72 signal contacts (at 2mm spacing)

  • 24 power contacts

  • Contacts stamped with ept Tcom press® press-fit technology

  • Hot plug contact design

For more information, visit www.ept.de.

ERNI Expands Universal Power Module Range to Include 5-, 6- and 7-pin Versions
April 2008—ERNI Electronics has upgraded its hard metric Universal Power Module (UPM) to include new 5-, 6-, and 7-pin versions. These UPMs augment the existing 3-pin power modules and match their current carrying capacity of 18 amps per contact (at 20°C).

These new high-performance connectors are designed to supply power in applications in line with industry standard PICMG EXP.0 CompactPCI Express (5-pin and 7-pin versions). This completes the family of connectors supplied by ERNI in accordance with the CompactPCI Express standard, and meets requirements on both the signal side (ERmet ZD, ERmet type B8) and the power side.

The angled male multipoint connectors featuring pressfit technology are designed to supply power to daughter cards in conjunction with 2mm ERmet connectors conforming to IEC 61076-4-101. Pre-mating contacts also make it possible to enable hot-swap applications. The corresponding straight female multipoint connectors are used on the backplanes. The UPMs are compatible with other 2mm and DIN 41612 connectors, and also meet the requirements for performance grade one, and comply with RoHS.


The UPMs are available now, with lead times of 10 days. Estimated pricing begins at 2.00EUR per mated pair for volume orders of the 5Pin ERmet PowerModule, 2.10EUR per mated pair for volume orders of the 6Pin ERmet PowerModule, and 2.20EUR per mated pair for volume orders of the 7Pin ERmet PowerModule.


For more information, visit www.erni.com.

ERNI’s Cost-Effective Board-to-Cable Solution
Additional space savings with the compact and economical SMC board-on-IDC cable connector

March 2008—ERNI Electronics has made an even more compact version of its proven and tested board-on-IDC connector available as part of its 1.27mm SMC series. The total height was reduced down to 5.0mm from its previous height of 7.3mm, and subsequently, cable connectors can now be designed in an even more space-saving manner. In addition, the costs were significantly reduced in comparison to a conventional solution using female and male multipoint connectors. The system avoids detachable points of contact in sensitive applications. In the process, the cable is permanently attached to the connector—already soldered to the PCB—by means of the cable duct, and forms a gas-tight connection with the IDC contacts.


The new connector enables the connection between the PCB and an IDC flat cable to be established using only one connector, and allows the assembly of the flat cable to be easily and quickly performed without the need for customized tools. The connector is designed for fully-automatic SMT assembly, and is equipped with features to take advantage of this, such as a black insulating body, high temperature-resistant thermoplastic housing (LCP) for SMT reflow soldering, a pre-assembled mounting hood and tape-on-reel packaging.


The simple assembly process is performed as outlined below, using a simple hand lever press:
 

  • Remove mounting hood from the soldered connector, and mount PCB in customer-specified installation frame

  • Move cable duct with pre-assembled flat cable to pre-lock position

  • Using a flat die, press cable duct to crimp dimension. During this process, the connector must be supported on the bottom of the PCB.

The data sheet provides additional information on the area and the dimensional design of the required support

The new SMT cable connector for the board-on-IDC cable connector is available with 12, 26, or 50 pins. To promote reliable processing and a long service life, bonus features enable additional support by means of the contact underneath the connector, the pre-locking of the cable duct, and the form-fitting inserted solder clips.


Further information is available at www.erni.com.

 

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FCI TwinMezz Mezzanine Connectors Offer High Density and High Performance
February 2008—FCI introduced the TwinMezz board-stacking connector, bringing ultra-high density to mezzanine applications while exhibiting next-generation, high-speed electrical performance. The TwinMezz system packs 25 high-speed differential signal pairs in a square centimeter, or 161 signal pairs in a square inch of board area.

A hermaphroditic design allows the TwinMezz connector to mate to itself, significantly reducing the number of part variations needed to accomplish a range of different stack heights. Current plans are to support six different connector heights to offer 20 different stack heights in the range of 12mm to 40mm. Planned options for two, four, or six differential signal pairs per column will provide capability for circuit counts ranging from 80 to 800 contact positions, and to tailor the connector width to fit available board space.

