Learn how to optimize a printed circuit board (PCB) stack-up with high-speed board-to-board interconnect solutions. Article Contributed by I-PEX A PCB stack-up defines the cross-sectional structure of a PCB. It defines the arrangement of copper and dielectric layers within the PCB. Figure 1 is an example of a typical 4-layer board – all copper andRead More

Starting a new FPGA project typically requires a custom form factor, pinout, and thermal concept for every design. Now the Standardization Group for Embedded Technologies (SGET)’s new Open Harmonized FPGA Module, or oHFM, puts a new high-speed board-to-board interconnect at the center of the design. A new standardized interface is changing the way FPGA applicationsRead More

As circuits run faster and hotter, keeping components cool becomes a more urgent challenge. Liquid cooling systems are an important strategy to help cool down data centers, industrial equipment, electric vehicles, and other high-speed, high-power applications. Thermal management is one of the most pressing challenges in today’s high-speed electronics systems. As transistors per chip continueRead More

Connector modularity lets engineers dynamically scale SWaP requirements to their needs while maximizing maintainability through field serviceability. Article Contributed By Clint Schlosser, Product Manager, Winchester Interconnect For the emerging small-satellite industry servicing LEO constellations as well as the UAS sector, development teams are often faced with two competing goals: designing to highly demanding performance specificationsRead More

Agentic or “agent”-based computers are goal oriented and are built around one or more autonomous agents that can plan, make decisions, and act over time to achieve goals. Computers have evolved into many forms, often to address specific applications or market segments. The mainframe computer from the 1960s was the genesis of a proliferation ofRead More

Artificial intelligence has become the primary driver of advanced high-speed copper and optical technology and products. The 2026 edition of the Optical Fiber Communications Conference and Exhibition filled both the south and west exhibition halls of the Los Angeles Convention Center, with some presentations spilling out to nearby hotel venues. Attendance continues to grow withRead More

DesignCon 2026 opened the 26th edition of this premier technical conference reflecting the incredible advances in technology and products being driven by artificial intelligence. 2025 was an outstanding year for revenue growth in nearly every segment of the computing equipment and component market including electronic connectors which grew 14.7%, according to Bishop & Associates. ExpectationsRead More

The PCIe 7.0 specification was released in 2025, with speeds of 128 Gigatransfers per second, doubling the maximum rate of PCIe 6.0. PCI-SIG promises to double bandwidth every three years, and last month’s preliminary 8.0 draft release shows that progress is accelerating to meet the high-speed needs of the AI era. In June 2025, PCI-SIG released theRead More

Meet the Connector: CopprLink Cables CopprLink is a PCIe cable specification introduced in 2024 by PCI-SIG to standardize high-speed cabled interconnects for modern computing architectures. It defines both internal and external copper cable assemblies for PCIe systems, covering signaling rates from 2.5 GT/s through 64.0 GT/s (PCIe 5.0 and 6.0), with development underway for PCIeRead More

Data center growth is reshaping how infrastructure is designed and scaled, placing new demands on the connectors that underpin power and data transmission. By Greg MacDonald, global business development manager – Amphenol CS Products, PEI Genesis Data centers are foundational to the global digital economy, supporting everything from cloud services and financial systems to AI, healthcare,Read More

Meet the Connector: IEEE 1394 Connectors IEEE 1394 is a high-speed serial bus that supports both asynchronous and isochronous communication between a computer and a peripheral. It is also known as FireWire, a now-retired Apple interface. It has largely been replaced by USB connectors but is still used with older equipment. This low-cost connector isRead More

Advanced signal conditioning and error correction have contributed to achieving channel bandwidth far beyond what was expected just a few years ago. Moving to a higher order modulation provides a pathway to achieving next generation speeds. Constantly increasing data transmission speed over a communication link has been a key enabler of achieving higher computing performanceRead More