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Connector Basics:
Connector Degradation Mechanisms—Corrosion Part I
By
Robert S. Mroczkowski, Sc.D
Bishop & Associates Inc.
This is the second
article in a series on connector degradation mechanisms. Corrosion, in
general terms, followed by a discussion of a particular corrosion
mechanism, fretting corrosion, will be the focus of this piece.
Last month, we studied the asperity or a-spot model of a contact
interface. In this continued discussion, it may be useful to refer again
to Figures 1 and 2.
To read the full
article, click here. Take special note as you examine the
asperity model: The asperity contact points are very small, of the order
of microns in diameter. These points are distributed across an apparent
contact area determined by the geometry of the contact springs at the
interface and the contact force exerted by the springs, due to their
deflection on mating. The electrical current across the contact
interface must flow through the asperity contact points, resulting in a
resistance called constriction resistance. The magnitude of the
constriction resistance depends on the number, size, and distribution of
the asperity contacts at the interface, because all the asperity
contacts are in parallel, electrically. Constriction resistance exists
even in the ideal case, when all the asperity contact interfaces are
metal-to-metal, e.g. gold-to-gold or tin-to-tin. If any of the asperity
interfaces are compromised by corrosion films or contaminants, the
constriction resistance will increase. This is the reason why corrosion
is a degradation mechanism for connectors. Loss of asperity contact
area, or of asperity contacts, due to corrosion or contamination can
result in contact interface resistance increases that are sufficient to
lead to connector failures.

Figure 1:
Schematic illustration of the structure of a contact interface
resulting from
the intrinsic surface roughness on the microscale of the contact
interface.
The kinetics of
corrosion mechanisms in connectors can be very complex, but for the
purposes of this discussion, two such mechanisms will be highlighted:
surface corrosion and motion-induced corrosion, or fretting corrosion.
Surface corrosion is a concern for all connector interfaces, even gold.
It is important to note that the gold is not the source of corrosion
products; rather it is the base metal of the contact spring, usually a
copper alloy, that is the corrosion source. (Check back next month to
learn more about corrosion effects on contact resistance in gold-plated
connector systems.)
In motion-induced, or fretting corrosion, the term “fretting” refers to
the small scale of a few, or up to a few tens of micron’s repetitive
motions. Driving forces for fretting include vibration, mechanical and
thermal shock, and thermal expansion mismatch due to temperature
cycling. Those driving forces probably sound familiar, as they are the
conditioning methods for a number of connector test specifications to
assess the stability of connector contact resistance. Fretting corrosion
is the predominant degradation mechanism for tin-plated connector
systems. A discussion of the details of tin-to-tin contact interfaces
helps us better understand the process.

Figure 2: Schematic illustration of the structure of a tin surface.
Figure 2 schematically illustrates the important characteristics of tin
surfaces as they relate to connector contact interfaces. Tin is a soft
and ductile metal that always has a very hard, brittle, and thin oxide,
of the order of a hundredth of a micron, on its surface. Tin oxide is a
semiconductor, but the hard-over-soft structure of tin makes it very
easy to disrupt and displace the tin oxide, so that direct tin-to-tin
contact can result in a metal-to-metal and, thus, low-contact
resistance. The mechanics of the displacement are simple. The tin oxide,
being brittle and thin, cannot support an applied load, so the oxide
cracks and the load transfers to the underlying soft and ductile tin.
The tin flows under the applied load and the cracks in the oxide widen
with the flowing tin extruding through the cracks to make contact to the
surface applying the load. Thus, it is easy to establish a low
resistance, metal-to-metal, contact interface between two tin-plated
surfaces. The potential problem is maintaining the integrity of that
interface under fretting conditions.

Figure 3: Schematic illustration
of the kinetics of fretting corrosion.
Figure 3
schematically illustrates the kinetics of fretting corrosion of tin
contact interfaces. The top figure shows the initial interface created
as the tin oxide is displaced. At this point the electrical resistance
of the interface will be of the order of a milliohm or so. If the
contact interface moves, it experiences a fretting event as a result of
any of the driving forces mentioned previously, and a new contact
interface will be created in essentially the same manner as the original
interface. This new contact will have a similar contact resistance. At
the site of the original interface, the disrupted tin interface area
will be exposed to air—specifically, to oxygen—and a new layer of tin
oxide will form at all the original contact points. This is the
corrosion part of fretting corrosion. If the fretting motions are
repeated, each repetition will result in the formation of additional tin
oxide debris in the general area of the contact interface. As this
debris accumulates in and around the contact interface, it interferes
with an increasing number of asperity contact spots and, eventually, the
contact resistance of the interface will increase. The rate of
resistance increase is dependent on many factors, the most important
being the length of the fretting motion and the contact force. The
importance of the length of motion is in its impact on the accumulation
of oxide debris at the interface. Small motions produce a small amount
of debris, but the debris remains at the contact interface. Longer
motions may produce larger amounts of oxide debris, but the debris may
be pushed towards the end of the fretting motion track, reducing the
immediate impact of the debris on contact resistance. The effect of
contact force is similar. Low forces will produce less wear, and,
therefore, less oxide debris, but high forces will be more effective at
displacing the oxide debris towards the ends of the fretting track.
Needless to say, the geometry of the contact springs at the contact
interface also plays an important role. The kinetics of fretting
corrosion are complex indeed.