The TwinMezz connector exhibits very well-matched impedance, low insertion loss, and low crosstalk, which makes it well-suited for applications in very high-speed environments. The open pin field structure, builds on the same edge-coupled technology used in FCI’s successful AirMax VS high-speed connector system. The structure allows for custom pin assignments for optimal speed and signal density. With optimized wiring patterns, transmission rates of 25 Gb/s or higher are achievable.

TwinMezz connectors also feature FCI’s patented BGA connector termination for easy attachment to printed circuit boards using conventional reflow soldering processes.


For more information on TwinMezz connectors, contact Rob Poort at
rob.poort@fci.com or +31.73.6206.827, or visit www.fci.com.

Fischer AluLite Connectors—When Weight Matters
June 2008Are weight considerations important in the development of your equipment? The new aluminium-engineered Fischer AluLite Series is your solution to ultralight product design, weighing up to 50 percent less than a comparable connector.

Saving weight improves efficiency, making the use of aluminium in product development a natural choice in many fields. Ultra-light, compact, and offering excellent strength-to-weight ratio, the new Fischer AluLite product line is ideal for mobile equipment, portable systems, and hand-held devices.

Available in a wide range of colors, from bright to camouflage shades, the Fischer AluLite connectors easily integrate with your product design, while also offering a flexible color-coding system. Rugged, 360° EMC shielded, sealed up to IP68 (2m/24h) or hermetic, they can withstand harsh conditions. Ideal for frequent connect/disconnect operations, the plugs and receptacles are engineered to endure more than 5,000 mating cycles within a temperature range of -50°C to +150°C. Additionally, the anodized finished connector housing is engineered with an aluminium alloy specifically chosen for its anti-corrosion properties.

Accepting cable diameters from 1.4 to 10.7mm, the new AluLite series is available in multi-pole, from two to 27 pins with solder, PCB, or crimp contacts and, upon request, in coax, triax, or hybrid contact configurations. The choice of body styles is wide: standard-sized or short plugs, push-pull locking mechanism or emergency release system, front projecting or flush receptacles, and front- or rear-mounting models. This high flexibility of configurations makes it easier to find the connector dedicated to providing a solution to your specific product design.

For more information, visit www.fischerconnectors.com.

FCI AirMax VS® and ZipLine™ Connectors Transmit Error-free 40Gb/s Data
May 2008—FCI recently completed multi-channel tests for both the AirMax VS and the ZipLine connector systems, using twin test vehicles in which the high-speed connectors transmitted error-free data at 40Gb/s.

The test configurations consisted of a set of four Broadcom BCM8072 dual-channel 10Gb/s transceivers and two IEEE802.3ap reference backplanes with either AirMax VS connectors or ZipLine backplane connectors. FCI successfully transmitted error-free data over eight one-meter channels simultaneously. With the daughter cards and backplane made of Nelco 4000-12SI material, each of the channels achieved a bit-error rate (BER) of better than 5e-16 in the presence of seven aggressor channels. With four channels running in each direction, the resultant aggregate data rate was 40 Gb/s.

AirMax VS Connector has been a leading high-speed backplane connector since 2004. The recently announced ZipLine connector system offers customers the highest signal density of any backplane or orthogonal midplane connector presently on the market. Both AirMax VS and ZipLine connector systems are ideally suited for multiple 10Gb/s channel applications.

ZipLine connectors are built upon FCI’s AirMax VS technology and offers similar signal integrity performance. Like AirMax VS connectors, the ZipLine connector system uses edge-coupling technology to deliver high signal density with low insertion loss and low crosstalk, all without the use of costly and space-consuming metal shields. Data rates can scale from 2.5Gb/s to beyond 12Gb/s without requiring re-design of a basic platform.

For more information
, visit www.fci.com/airmax or www.fci.com/zipline.

FCI’s Product Portfolio Meets Demands of Industrial Applications
May 2008—FCI is expanding and updating its product portfolio to continue to meet the needs of industrial equipment manufacturers.

FCI’s industrial product offering is built around an extensive range of board-to-board and wire/cable-to-board connectors, with established brand names such as Dubox™, Quickie®, and Minitek™. I/O connectors, including modular jacks and D-subs, are also used in such applications.

“Customers know FCI for innovative, high-speed connector solutions,” said Gijs Werner, global I&I market manager for FCI. “FCI is also a reliable source for interconnect solutions in industrial applications.”

