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Industry News: February 2018 – Part I

Summary coverage of upcoming events and recent news from across the connector industry. Industry News February 2018 – Part I Event News BIRNS is showcasing its latest subsea connectivity technology at Underwater Intervention 2018, February 6–8 in New Orleans, including: new open-faced, pressure-rated coax and electro-optic-coax-mechanical hybrid options for its 6km-rated Millennium™ Series, ABS Product Read More >>

DesignCon ChipHead

10 Must-See Moments at DesignCon 2018

This year, DesignCon promises a full array of events, including technical sessions, panels, training boot camps, and hundreds of exhibits featuring the latest connector technology.   DesignCon is one of the premier conferences and exhibitions for the high-speed communications and semiconductor communities. Held each year in Santa Clara, California, this jam-packed three-day event includes continuing Read More >>

Industry News: January 2018

Summary coverage of upcoming events and recent news from across the connector industry. Event News  DesignCon 2018, which will take place January 31 – February 1 in Santa Clara, California, will feature in-depth education, top-tier suppliers, and easy networking activities designed to help chip, board, and systems design engineers stay ahead of the pack, push Read More >>

Industry News: December 2017

Summary coverage of upcoming events and recent news from across the connector industry. Industry News for December 2017 Event News DesignCon’s 2018 keynote presentations are open to all pass types and will include a panel discussion that brings some of the industry’s brightest minds together to discuss the SI/PI and EMI forecast for the next Read More >>

Industry News: October 2017

Do you have your finger on the pulse? We do! Here’s the last few weeks of industry news in a nutshell, with links to full press releases for further information.  Industry News – October 2017 Event News  Molex will showcase its broad range of power, signal, data, and media connector solutions at this year’s Engineering Read More >>

Best of DesignCon 2017

Several trends were apparent at last week’s DesignCon 2017 conference. Foremost among them was the advance of copper solutions that include wiring as an alternative to PCB traces.   DesignCon 2017 opened amid a thoroughly drenched Bay Area, but did not deter more than 5,000 attendees to this premier exhibition of leading edge electronic design, Read More >>

DesignCon ChipHead

DesignCon 2017 showcases speed, density improvements

Technical sessions at DesignCon 2017 in Santa Clara will examine next-generation technologies for speedy, compact connectors, while booths on the show floor will give users a place to see the newest commercial implementations for a broad range of applications.   The soaring demand for more data is putting pressure on connector makers who need to Read More >>

Featured news

Interconnect News: January 2017

Interconnect News for January 2017   Events DesignCon will return to the Santa Clara Convention Center January 31 – February 2, 2017. In addition to technical paper sessions, industry panels, product demos, and exhibits from leading industry experts and solutions providers, this year’s conference will offer a range of programming dedicated to the education and Read More >>

DesignCon ChipHead

DesignCon 2016 Technology Wrap-Up

DesignCon 2016 featured 33 interconnect manufacturers, all concentrating on ever-higher speeds and improved signal integrity.   DesignCon 2016 opened in the shadow of preparations for Super Bowl 50 at Levi’s Stadium, directly across the street from the Santa Clara Convention Center. With more than 160 exhibitors and 4,800 pre-registered attendees, the exposition and conference continues Read More >>


Eric Bogatin Named DesignCon’s Engineer of the Year

The DesignCon community honored Dr. Eric Bogatin with the prestigious Engineer of the Year Award for his many contributions to the engineering industry.   DesignCon 2016, held January 19 – 21 in Santa Clara, Calif., recognized Dr. Eric Bogatin of the Teledyne LeCroy Signal Integrity Academy with its 2016 Engineer of the Year Award for Read More >>

DesignCon ChipHead

Gettin’ Down on the Show Floor: DesignCon 2016

The DesignCon show floor opens today, so we spoke with some of the exhibitors to find out what they expect will be the hot technologies in this year’s Expo Hall.   Did you enjoy your workshops and survive your bootcamps? Well, slip on your walking shoes because the DesignCon show floor opens today, and there is so much Read More >>

OFC trade show

DesignCon 2016: Chipheads Assemble!

The connector industry is descending on Santa Clara this week to take part in the top trade show for chip, board, and systems design engineers. Here’s a look* at what DesignCon 2016 has in store for this year’s conference attendees.   It’s that time of year again, when Santa Clara’s rumored vampire packs clear out to Read More >>