Connector and Cable Assembly Supplier

data centers

Cloud Computing, IT Infrastructure, and the Need for Greater Security

As more companies turn to the cloud for data storage, security concerns are rising. The current solution for protecting IT infrastructure from data breaches and network failures is a combination of software and hardware defenses. The current major trend in the evolution of IT infrastructure is the widespread migration of computing and storage resources from Read More >>

artificial intelligence influences connector development

The AI Impact: Artificial Intelligence Influences Connector Development

AI technologies are being used to help analyze rapidly growing data sets, which is generating substantially more data and further increasing demand for ever more powerful connectors. Artificial intelligence has become a prominent element in many advanced system designs, including leading sensing and analysis tools used by data centers and military agencies. Though AI is a high-level software technology, it’s having a major impact on the development of electronics, including connector designs that can accommodate Read More >>

New Connector and Cable Products: April 2019

Summary coverage of the new connector and cable products that were recently released to market, including interconnects, wire and cable, cable assemblies, materials, accessories, tools, development kits, and other connectivity products. Supplier names are generally linked to product announcements and product names are generally linked to product pages or datasheets. New Connector and Cable Products: Read More >>

March 2019 Connector Industry News

Summary coverage of upcoming industry events, as well as recent award, partnership, promotion, personnel, facility, distribution, standards, association, and certification news from across the connector industry. March 2019 Connector Industry News March 2019 Connector Industry News > Event News TE Connectivity is showcasing its portfolio of SEACON products, DEUTSCH connectors, sensors, and Rochester engineered cables Read More >>

OFC Spotlights Optical Connectivity

The Optical Fiber Communications Conference & Exhibition explored emerging optical connectivity technologies, including optical transmitters, multi-fiber cables, and connectors. The Optical Fiber Communications Conference & Exhibition recently held in San Diego is the prime showcase of current and next-generation optical network communication technology. With over 700 exhibitors and 15,000 registered attendees, this conference filled both Read More >>

QSFP-DD Strategies Help Data Centers Keep Cool

The Quad Small Form Factor Pluggable Double Density (QSFP-DD) is the industry’s smallest 400GbE module and provides the highest port bandwidth density. Rigorous tests verify its suitability as a next-generation high-density, high-speed pluggable module. The thermal performance of the Quad Small Form Factor Pluggable Double Density (QSFP-DD) module has been extensively evaluated for use in a Read More >>

5G Connector Products

This week’s Product Roundup highlights 5G connector products from leading suppliers. 5G Connector Products Siemon Interconnect Solutions‘ LC BladePatch duplex jumper for high-density fiber optic applications, including data centers, blade servers, patch panels, and 5G infrastructure, supports the precise optical requirements of high-speed networks, exhibits excellent, low-loss multi-mode and single-mode performance, and features an innovative, Read More >>

February 2019 Connector Industry News

Summary coverage of upcoming industry events, as well as recent award, partnership, promotion, personnel, facility, distribution, standards, association, and certification news from across the connector industry. February 2019 Connector Industry News February 2019 Connector Industry News > Event News TE Connectivity is hosting a new webinar series, TE Tech Talks, to help engineers develop solutions for integrating Read More >>

High-Speed Products Dazzle at DesignCon 2019

The DesignCon conference never fails to live up to its reputation of being the premier platform for state-of-the-art chip and board technology, and DesignCon 2019 was no different. Once again, DesignCon demonstrated why it has become the most respected conference and exhibition for engineers engaged in high-performance chip, PCB, and system design. DesignCon 2019 featured Read More >>

Meeting Datacom and Telecom Application Demands With Higher Data Rates and Smaller Connectors

As the need for bandwidth continues to increase, so does the need for higher data rates and smaller connectors capable of higher densities. What was once 1–3Gb/s moved to 4–8 Gb/s; then we saw the jump to 16Gb/s, then 28Gb/s, and now we are ready for 56Gb/s.   Although the datacom and telecom industries are pushing for higher data rates and smaller connectors capable of higher-density configurations, achieving this Read More >>

RCx MSA Offers New Alternative for Data Centers to Connect Servers

The cabling system promises to streamline rack interconnect systems. Companies that design components for Ethernet systems will want to take a look at the RCx Multi-Source Agreement (MSA), a new intra-rack connection technology aimed at Ethernet applications. RCx MSA, an industry working group with members from Amphenol, Broadcom, Dell, Hewlett Packard Enterprise, and JAE Electronics, Read More >>

Molex qSFP DD cable

Next-Gen Datacenter Connectivity and Thermal Management

As speeds and requirements rise, the QSFP-DD MSA comes forth as a solution that addresses the technical challenges of achieving a double-density interface. By Joe Dambach, new product development manager, Molex Next-Gen Datacenter Connectivity Chips, switches, connectors, cables, and optical module technologies are at the core of datacenter networks, which must be able to support Read More >>