FCI has developed several technologies to enhance product offerings, including an improved through-hole reflow technology (Pin-In-Paste), which is used for most of FCI’s products. Following the trend towards miniaturization, FCI also expanded its successful 2.00mm modular, board-to-board system—Minitek, the most complete 2.00mm system. Minitek provides 38 percent PCB space reduction, compared to 2.54mm systems.

“Although some of FCI’s products were designed more than 40 years ago and set the connector standard at that time, we find that even today these products are still going strong,” said Bavo Teunissen, global marketing communications director for FCI. “Products with dual-beam contact systems, proper normal force, higher conductive materials, and performance-based plating address the needs for higher reliability in long lasting applications.”

A specific service program was created to accomplish a two week lead-time, quick delivery of samples, and easy access to information to make the design-in process easy and to speed-up time-to-market. FCI continues to invest in the expansion and updating of its standard product portfolio because of the value these products have for industrial manufacturers. Detailed information is available in a dedicated brochure, “Connectors for Process Control,” available on FCI’s website.

For more information, visit www.fci.com.

FCI’s eSATA Connector Provides External Data Backup at Speeds up to 3Gb/s
April 2008—FCI has expanded its line of storage interface interconnects with the development of an eSATA input/output connector aimed at single lane external storage applications with less than six feet of cable. Up to five times faster than existing external storage solutions like USB 2.0 and FireWire 400, the eSATA connector provides external data backup and protection at speeds up to 3 Gb/s, and is ideal for applications such as desktop and notebook computers, set-top boxes, gaming equipment, external portable storage, and USB-related equipment.

The eSATA connector operates at both Gen1 and Gen2 speeds, so regardless of the implementation, the outside of the device enclosure will meet Gen1m specifications when operating at Gen1 speeds, and Gen2m specifications when operating at Gen2 speeds. The eSATA is available with eSATA + USB 2.0 in the same connector housing, and is available in versions including eSATA, eSATA + USB, or eSATA/USB (2-in-1) combination.

Offering high durability up to 2500 cycles, the connector withstands a mating force of 40N maximum and an unmating force of 10N minimum. The eSATA connector is RoHS-compliant and compatible with lead-free processing temperatures.


For more information, visit www.fci.com/basics.

FCI Develops Customized Solutions for E1/T1 and VDSL Applications
March 2008—FCI has developed several customized I/O connector solutions for E1/T1 and xDSL applications, including a cable connector and a board connector solution. These products are ideal in the telecom industry.

The E1/T1 transmission protocol is used to transmit voice and data between devices, and runs at a speed of 2Mbit/s. ADSL and VDSL (-2) solutions run at higher speeds, up to 100 Mbit/s, and are capable of supporting new high bandwidth applications, such as general Internet access, HDTV, and Voice-Over-IP services.

“Although in both cases the data transmission takes place over a single twisted pair of copper cable, most of FCI’s cable connector solutions are customized to accommodate a customer’s specific needs,’’ said Remco Innemee, global telecom market manager, FCI. ‘’Requests vary based on the connector system, cable, cable management, and cabinet requirements, including meeting over-voltage specifications like ITU-T K20.’’

FCI’s range of solutions—from eight to 72 pairs per connector—are designed to connect to cost-effective shielded cable options.

Based on the proven Metral® IDC (insulation displacement contact) technology, FCI is capable of using standard building blocks to support its customer’s need for short time-to-market. FCI also can provide its customers with cable assemblies that complement the custom connector systems developed for E1/T1 and xDSL solutions.


For more information, visit www.fci.com.

 

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HARTING Field Termination Panel Feed-Through M12 for Individual Assembly
June 2008—The HARTING field termination panel feed-through M12 connector allows t
he user to choose between two different kinds of termination; the IDC-termination, by the use of HARAX® contact blades, or the standard crimp termination are possible.

Special tools are not necessary when the newly developed HARAX® product from HARTING has been chosen. A wide range of shielded cables fit the new design. D-coded versions for Ethernet applications are offered as well as A-coded panel feed-through connectors.

For more information, visit www.harting.com.

Hypertronics’ High-Density, Low-Profile Mezzanine Connectors for High-Rel Applications
June 2008–Smiths Interconnect, part of the global technology company Smiths Group, announced that Hypertronics Corporation has introduced the KFT Connector Series, a 0.050 inch (1.27mm) fine pitch, high-density rectangular connector utilizing 0.40mm diameter Hyperboloid sockets. With a 0.343 inch (8.71mm) stacking height, this low profile, dual-row in-line interconnect solution is ideal for stacking, and can be used in areas where board real estate is at a premium.