Figure 4: Schematic illustration of the relationship between contact
resistance and fretting cycles.
Figure 4
schematically illustrates the general relationship between the average
resistance increase due to fretting corrosion and the number of fretting
cycles. The green curve is for a dry, non-lubricated tin interface. The
rapid increase in resistance generally occurs at the order of a few
thousand fretting cycles. The magnitude of resistance change can vary
from tens of milliohms to ohms, and even open circuit. Two features, not
shown explicitly in the graph, merit discussion. The first feature is
the time dependence of fretting corrosion. That time is, of course,
dependent on the rate of fretting cycles and fretting degradation
kinetics. Suffice it to say that fretting corrosion can lead to
resistance increases of the order of ohms, in tens of minutes under
severe fretting conditions. Second, Figure 4 shows the average
resistance, but that is not the whole story. If the contact resistance
was continuously monitored at a high sampling rate, intermittent high
resistance events would be noted before significant changes in average
resistance would be recorded. The frequency of intermittents and the
magnitude of the resistance change at each intermittent event would
increase dramatically in the same manner as the average resistance as
fretting corrosion continued.
OK, fretting corrosion as a degradation mechanism leading to contact
resistance degradation is a real and significant performance issue for
connectors. What can be done about it? There are two general approaches
to fretting corrosion prevention: one directed at preventing fretting,
and one at preventing corrosion.
Fretting motions can be prevented if the mechanical stability of the
contact interface is sufficient to withstand the driving forces for
fretting motion in the application environment of concern. The most
effective means of providing mechanical stability is through high
contact forces. High contact forces mean high friction forces at the
contact interface to resist the driving forces for fretting motions.
This is the reason that contact forces for tin connector systems are in
the range of hundreds of grams, as compared to the hundred grams or less
typical of gold connector systems. There are, however, limits to the
magnitude of contact force that can be employed. The benefit of the
friction force that comes with contact force in providing mechanical
stability has a downside in that the same contact force also increases
the mating force of the connector system. This effect may limit the
number of positions that can be realized in a tin connector system. High
contact forces also mean enhanced wear of the contact surface at the
interface. As mentioned, tin is a soft material, and high contact forces
will reduce the number of mating cycles the connector system can support
before the tin is worn away. Recall also that high forces will enhance
the rate of fretting debris formation, if fretting motions are not
prevented. Thus, if the contact force is not sufficient to prevent
fretting motions, the fretting degradation rate may be significantly
increased.
Preventing the “corrosion” part of fretting corrosion is accomplished by
using a contact lubricant. Contact lubricant is a generic term and
includes lubricants that are intended to reduce friction, as well as
lubricants to prevent fretting corrosion. It is important to specify to
any lubricant supplier that an anti-fretting lubricant is desired to
prevent the improper selection and application of lubricants. There are
many formulations of anti-fretting contact lubricants available in
various consistencies and with application processes designed to suit
different operating conditions and applications. Properly formulated
anti-fretting lubricants can be effective at reducing the potential for
fretting corrosion. An example is the white curve, the “active
lubricant,” in Figure 4. With this lubricant, the fretting cycling was
carried out to 50,000 cycles with no significant degradation in contact
resistance.
One concern with the use of contact lubricants is ensuring proper
application of the lubricant, as well as confirming its presence on the
product as received. If the lubricant is to be self-applied, the costs
and possible environmental effects of the selected lubricant must be
considered. An additional potential issue may arise in applications
where the potential dust and/or contamination are high. Some contact
lubricants may tend to be “tacky” and to retain dust with the dust
itself then contributing to fretting degradation.
The major connector plating systems that are susceptible to fretting
corrosion are tin and nickel. Flash gold systems may become susceptible
to fretting corrosion if the flash gold is worn away due to fretting
wear or the mating cycles of the connector and the nickel underplate is
exposed.
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Dr. Robert S. Mroczkowski
Director Technology, Bishop and Associates Inc.
In 1998, Dr. Mroczkowski founded connNtext associates, a
firm providing consulting services in connector applications
to the electronics industry. Dr. Mroczkowski has over 30
years experience in various aspects of the electronics
industry. He joined AMP Inc. in 1971. While at AMP, his
responsibilities included consulting on connector design,
materials, and reliability concerns within AMP, and
providing an interface to AMP customers on the same issues.
In 1990 he joined the AMP Advanced Development Laboratories,
where he was responsible for the development of microstrip
cable connectors and a new microcoaxial connector for
medical ultrasound diagnostic equipment. Dr. Mroczkowski
retired in 1998 as an AMP principal. He is the author of the
McGraw Hill Electronics Connector Handbook, has
contributed chapters on connectors and interconnections to a
number of packaging handbooks, and written more than 20
technical papers. He holds seven patents. In 1997, Dr.
Mroczkowski received the Lifetime Achievement Award of the
International Institute of Connector and Interconnection
Technology.
He holds a bachelor’s, master’s, and doctorate of
science degrees in physical metallurgy from the
Massachusetts Institute of Technology.
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