KFT connectors, like all Hypertronics connectors, are engineered to allow for top performance under all dynamic environmental conditions. KFT connectors provide immunity to shock and vibration fretting, numerous linear paths of contact, and a self-wipe action that consistently results in better signal integrity. Designed with 30 percent glass-filled liquid crystal polymer (LCP) insulators and potted contacts, KFT connectors withstand the high temperatures associated with soldering. The LCP insulators also exceed NASA space requirements for outgassing, and have inherent keying features to prevent improper mating.

“We designed the KFT, using the high-performance Hypertac® technology, to be smaller in size and weight with the capacity for high pin count to accommodate tightly spaced board designs,” said Vadim Radunksy, Hypertronics’ president.


For more
information, visit www.hypertronics.com or www.smiths.com.

Hirschmann Media Module for MICE Switches
April 2008—With new optical media modules for the switches of the MICE family, which are approved for installation in explosion protection zone 2, as well as optical transceivers and connectors of the microFX series, remote terminals can be connected safely via Ethernet in zone 1.

The media module, which has four optical ports (100 Mbit/s) with M12 connections, is designed for a temperature range of -40°C to +70°C. The printed circuit boards are coated with a special varnish for protection against condensation (conformal coating).

The signals are transmitted from the module to the remote terminals via fiber optic cables. MicroFX transceivers, with M12 connection technique in accordance with IEC 61076-2-101, serve as an Ethernet interface. The remote terminal may easily get the necessary approval for explosive zone 1 atmospheres (EN 60079-28:2007, Part 28).

The MICE switches, which are designed for mounting on DIN rails, support both fast and gigabit Ethernet and various routing, redundancy, and security methods. They are especially suitable for use in industrial networks with complex applications.


For more information, visit www.hirschmann-unlimited.com.

HARTING Micro Card Edge Connector Offers Flexibility
April 2008—HARTING offers the new Micro Card Edge Connector in surface-mounting technology for card gauges of 1.6mm. It is suitable for board-to-board mezzanine, as well as for small pluggable daughter card applications. The key feature for mezzanine applications is the very flexible staple height of parallel boards by utilizing a small board between the connectors. This gives flexibility in the mechanical design of the system.

The HARTING Micro Card Edge Connector is able to transfer data rates up to 14 Gb/s, suitable for telecommunications, medical, and industrial high-speed applications. It is available with 40 and 100 contacts at a pitch of 0.8mm. An extremely smooth contact surface achieved by high-performance stamping tools and a special after-treatment ensures low insertion forces and high contact reliability.

HARTING´s Micro Card Edge Connector offers excellent manufacturing features, such as tape-and-reel packaging with a pick-and-place pad for nozzle in high-volume productions.


For more information, visit www. HARTING.com.

Hypertronics’ ImplanTac™, a Biocompatible, Hi-Rel Interconnect for Implantable Devices
March 2008—Hypertronics Corporation announces the release of their ImplanTac technology, a biocompatible contact technology for implantable medical devices in which reliability, dependability, and ease-of-use are critical. Implanted devices such as pacemakers, ICDs (internal cardiac defibrillators or implantable cardioverter-defibrillators), neurosti-mulators, metabolic controls, circulation pumps, bone growth simulators, and pain management devices will benefit from this advanced technology.

The Hypertronics ImplanTac contact, based on Hypertronics' low-force, low-resistance, Hypertac
® contact technology, is composed of biocompatible materials and designed to prevent faulty connections and high risk factors that may have been an issue in the past. The ImplanTac biocompatible contact solution offers surgeons the ability to easily mate implanted leads into devices without misalignment, damage to the system, or risk to the patient. The need for specialty mating tools, as well as the life threatening risks associated with applying unnecessary pressure to the patient during the mating process, are eliminated. Using the ImplanTac interconnect, doctors can minimize patient risk, as well as the costs that are associated with these procedures.

Typically, devices are encapsulated into a housing structure, then implanted into the body cavity. The leads are connected to the device during the surgical procedure. These leads monitor and apply electrical energy based on sensory inputs. The connection must be of the ultimate reliability, since failure could be life threatening.
Hypertronics' new ImplanTac technology provides this critical reliability.

For more information, visit www.hypertronics.com.

HARTING’s Next-Generation D-Sub with Angled Low Profile Surface Mount
May 2008—HARTING Technology group introduces a surface mount assembly version of the low profile angled D-sub.

The SMT D-sub design has been optimized around key features to provide reliable and long-term usage. It allows surface mounting of this very standard connector, thus simplifying PCB assemblies and broadening its range of application.

It is available in nine to 25 positions, with a large choice of mounting hardware:  

  • M3 and 4-40 UNC threaded insert; M3 and 4-40 UNC female screw locks.

  • Performance level 2 and 3 are standards; PL1 upon request. Nine- and 15-pole versions are delivered in 160 piece reels; for larger sizes, packaging will be made according to the customer equipment.

For more information, visit www.harting.com.

 

I
 

ITT Develops High-Temp Connectors for Transportation Applications
May 2008—ITT Interconnect Solutions has developed a series of high temperature connectors. Designated the CIR Series, ITT VEAM’s circular connectors meet European CEN/TS 45545 standards governing railway fire safety. The connectors are capable of withstanding a high temperature exposure period of at least 15 minutes at the ISO 834-1 heating curve, where maximum temperature is 800°C.

“The CIR Series connectors were developed specifically to address the concerns of passenger safety in European railway systems,” said Keith Teichmann, director of marketing for ITT Interconnect Solutions. “As a result of the high temperature capabilities and increased reliability, critical control signals remain viable and the connectors remain active while a train moves away from the site of an accident or fire, providing increased passenger safety in the event of an emergency.”

Typical applications for the VEAM CIR Series connectors include railway systems, transportation interconnects, and high temperature environments where signal integrity is critical.

Featuring a stainless steel shell and ceramic insulation, the VEAM CIR Series connectors are available with 35 size 12 poles at 40 amps. A silicon rubber grommet ensures sealing, while contacts with a metallic retention clip provide a high integrity contact that will not release under extreme shock and vibration conditions. ITT is also developing the CIR Series connectors with 40 size 16 poles rated at 36 amps and 4 size 16 poles.

For more information, visit
www.ittcannon.com.

Ironwood High-Performance Sockets for 0.8mm Pitch SDRAM
May 2008—Ironwood Electronics has recently introduced the new high-performance BGA socket for 0.8mm pitch SDRAM. The SG-BGA-6252 socket is designed for a 9mm x 11mm, 0.8mm pitch 60-pin BGA package, and the SG-BGA-6253 socket is designed for a 9mm x 13mm, 0.8mm pitch 84-pin BGA package. The sockets operate at bandwidths up to 8 GHz, with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat-sinking, and can dissipate more watts with custom heat sink. The contact resistance is typically 25 milliohms per contact. The sockets are ZIF sockets and provide excellent signal integrity.

The SG-BGA-6252 and SG-BGA-6253 are constructed with a high-performance and low-inductance elastomer. The temperature range is -35°C to +100°C. The pin inductance is 0.28 nH. The SG-BGA-6252 socket accommodates IC packages such as the 60-pin Samsung DDR2 SDRAM (K4T51043QE) FBGA package. The SG-BGA-6253 socket accommodates IC packages such as the 84-pin Samsung DDR2 SDRAM (K4T51043QE) FBGA package. The sockets are mechanically mounted to target PCB.

Pricing for the SG-BGA-6252 and SG-BGA-6253 is $348 each in single quantities, with reduced pricing available depending on quantity required.


For more information, visit www.ironwoodelectronics.com.

IMSCS Releases Two New FAKRA Connectors

  

June 2008—As a fully accredited ISO TS 16949 supplier to the automotive industry, IMS Connector Systems announces the release of two new FAKRA Connectors.

Both the 4369.SMBA double plug and 4408.SMBA single plug are PCB-mount style and fully compliant to the FAKRA DIN standard. Benefiting from the very latest in die cast technology, both parts are capable of being reconfigured to various standards, IPC/JEDEC J-STD_020C and IEC-norm 60068.

Their unique design means that both parts are perfectly balanced, to prevent tilting during the pick-and-place process and prior to the soldering operation. This unique design has also seen a width reduction in the 4369.SMBA double plug of nearly 20 percent to 12.5mm, without any compromise to the interface, meaning a reduction in the required PCB surface, allowing for greater PCB availability. The reliability of die-cast technology allows an automated assembly process, resulting in further cost savings, guaranteeing a very competitive price.


For more information, visit www.imscs.com.

ITT Develops Filtered High-Power D-Sub Connector for Telecom, Power Supply Applications
D-sub connector design provides high reliability in space-saving package
March 2008—
ITT Interconnect Solutions has developed a series of filtered D-sub connectors for power applications. Designated the Combo D Series, the connectors feature size eight power contacts with an optional integrated filter planar array. The Combo D connectors accommodate a right-angle press fit termination and Eurostyle brackets that meet CECC75 301 802 specifications.

“The low profile of the Combo D filter connector, along with the Eurostyle brackets, provide customers with a significant space savings, while the D-sub design provides increased reliability and robustness,” said Keith Teichmann, director of marketing for ITT Interconnect Solutions. “The connector also ensures that the 50/60Hz frequency from the power network does not interfere with the operation of equipment, making the connector ideally suited for high power telecommunications and power supply applications.”

The low-profile Combo D connector features a maximum contact current rating of 40 amps and a passive filter array with 47 pico farad capacitance. Minimum lifespan is 200 mating cycles, and the device is intermateable with Combo D 5W5 cable connectors. The connectors are capable of withstanding a 1000-volt peak.

Typical pricing for the Combo D Series filtered connectors is approximately $30 each. Lead time is four weeks.


For more information, visit
www.ittcannon.com.

ITT Develops High Temperature Micro Connector Assemblies for Harsh Environments
April 2008—ITT Interconnect Solutions has developed a series of high temperature micro connectors. Designated the MDM Series, the connectors are rated for operation to 200°C and can be terminated in daisy-chain configurations within complex electronic instrumentation packages.

“We’ve had a number of requests from customers for a connector solution that accommodates larger wire sizes, which in turn requires the use of high temperature back molding materials,” said Keith Teichmann, director of marketing for ITT Interconnect Solutions. “The MDM Series connectors feature an integrated termination method to accommodate multiple conductor sizes and precision back molding, allowing us to meet our customers’ precise needs.”

Typical applications for the MDM Series high temperature connectors include geophysical and oil exploration, electronic instrumentation, and down-hole mapping.

The MDM Series connectors represent a complete turnkey solution based on the use of specialized high temperature materials such as LCP (liquid crystalline polymer) thermoplastic. A D-subminiature connector based on PPS (polyphenylene sulfide) thermoplastic can also be integrated into the assembly.

The micro connectors accept #22 and #26 AWG wire sizes and offer a combination of 1.27mm and 2.54mm (0.050” and 0.100”) spacing. The MDM Series connectors also feature a twist pin contact system and crimped gold-plated contacts. Lead time for the custom MDM Series micro connectors is from eight to 10 weeks.

For more information, visit
www.ittcannon.com.

ITT’s LC Fiber Optic Connector Meets Lucent and Telcordia Requirements
March 2008ITT Interconnect Solutions has developed a fiber optic connector for operation in harsh environments. The Cannon PHD SuperLC connector features a small form factor and maintains the same high optical performance characteristics of a standard LC product while operating in severe environments.

“Until now, the LC configuration commonly used to connect fiber optic devices was not able to function reliably in high temperature or high vibration environments,” said Keith Teichmann, director of marketing for ITT Interconnect Solutions. “With superior mechanical durability, including a thermal plastic housing and a locking feature to prevent mechanical release, the connector is capable of withstanding high temperatures and thermal cycling, along with elevated levels of shock and vibration.”

The Cannon PHD SuperLC connector meets or exceeds Lucent 640-252-053 and Telcordia GR-326 requirements. The connector is ideal for military/aerospace, telecom service, and industrial data communications applications.

The SuperLC connector features a tunable optical cartridge that functions as a standalone optical element separate from the connector housing and accepts multi-mode or single-mode ferrules. The locking mechanism also prevents thermal stress of the latch at high temperatures. Crimp termination of the cable to the rear body ensures ease-of-use and quick field repair.

Typical pricing for the Cannon PHD Super LC connector ranges from $20 to $25 depending on quantity. Lead time is from four to six weeks.


For more information, visit
www.ittcannon.com.